From kyunglok at stanford.edu  Sun Oct 24 00:43:11 2010
From: kyunglok at stanford.edu (Kyunglok Kim)
Date: Sun, 24 Oct 2010 00:43:11 -0700 (PDT)
Subject: Questions related to make a recipe
Message-ID: <1758766576.11516.1287906191240.JavaMail.root@zm03.stanford.edu>

Dear spray coater users,

I'm making a recipe for the spray coater.
When I looked at some recipes made by other users, I found that some people raised the nozzle by about 800000 during spray coating and some others didn't. The used profile is very similar in both cases. 
And the several numbers are used in nozzle pressure : from 100mbar to 1600mbar. 
Can I ask the effect of theses changes to the coating profile?

Thanks!

Bests,
Kyunglok


From kyunglok at stanford.edu  Sun Oct 24 01:10:21 2010
From: kyunglok at stanford.edu (Kyunglok Kim)
Date: Sun, 24 Oct 2010 01:10:21 -0700 (PDT)
Subject: One more question : resist dots
In-Reply-To: <945218166.11633.1287907289827.JavaMail.root@zm03.stanford.edu>
Message-ID: <1182769372.11676.1287907821947.JavaMail.root@zm03.stanford.edu>

Dear spray coater users,

I missed to ask one more question.
After spray coating, I found that there are many resist dots on my sample wafers.
I attached sample pictures pictured by 5x lens.

Before installing a syringe, I used a 1um pore filter to remove dust or other unnecessary things inside resist mixture.
First image is the first sample I have coated. A few resist dots are spotted but I think it is acceptable.
About twenty minutes later, I tried coating another wafer with very similar recipe. But in this case, I found a lot of dots.

What is the possible reason and the way to solve it? I desperately hope to find kind users to help me out.
The thickness of resist coat is about 2um.

Regards,
Kyunglok
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From jprovine at stanford.edu  Mon Oct 25 07:50:13 2010
From: jprovine at stanford.edu (J Provine)
Date: Mon, 25 Oct 2010 07:50:13 -0700
Subject: Questions related to make a recipe
In-Reply-To: <1758766576.11516.1287906191240.JavaMail.root@zm03.stanford.edu>
References: <1758766576.11516.1287906191240.JavaMail.root@zm03.stanford.edu>
Message-ID: <AANLkTikN6k=2kKxfQTqA8db-pmp9B-mm0n3ntuY2B6j9@mail.gmail.com>

kyunglok,
you may have already heard back from others, but here are my two cents:
effects of increased nozzle pressure:
1) rougher films
2) more coverage at the bottom of trenches
essentially the higher pressure allows for a less fine spray but great
directionality of the spray.

when you mention the nozzle being raised by 800k steps during a recipe, that
is to avoid having too much pressure on a wet resist in the center...without
raising the nozzle the pressure could spread out the resist in the center of
the wafer.  at least that is the only reason i know of to make this
adjustment.

considering your other question about dots in your sprayed resist coats...i
have not seen this, but i have not been using the system much lately.
 anyone else?
j

On Sun, Oct 24, 2010 at 12:43 AM, Kyunglok Kim <kyunglok at stanford.edu>wrote:

> Dear spray coater users,
>
> I'm making a recipe for the spray coater.
> When I looked at some recipes made by other users, I found that some people
> raised the nozzle by about 800000 during spray coating and some others
> didn't. The used profile is very similar in both cases.
> And the several numbers are used in nozzle pressure : from 100mbar to
> 1600mbar.
> Can I ask the effect of theses changes to the coating profile?
>
> Thanks!
>
> Bests,
> Kyunglok
>
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From mahnaz at stanford.edu  Thu Oct 28 14:57:16 2010
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Thu, 28 Oct 2010 14:57:16 -0700
Subject: Missing chemicals
Message-ID: <4CC9F1BC.3070703@stanford.edu>


Hello all,

I have a user who has lost two bottles of his chemicals.
One was full ( the recent one) is gone missing so if you want to use 
some ones chemical
have the courtesy of asking them first and make sure that you put it 
back where you have taken it from.

Secondly,  so often I end up to clean the table next to the tool, please 
keep it tidy.

mahnaz