From mahnaz at stanford.edu  Mon Jan  5 22:02:30 2009
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Mon, 05 Jan 2009 22:02:30 -0800
Subject: update
Message-ID: <4962F3F6.2080209@stanford.edu>


Hello all,

The system got the pm on 12/18 and 1/19 of 2008
I tested the system on 12/19. I ran two wafers simultaneously for each 
thickness and ran it with both developers.

1 um of 3612:
1.1 second of exposer in Hard contact regular developer Ldd26W vs. MF26A
I resolved 1um ( some area) and 1.5 um line and space  in all areas, 
with both developers.
For 1 um depending on your polarity of your mask and etc.  you need 1.1 
to 1.3 seconds of exposer.
 *
Please note that the original recipe already has been replaced with new 
developer and the recipe on both svgdev and svgdev2 has been modified 
for 1 um resist.*

Same was done with 1.6 um 3612 , 1.6 seconds  of expose in Vac. contact 
and  1.5 um line and space was resolved in all areas with both developers.

*
Please note that the original recipe already has been replaced with new 
developer and the recipe on both svgdev and svgdev2 has been modified 
for 1.6 um resist.
*
depending on your polarity of your mask for 1.6 um resist you need 1.5 
to 1.8 seconds of exposer.
 
welcome back
mahnaz


From mahnaz at stanford.edu  Mon Jan  5 22:23:39 2009
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Mon, 05 Jan 2009 22:23:39 -0800
Subject: Test wafers
Message-ID: <4962F8EB.2060104@stanford.edu>


Hello all

I forgot to mention in my earlier email that every one should run a test 
wafer with new developer.
I have reserved program 8 on both developer tracks so you can freely 
change the time  in case you need to adjust things for your process,  
just in case.
Let me know if you need help with your process.
mahnaz


From mahnaz at stanford.edu  Thu Jan  8 11:19:58 2009
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Thu, 08 Jan 2009 11:19:58 -0800
Subject: exposure time
Message-ID: <496651DE.3050504@stanford.edu>


Hello all,

I see few labmember are frustrated by the way the system has been left.
So  here are my two cents.

If you need to expose for 190 seconds, process wise is wise to break it 
down so you will take care of nitrogen activation and give it a chance 
to release itself.
Go to *Multiple exposer *and turn it on and divide/ break down your 
exposure time for *20 seconds you can do 5 seconds X 4( this is the 
interval) and there will be delay time as well which we recommend some 
where from 5 to 10 seconds  depending on thickness of the resist. *
All of this are written in the documentation next to to tool. need help 
talk to me.


If still want to do what you are doing then be kind and lower the 
exposure time to 2 seconds.

mahnaz