From ibrahim at stanford.edu Fri Feb 1 07:33:47 2002 From: ibrahim at stanford.edu (Nabeel Ibrahim) Date: Fri, 1 Feb 2002 07:33:47 -0800 (PST) Subject: 110C postbake set to 180C Message-ID: I came in this morning and found the 110C postbake at 180C. I think I know who did this, but I would like to suggest that anyone who cranks up the temperature should, at the very least, tape a note to the oven door indicating that the temperature is set higher. Ideally, the person should also set the temperature back down to 110C when finished. Nabeel From beckwith at snf.stanford.edu Fri Feb 1 16:04:58 2002 From: beckwith at snf.stanford.edu (Sharleen Beckwith) Date: Fri, 1 Feb 2002 16:04:58 -0800 (PST) Subject: 110C postbake set to 180C In-Reply-To: Message-ID: I seem to remember the rule being that if you need a different temp in one of the litho ovens, you change the SINGE temp. AND leave BIG a note on the door. That way you NEVER mess up someone else's resist. The 90 and 110 oven temps are NEVER to be changed. Correct me if I am wrong about this. On Fri, 1 Feb 2002, Nabeel Ibrahim wrote: > > I came in this morning and found the 110C postbake at 180C. I think I > know who did this, but I would like to suggest that anyone who cranks > up the temperature should, at the very least, tape a note to the oven > door indicating that the temperature is set higher. Ideally, the > person should also set the temperature back down to 110C when finished. > > Nabeel > From mahnaz at snf.stanford.edu Mon Feb 4 10:59:09 2002 From: mahnaz at snf.stanford.edu (Mahnaz Mansourpour) Date: Mon, 04 Feb 2002 10:59:09 -0800 Subject: Changing temp. Message-ID: <3C5ED9FD.74C16173@snf.stanford.edu> Hello all, I had made the mistake of oking the change of the temp on the 110 oven in the litho area for one member. I learned that cost other members some head ache and misproccessing. I apologize for that. Also recently few members brought to my attention that rules are not being followed at night. It is every ones responsibility to be very careful and take all the measure to prevent accidents. we are all part of a community and we all need to follow the rules and policies and that is the only way. No one should change or adjust the oven temperature including the singe oven. If there is a need for some nonstandard processing, please come and see me. mahnaz From mahnaz at snf.stanford.edu Mon Feb 4 16:23:11 2002 From: mahnaz at snf.stanford.edu (Mahnaz Mansourpour) Date: Mon, 04 Feb 2002 16:23:11 -0800 Subject: mixed up chemical Message-ID: <3C5F25EF.D91FEF59@snf.stanford.edu> People, people I hate to lecture....so lets start from step one, do we all know every little thing we do in the lab effect some one else or their work.? If this is true, why do I come across things like this? This afternoon we found the bottle of 220-7 resist in the cabinet the one that says for manual dispense only we noticed is not as viscous as should be, thanks to Pierre's help we ran a wafer with that resist and there is 3612 resist in there. I am not really sure what has happened ,but if you were combining the left over resist that should go to the correct bottle. I will look in to the manual dispense bottle issue and let you know how we will be handling it. Mean while I have this bottle of resist if any one has a need for it for simple resist coverage which is not critical, let me know and you are welcome to it.. mahnaz From DWeaver at sirostech.com Tue Feb 5 08:15:00 2002 From: DWeaver at sirostech.com (Daniel Weaver) Date: Tue, 5 Feb 2002 08:15:00 -0800 Subject: polyimide Message-ID: <31B8005BBABAD511A71E00A0C9EEA2F50BF306@MAIL> Does anyone have a small amount of polyimide I could use for an experiment? Thank you Daniel Weaver Process Development Engineer Siros Technologies 101 Daggett Drive San Jose, CA. 95134 Phone: 408-474-3381 Fax: 408-954-9300 dweaver at sirostech.com -------------- next part -------------- An HTML attachment