From mzi9890 at yahoo.com Thu Jun 5 18:21:35 2008 From: mzi9890 at yahoo.com (Mohammed Islam) Date: Thu, 5 Jun 2008 18:21:35 -0700 (PDT) Subject: Request for plate change to quartz Message-ID: <222197.13503.qm@web83502.mail.sp1.yahoo.com> Hello Mario and Gary, I like to request a plate change on the Evbonder to quartz tomorrow (Friday, 6/6) preferably in the morning if possible. Thanks all for support. Regards Moahmmed -------------- next part -------------- An HTML attachment was scrubbed... URL: From ben.jian at arrayedfiberoptics.com Mon Jun 30 23:40:18 2008 From: ben.jian at arrayedfiberoptics.com (=?iso-8859-1?Q?ben.jian?=) Date: Tue, 01 Jul 2008 06:40:18 +0000 Subject: Looking for advice on wafer bonding Message-ID: <20080701064018.23255.qmail@server266.com> Dear labmembers, I have been doing silicon-silicon wafer bonding for years using gold-silicon eutectic bonding. While this is a reasonable wafer bonding method, it leaves much to be desired. Briefly, the bond is not very strong - frequently even ultrasonic cleaning can break the bonded chip stack. I am looking for a better silicon-silicon wafer bonding process. Factors to consider include process simplicity, bonding yield/strength, tolerance to dust particle, etc. If every step can be performed at SNF, it would be always better. A lower temperature process is desirable. Your kind advice is greatly appreciated. Ben Jian -------------- next part -------------- An HTML attachment was scrubbed... URL: