need info for wet etching of glass
hgross at etec.com
Fri Dec 1 07:36:59 PST 2000
Who has experience in wet etching of 50-100um deep microchannels (e.g.
50, 100 and 250
micron wide) in glas substrates (e.g. Pyrex)?
-Etchant / Concentration?
-Cross section profile of the trench?
-Etch rates dependance on trenchwidth?
-Impact of agitation (etch rate, profile)?
Who knows anything about Electrochemical Isotropic Silicon Etching
-Beside for the fabrication of porous silicon, is this technique also
to etch trenches in silicon (to replace the difficult to control
isotropic silicon etching with HF-HNO3) and
for wafer polishing (e.g. to remove DRIE sidewall scalloping)?
-If so, how well can the process be controlled?
-Surface roughness improvement (Ra)?
-Etchant / concentration?
-Silicon wafer dopant type and concentration?
Thanks very much in advance for any feedback!
Dr. Harald Gross (m/s 144270)
Multi E-Beam Technology
ETEC Systems, APPLIED MATERIALS Inc.
26460 Corporate Avenue
Hayward, CA 94545 USA
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