Shutdown hdpcvd SNF 2012-06-19 17:31:17: Wafer in chamber

[mcvittie at snf.stanford.edu]

Had to vent chamber to remove wafer. Problem was caused by residue from tape at edge of wafer. Residue cause wafer to stick to clamp on declamping so it could not be unloaded.  
Leaktest after about 20 min of pump gave rate of 0.7 mT/m.
  Jim