was scrubbed... URL: From tbilir at stanford.edu Tue Feb 5 10:10:04 2002 From: tbilir at stanford.edu (David Taner Bilir) Date: Tue, 5 Feb 2002 10:10:04 -0800 (PST) Subject: porous Si Message-ID: Hi, I was wondering if anyone has experience with porous Si. particularly in applications of microfluidics. any info would be greatly appreciated. -Taner From sganesan at stanford.edu Tue Feb 5 10:45:13 2002 From: sganesan at stanford.edu (Srikanth Ganesan) Date: Tue, 5 Feb 2002 10:45:13 -0800 (PST) Subject: Hard planarization layer Message-ID: Dear lab members, I want to know if anyone of you have experience with planarization. I would like the final thickness of the planarization layer to be about 50-60nm. (either direct spinning or spinning and etch back). The surface has to be very smooth and the planarization layer has to be very very hard( I want to scan a read head in contact with the surface). I would really appreciate if you could help me with this. Or if you know of someone who would be able to help, please let me know. Thanks Srikanth ******************************************************************************* Srikanth Ganesan PH:(RES) 650-852 9989 2179 Williams St, Email:sganesan at leland.stanford.edu Palo Alto, CA 94306-1417 PH:(OFF) 650-724 4582 ******************************************************************************* From rcrane at snf.stanford.edu Tue Feb 5 16:49:11 2002 From: rcrane at snf.stanford.edu (Dick Crane) Date: Tue, 05 Feb 2002 16:49:11 -0800 Subject: Furnace area disruption 2/7/02 Message-ID: <3C607D87.E9AD483E@snf.stanford.edu> The Tylan bank 1 furnace will be moved to bank 5 location on Thursday, 2/7/02, between 0900 and 1100. During the move the follow areas will disrupted (moving crew, equipment dollies, fab shelves moved, etc.): Aisle L114, bank 1 and 2 area. Main cross aisle from bank 1, through the epi reactor/ion implant area, to bank 5 . Aisle L118, from the chemical passthru to bank 5 & 6. The actual move should take less than 30 minutes. In general, only the area immediately around the moving furnace will be affected. Furnace gas supplies will not be interrupted. Thank you for your patience, Dick From jperez at snf.stanford.edu Wed Feb 6 14:57:35 2002 From: jperez at snf.stanford.edu (Jeannie Perez) Date: Wed, 06 Feb 2002 14:57:35 -0800 Subject: Innotec is down for a clean! Message-ID: <3C61B4DF.1A27F2B8@snf.stanford.edu> Greetings All, Parts are being sent out for clean. Watch for further announcements. From mahnaz at snf.stanford.edu Wed Feb 6 15:59:49 2002 From: mahnaz at snf.stanford.edu (Mahnaz Mansourpour) Date: Wed, 06 Feb 2002 15:59:49 -0800 Subject: SVGtrack 2 up date Message-ID: <3C61C375.C77333F0@snf.stanford.edu> Hello all, I like to let you know that SVG track 2 is up on dispense one (1) ONLY. I worked on the track a while today and uniformity looks very good. Recipes 7 for 1 um and 8 for 1.6 um are to be used only and the thickness on both recopies ARE about +/- 150 A of the target. As usual run one or two dummies as it is hard to spray these nozzles with Acetone. PLEASE DO NOT ASSUME THE TRACK 2 IS THE DUPLICATION OF TRACK 1. DO NOT GO TO OTHER DISPENSES (2 AND 3), THEY ARE TOTALLY DIFFERENT RESIST. i WILL RELEASE MORE INFORMATION AS I GET MORE TIME ON THE SYSTEM. The new sensor is on the order so the issue with the sensitivity with glass wafers should resolve with in few weeks. You are responsible to check the carboy under the cover and pump it if necessary. If it has been a while for you to use the track see me, Uli, Mike or Mario and we go over the changes. Comments and suggestions are welcome as usual. mahnaz From guerra at par.stanford.edu Wed Feb 6 16:26:56 2002 From: guerra at par.stanford.edu (Ann Guerra) Date: Wed, 6 Feb 2002 16:26:56 -0800 (PST) Subject: Reminder: BROADCOM Presentation FRIDAY 2/8/02 Message-ID: SPECIAL SEMINAR Friday, February 8, 2002 10:00 a.m. CIS-101 "A 64MHz Sigma-Delta ADC with 