From king at snf.stanford.edu Mon Aug 14 16:26:01 2000 From: king at snf.stanford.edu (Robin King) Date: Mon, 14 Aug 2000 16:26:01 -0700 (PDT) Subject: Results Message-ID: Dear Innotec users, I'm sure most of you measure the film thickness, and often stress and resistivity, but how can we get you to record the results in the logbook? It really needs to be done. Thanks for your cooperation, Robin King From flannery at leland.Stanford.EDU Tue Aug 22 17:07:29 2000 From: flannery at leland.Stanford.EDU (Anthony Flannery) Date: Tue, 22 Aug 2000 17:07:29 -0700 Subject: Ion Gun Message-ID: <39A315C1.CC5D2FCE@leland.stanford.edu> Hi All, As forewarned a month or two ago, I will be installing the ion gun into the Innotec sometime in the next two-three days. The installation will probably take less than a day so it should not interrupt use of the machine any more than a run. What will change is the tooling factor. Dep rates will decrease by roughly 20-25%. If you have thickness critical runs, you will want to recalibrate them after the gun is installed. I will be doing a quick calibration run, probably with Al, and send this info out as soon as I have it, but I would still check for anything critical. Other metals SHOULD be affected by the same percentage, but you never know. The ion gun accelerates a stream of Argon ions at the wafers during the dep. They provide just enough energy for some surface rearrangement and are effective at reducing stress. Last time this was in place, stress in Pt was reduced from ~900 MPa to ~400 MPa, allowing us to deposit thicker films. Do not use the gun unless you get trained. You could really do some damage to it and then I would cause you to hurt with great pain. Tony