From jrjain at snf.stanford.edu Thu Apr 30 02:08:07 2009 From: jrjain at snf.stanford.edu (jrjain at snf.stanford.edu) Date: Thu, 30 Apr 2009 02:08:07 -0700 Subject: Problem ksbonder SNF 2009-04-30 02:08:06: Wafer Broken Message-ID: Top wafer came out broken after a process. This process has been done successfully several times in the recent past. Wafers were positioned correctly, with tabs and rollers extended properly. A bonding immediately preceding this one was also done successfully (but using a different recipe). I remove the wafer pieces from the chuck and blew particles off using N2 gun.