Comment gasonics SNF 2009-02-25 21:09:00: Wafer chip

[damodei at snf.stanford.edu]

While removing photoresist from bonded wafers,t one of the wafers had a small chip in it on removal from the machine.  Bonding was apparently weak at the edge.  The broken-off piece of wafer was in place and accounted for, but I am concerned that  smaller splinters of wafer might be still in the machine.  The machine seems to function normally.