Hi all, I wonder how uniform is the shallow Si etch with Drytek2, could that be as good as 20% error? Since I must use photoresist as an etch mask, I couldn't use Lampoly. And with STS, the etch rate is too fast; uniformity is also worse. My process will be six trenches, 10um wide, 2um deep, and smallest spacing is 5um. Thanks!! Yu-ju