105dB IM3 Distortion Using a Linearized Sampling Network" (ISSCC 13.6) Abstract: A sigma-delta ADC with 105dB distortion up to 1.5MHz signal bandwidth uses a linear sampling network in a 2-1-1 modulator. Operating at 64MHz clock frequency, the measured SNR in a 1.1MHz bandwidth is 88dB. The area, including the bypass capacitors, is 2.6mm2. The power consumed is 230 m@, including references and decimation filter. From rcrane at snf.stanford.edu Wed Feb 6 18:27:25 2002 From: rcrane at snf.stanford.edu (Dick Crane) Date: Wed, 06 Feb 2002 18:27:25 -0800 Subject: Lab evacuation Message-ID: <3C61E60D.EE9F9D76@snf.stanford.edu> On Wednesday afternoon, 2/6/02, the fab was evacuated due to a Cl detector in the pquest gas cabinet erroneously triggering. No Cl gas was present or leaking in the cabinet. The control computer had reset the set (trigger) point to 0.0ppm thus setting off the alarm. The computer and softwave (from 1994) will be upgraded soon. Sorry for the inconvenience, Dick From ferrera at snf.stanford.edu Thu Feb 7 18:49:50 2002 From: ferrera at snf.stanford.edu (Juan Ferrera) Date: 07 Feb 2002 18:49:50 -0800 Subject: Boron etch stop for KOH/TMAH etching Message-ID: <1013136590.1511.31.camel@filipo> Dear lab members, I need to fabricate 3 um-thick Si membranes, and plan to use a highly boron-doped (>1E20 /cm^3) layer as an etch stop. If anyone has a process to use diffusion or epi to get a similar etch stop layer, I'd love to hear about it. Juan From rgrow at stanford.edu Fri Feb 8 16:55:08 2002 From: rgrow at stanford.edu (Randy Grow) Date: Fri, 08 Feb 2002 16:55:08 -0800 Subject: Lost Wafer of Released Cantilevers Message-ID: <5.1.0.14.2.20020208165233.00b0f740@rgrow.pobox.stanford.edu> If anyone found a wafer of released cantilevers, I would really love to have it back. I think I may have left in the fab or thereabouts last Thursday or so. It is in a covered petri dish on top of a circle of wipe. I etched it in the Drytek1 and removed PMMA in the litho solvent bench. Thx. Randy Grow From jwc at snf.stanford.edu Tue Feb 12 10:33:35 2002 From: jwc at snf.stanford.edu (James Conway) Date: Tue, 12 Feb 2002 10:33:35 -0800 Subject: Gary Bordonaro to visit SNF March 1, 2002 Message-ID: <3C695FFF.A95234CA@snf.stanford.edu> Hello, Gary Bordonaro from the Cornell Nanofabrication Facility, Cornell University, will be visiting SNF all day March 1, 2002. We are putting together a schedule of meetings and hope to facilitate discussions with staff and all interested parties whom wish to participate. He indicated he is very interested in discussions regarding Photolithography processes. Please send me an email with the time(s) you are available, and if you desire to participate in a general discussion or wish for a one-on-one meeting, and we will get you on the schedule. Also indicate if you would be able to attend a luncheon held off site over the lunch hour. Thank you, James Conway 725-7075 From mahnaz at snf.stanford.edu Tue Feb 12 16:33:29 2002 From: mahnaz at snf.stanford.edu (Mahnaz Mansourpour) Date: Tue, 12 Feb 2002 16:33:29 -0800 Subject: EV visit Message-ID: <3C69B459.F53F51A4@snf.stanford.edu> Hello all, I really apologize for this email coming out so late. Chad Brubaker the staff engineer from Electronic Vision will be here tomorrow 2/13 at 10 in the lab. As usual we will go over the aligner in the morning and the afternoon is put aside for the bonder. Please come by with your questions and concern and if you are interested in the bonder come around 2 pm and chad will give a overall view of the system which is very beneficial for beginners.. see you mahnaz From kenney at snf.stanford.edu Tue Feb 12 23:54:58 2002 From: kenney at snf.stanford.edu (Christopher Kenney) Date: Tue, 12 Feb 2002 23:54:58 -0800 (PST) Subject: XeF2 Etching Talk Message-ID: Xenon Difluoride Etching Wednesday at 2:30 in the CISX Auditorium Rosemary M. Dahlberg XACTIX, Inc. Xenon difluoride is