Looking for advice on wafer bonding
ben.jian at arrayedfiberoptics.com
Mon Jun 30 23:40:18 PDT 2008
I have been doing silicon-silicon wafer bonding for years using
gold-silicon eutectic bonding. While this is a reasonable wafer bonding
method, it leaves much to be desired. Briefly, the bond is not very
strong - frequently even ultrasonic cleaning can break the bonded chip
I am looking for a better silicon-silicon wafer bonding process. Factors
to consider include process simplicity, bonding yield/strength, tolerance
to dust particle, etc. If every step can be performed at SNF, it would be
always better. A lower temperature process is desirable.
Your kind advice is greatly appreciated.
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