From jzheng at rheosense.com  Mon Apr 18 16:43:37 2005
From: jzheng at rheosense.com (Jun Zheng)
Date: Mon, 18 Apr 2005 16:43:37 -0700
Subject: compression bonding
Message-ID: <002001c54470$716d46a0$6801a8c0@RheoSenseJun>

Has anybody done compression bonding below 300C? I like to bond pyrex to
kovar by gold compression bonding. If you has any experience on it,
please let me know.
 
Thanks!
 
 
Jun Zheng
Senior MEMS Engineer
RheoSense Inc.
(925)866-3802
 
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From vidyagv at gmail.com  Mon Apr 18 16:52:07 2005
From: vidyagv at gmail.com (Vidya V)
Date: Mon, 18 Apr 2005 16:52:07 -0700
Subject: BCB bonding
In-Reply-To: <002001c54470$716d46a0$6801a8c0@RheoSenseJun>
References: <002001c54470$716d46a0$6801a8c0@RheoSenseJun>
Message-ID: <616a3579050418165213131c78@mail.gmail.com>

Hello!
I was wondering if anyone has done BCB bonding before, either the
regular or the photosensitive kind.
Thanks,
Vidya