Innotec Planning Questionaire
mihuhou at stanford.edu
Wed Mar 11 17:08:37 PDT 2009
I used innotec (a few times) because it can process large batch of wafers. I
used to processed 10~22 wafers at one pump down.
----- Original Message -----
From: "Ed Myers" <edmyers at stanford.edu>
To: <innotec at snf.stanford.edu>
Cc: "Yoshio Nishi" <nishiy at stanford.edu>
Sent: Wednesday, March 11, 2009 1:44 PM
Subject: Innotec Planning Questionaire
> Innotec Users,
> Attached are two documents regarding Innotec usage. The utilization
> graph shows the level of usage of the Innotec. As you can see, the
> utilization rate has climbed by ~25% over the last few years. This,
> along with the cancelation of reservations has created a lot of pain
> for those depending on this tool.
> The second attachment (Usage Items) is a list of all the depositions
> done in the system since mid-October 2008. When I looked at the
> depositions, it appears that ~75% of those depositions could be done
> in a different tool. I admit, there are a lot of assumptions
> regarding this estimation, one being we may not have that other
> tool. We are attempting to do some equipment planning and we need
> clarification as to why you have chosen to use the Innotec.
> To me, there are a couple of options to relieve the pressure on the
> Innotec. The simplest and the one you hear the most is a second
> Innotec. Option two may be adding/replacing/modifying a metal system
> to off load the deposition which don't have to be on the Innotec. A
> third option may be addition of an ion mill system to lower our
> dependence on lift-off processing. Or options you can point out.
> I prefer we chose the correct tool for the right applications and add
> capability if possible (we have not forgotten about the requests for
> dielectric depositions). For example, if we can identify another
> tool which can off load the Innotec and provide new capability this
> could also be a winning solution. Another approach could reconfigure
> the Gryphon or SCT or working on the uniformity of the metalica.
> To help us in planning, could you please respond as to why you use
> the Innotec. The reasons may range from the need for very thin
> films, uniformity of the deposition (then you should provide a
> uniformity target), in-situ thickness monitoring (what range can you
> tolerate?), multiple layers in a single pump down (how many?),
> required for lift-off (what metals are you sing) device sensitivity
> (plasma damage), substrate (polymer or organic), contamination
> categories (clean verse gold contaminated), large batch of wafers
> (how many), or I would use a different tool (if it did...).....
> Please hit the reply button and share your reasons for using the
> Innotec and what other approaches could serve your needs.
> Ed and your SNF staff
More information about the innotec