used for the isotropic etching of silicon, mainly for microstructure release processes, undercutting, smoothing of sharp edges, and for any application in which you need high selectivity isotropic etching. Etch rates up to 10 microns per minute. Are you involved in MEMS or semiconductor processing? Are your etching silicon as your sacrificial layer? Are you tired of dealing with wet etching release processes? Do you wish that you could do extended isotropic etching of silicon with only a photoresist mask? Are you concerned about the survival of your released structures during drying, or final device packaging? Then consider an xenon difluoride etching system solution: - Xenon difluoride etching shows very high selectivity to silicon over many standard semiconductor materials including photoresist, silicon dioxide, silicon nitride, and aluminum. - Xenon difluoride etching is a clean, dry process that is potentially CMOS-neutral. - Depending on your device and its package design, XeF2 can release your structures after bonding and packaging. - A versatile, computer controlled system capable of handling dies, pieces of wafers, and wafers up to 8" diameter will be described. From griffin at plumb.Stanford.EDU Wed Feb 13 09:31:33 2002 From: griffin at plumb.Stanford.EDU (Peter Griffin) Date: Wed, 13 Feb 2002 09:31:33 -0800 (PST) Subject: Seminar Wed 11am on Atomistic Modeling of FET's (fwd) Message-ID: WEDNESDAY 13 FEB --- 11 am --- CISX-338 3-D Atomistic Modeling for Deep Submicron Device Fabrication Dr. Martin Jariz The complexity attained by current microelectronics processing technologies can hardly be handled with simulator based on the continuum approach. Over the last few years, atomistic Kinetic Monte Carlo (KMC) has proven to be an effective way to tackle the many concurrent mechanisms that have to be taken into account as device dimensions shrink into the deep submicron regime. We will describe how we model point defect diffusion and extended defects in silicon within this approach (DADOS KMC simulator) and present some examples, including the simulation of a device with the new DADOS version recently implemented in the Taurus 3D Process Simulator. From cheng1 at stanford.edu Wed Feb 13 12:20:38 2002 From: cheng1 at stanford.edu (Ching-Hsiang Cheng) Date: Wed, 13 Feb 2002 12:20:38 -0800 Subject: Image Reversal using AZ5214 Message-ID: <3.0.3.32.20020213122038.00ab8b90@cheng1.pobox.stanford.edu> Dear Lab members, Have anyone been using AZ5214 to do image reversal? Could you please tell me what is the flood exposure time you use on either evalign or karlsuss? What is the spinned photoresist thickness also? Thanks a lot ^^ Ching-Hsiang From casey at reflectivity.com Thu Feb 14 11:58:51 2002 From: casey at reflectivity.com (Casey Feinstein) Date: Thu, 14 Feb 2002 11:58:51 -0800 Subject: si substrate etching Message-ID: Hi, I'm planning a KOH or TMAH etch through a Si substrate, and I'm wondering about potential frontside masking materials. Has anyone used BCB or black wax to protect the front side during a long etch? If so, how do you address the BCB edges and possible delamination? Does anyone have other suggestions for a good protective layer? Thanks in advance for your help, Casey Feinstein Device Development Engineer Reflectivity, Inc. 3910 Freedom Circle Suite 103 Santa Clara, CA 95054 (408)970-8881 x151 -------------- next part -------------- A non-text attachment was scrubbed... Name: winmail.dat Type: application/ms-tnef Size: 1880 bytes Desc: not available URL: From mahnaz at snf.stanford.edu Fri Feb 15 14:25:42 2002 From: mahnaz at snf.stanford.edu (Mahnaz Mansourpour) Date: Fri, 15 Feb 2002 14:25:42 -0800 Subject: SVG track Message-ID: <3C6D8AE5.DAAB5734@snf.stanford.edu> Hello all, There is two sets of recipes for the track now, which labeled TRACK 1 and TRACK 2. Please do not copy the recipes from one track to another, it will NOT WORK. The track 2's software is different form the track 1. So lets go over this again on track 2 recipe 7,8 and 2 on dispense 1 are only available to you. No changes to these recipe allowed and the hard copy is in the lab by the system. Have a nice holiday mahnaz From rcrane at snf.stanford.edu Tue Feb 19 09:24:26 2002 From: rcrane at snf.stanford.edu (Dick Crane) Date: Tue, 19 Feb 2002 09:24:26 -0800 Subject: Loss of building heat 3/2/02 Message-ID: <3C728A4A.457DB35@snf.stanford.edu> On Saturday, March 2, 2002, CIS and CISX building will lose heating water from 0700 to 1700 to permit the addition of a flowmeter to the system. In general, the buildings and labs will be functional but not temperature controlled. The photolithography area of the fab will be unusable due to loss of temperature and humidity control. Please assume the photo area will require an additional two to four hours to stabilize. Sorry for the inconvenience, Dick Crane From vikbala at yahoo.com Thu Feb 21 13:50:00 2002 From: vikbala at yahoo.com (Vikram Bala) Date: Thu, 21 Feb 2002 13:50:00 -0800 (PST) Subject: Si grinding outsource Message-ID: <20020221215000.50985.qmail@web13805.mail.yahoo.com> Can anyone suggest a reliable company that provides Si wafer grinding services? Thanks! Vikram __________________________________________________ Do You Yahoo!? Yahoo! Sports - Coverage of the 2002 Olympic Games http://sports.yahoo.com From mbadi at relgyro.stanford.edu Fri Feb 22 09:56:28 2002 From: mbadi at relgyro.stanford.edu (Mohammed H. Badi) Date: Fri, 22 Feb 2002 09:56:28 -0800 (PST) Subject: 350 um wafer w/Aluminum? Message-ID: hi all, does anybody have an extra 350 um thick Si wafer with blanket Al on it? it doesn't matter if there are any films underneath the Al. i'd love to have one if you can spare it. thanks! moe. mbadi at snf -------- Mohammed H. Badi 650.906.0663 From hsiung at snf.stanford.edu Mon Feb 25 12:06:34 2002 From: hsiung at snf.stanford.edu (Alan Hsiung) Date: Mon, 25 Feb 2002 12:06:34 -0800 Subject: SOI measurement Message-ID: Dear Lab members, Has anybody had the experiences for measuring silicon thickness of SOI varying from 200 to 2000A? Is there a recipe or program that I can use on either the nanospec or ellipsometer? Your help is gratefully appreciated. Alan From shott at snf.stanford.edu Mon Feb 25 14:50:25 2002 From: shott at snf.stanford.edu (John Shott) Date: Mon, 25 Feb 2002 14:50:25 -0800 Subject: Coral enable/disable difficulties over the weekend .... Message-ID: <3C7ABFB1.A9D2ECB8@snf.stanford.edu> SNF Lab Members: Several of you have noticed varying levels of enable/disable "wierdness" that occurred over the weekend. Specifically, what Coral thought was enabled was not always consistent with what the "ON" light said. Also, it turns out that what Coral was displaying was not consistent with the underlying data in the database. Without boring you with details, while the equipment server appeared to be functional during the weekend, an "under to covers" portion that updates the database failed silently. In over 2 years of operation, we have never seen this behavior and, at this point, don't know the cause. We are, however, adding improved logging to at least detect and warn us of this failure and hope to get to the bottom of this quickly. On Sunday morning, I rebooted the machine and restarted the servers in the process of adding some operating system patches. Restarting the servers causes them to reload their memory from the database ... which caused these inconsistencies to become visible. (It actually appears as if equipment database updates had quit ... silently ... on Friday.) While Coral does not actually disable any hardware in these circumstances ... some people who actually had equipment enabled were adversely affected because others found that equipment was "ON" even though Coral showed it not to be enabled ... and tried to correct the problem by "resynchronizing" the equipment with Coral by disabling it. While we have not had frequent problems of this type, remember to let us know when you see an inconsistency between "ON" lights and what Coral thinks is enabled .... We apologize for diffuculties that this has caused and are working hard to figure out where the bug occurs. Thanks for your continued support, John From mglazer at stanford.edu Mon Feb 25 16:18:13 2002 From: mglazer at stanford.edu (Marc Irving Glazer) Date: Mon, 25 Feb 2002 16:18:13 -0800 (PST) Subject: *** PhD defense for Marc Glazer - this Friday, 1:00 ** Message-ID: "Colloidal Silica Films for High-Capacity DNA arrays" PhD defense for Marc Glazer - Stanford depts. of Materials Science and Chemical Engineering in collaboration with Affymetrix, Inc. will be held in *** CISX auditorium, Friday, March 1st, 1pm*** http://www.stanford.edu/home/map/search_map.cgi?keyword=CISX Colloidal Silica Films for High-Capacity DNA Arrays The human genome project has greatly expanded the amount of genetic information available to researchers, but before this vast new source of data can be fully utilized, techniques for rapid, large-scale analysis of DNA and RNA must continue to develop. DNA arrays have emerged as a powerful new technology for analyzing genomic samples in a highly parallel format. The detection sensitivity of these arrays depends on the quantity and density of immobilized probe molecules, as well as on the thermodynamics and kinetics of nucleic acid hybridization. We have prepared and investigated substrates with a porous, "three-dimensional" surface layer as a means of increasing the surface area available for the synthesis of oligonucleotide probes, thereby increasing the number of available probes and the amount of detectable bound target per unit area. Porous films were created by two techniques. In the first approach, films were deposited by spin-coating silica colloid suspensions onto flat glass substrates, with the pores being formed by the natural voids between the solid particles. The resulting films have relatively small pores (23nm) and low porosity (35%). In the second approach, latex particles were co-deposited with the silica and then pyrolyzed, creating films with larger pores (36nm), higher porosity (65%), and higher surface area. For 0.3 micron films, a 10-fold enhancement was achieved with the pure silica films, and 15-fold with the films "templated" with polymer latex. Having demonstrated the effectiveness of the high-capacity films, we next investigated the kinetics of hybridization on these substrates. Adsorption of DNA onto the high-capacity films is controlled by traditional adsorption (ka) and desorption (kd) coefficients, as well as morphology factors and transient binding interactions between the target and the probes. To describe these effects, we have developed a model analogous to diffusion of a reactant in a porous catalyst. We show that the strength of the transient probe/target binding interactions are on the order of 5-7 DNA base pairs, which suggests the formation of nucleation or other metastable complexes, rather than fully-zippered duplexes. From rcrane at snf.stanford.edu Mon Feb 25 16:52:22 2002 From: rcrane at snf.stanford.edu (Dick Crane) Date: Mon, 25 Feb 2002 16:52:22 -0800 Subject: Fire alarm strobe test Tuesday AM, loss of process gas Message-ID: <3C7ADC46.B9805345@snf.stanford.edu> There will a brief test of the toxic gas monitoring system which will include the fire alarm strobe lights on Tuesday, 2/26/02 between 0800 and 0830. Please disregard the alarm. Lab users (all labs): All process gases, and hydrogen and oxygen will be turned off briefly as part of the test. This affects furnaces, dep tools, and some etch tools. Sorry for the inconvenience. This test will help keep our labs safe. Dick Crane From grupp at snowmass.Stanford.EDU Mon Feb 25 18:11:02 2002 From: grupp at snowmass.Stanford.EDU (Dan Grupp) Date: Mon, 25 Feb 