Shutdown hdpcvd SNF 2012-06-19 17:31:17: Wafer in chamber

mcvittie at snf.stanford.edu mcvittie at snf.stanford.edu
Wed Jun 20 11:51:18 PDT 2012


Had to vent chamber to remove wafer. Problem was caused by residue from tape at edge of wafer. Residue cause wafer to stick to clamp on declamping so it could not be unloaded.  
Leaktest after about 20 min of pump gave rate of 0.7 mT/m.
  Jim 




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