2002 18:11:02 -0800 (PST) Subject: SOI measurement In-Reply-To: Message-ID: program 52 on the Nanospec in photobay is best. -Dan On Mon, 25 Feb 2002, Alan Hsiung wrote: > Dear Lab members, > Has anybody had the experiences for measuring silicon thickness of SOI > varying from 200 to 2000A? > Is there a recipe or program that I can use on either the nanospec or > ellipsometer? > Your help is gratefully appreciated. > > Alan > > > > --------------------------------------------------------------------------- Dr. Daniel Grupp, Visiting Scholar Center for Integrated Systems Stanford University Stanford, CA 94305 (650) 724-6911 FAX: 723-4659 --------------------------------------------------------------------------- From casey at reflectivity.com Tue Feb 26 11:26:51 2002 From: casey at reflectivity.com (Casey Feinstein) Date: Tue, 26 Feb 2002 11:26:51 -0800 Subject: cold storage Message-ID: Hi Everybody- I am looking for somewhere to store 200mL of BCB at -15C. Does anyone know of a freezer around the lab where this would be possible? Thanks, Casey -------------- next part -------------- A non-text attachment was scrubbed... Name: winmail.dat Type: application/ms-tnef Size: 1532 bytes Desc: not available URL: From jwc at snf.stanford.edu Thu Feb 28 11:01:10 2002 From: jwc at snf.stanford.edu (James Conway) Date: Thu, 28 Feb 2002 11:01:10 -0800 Subject: WANTED: scraps and samples of B implant in Silicon? Message-ID: <3C7E7E76.5DB88851@snf.stanford.edu> Hello, By chance, would anyone have any sized scraps of silicon substrate with any pattern of an Ion Implant containing B (Boron), or another low Z metal dopant? I am seeking a material set or dopant that exhibits little to no Secondary Electron Contrast in the SEM, but would have a decent yield in Back Scatter Contrast when used in Backscatter Imaging mode. This would be used to teach BSE imaging in the SEM Practicum Class I teach, and to assist the San Francisco Police Department Gun Shot Residue Analysis Laboratory. Thank you. RSVP to James Conway jwc at snf.stanford.edu From jwc at snf.stanford.edu Thu Feb 28 12:23:15 2002 From: jwc at snf.stanford.edu (James Conway) Date: Thu, 28 Feb 2002 12:23:15 -0800 Subject: REMINDER: Gary Bordonaro from CNF - Cornell will visit SNF Friday 3-1-2002 Message-ID: <3C7E91B3.918DABE2@snf.stanford.edu> Greetings: Gary Bordonaro and Mike Skvarla from Cornell University, Cornell Nanofabrication Facility will be visiting SNF tomorrow Friday March 1, 2002. Gary Bordonaro is a Photolithography Process Engineer and Mike Skvarla is the Outside User Program manager for CNF. Below is an informal schedule of events. Please join us for general discussions about Ebeam and Optical Photolithography Processes we can share between centers, and other interesting topics as they come up. This meeting is the result of extended discussions with CNF staff and myself during my visit to Cornell University in January, where we began discussions to seek methods to improve communications and sharing of process information between NUNN Centers. This is intended to be a means to aid in process development and to enable developing continuing collaborations between lab members between all NUNN facilities. Schedule for Gary Bordonaro's Visit to SNF: Meet and Greet 9:00 - 9:15 Lab and Cleanroom Tour 9:20 - 10:15 General Discussions: 10:30 -11:30 Meeting in Room CIS 201 Everyone is invited to attend if interested. Lunch in Palo Alto 12:00 - 1:30 Afternoon Individual and One-on-One Discussions: Meeting in Room CIS 201 2:00 - 4:00 Please sign up on the sheet posted in my office, CIS 31 2:00 - 2:30 "Sergey Babin" 2:30 - 3:00 _______AVAILABLE_____________ _______________________ 3:00 - 3:30 _______AVAILABLE_____________ _______________________ 3:30 - 4:00 _______AVAILABLE_____________ _______________________ Thank you, James Conway 725-7075 -------------- next part -------------- An HTML attachment was scrubbed... URL: From grupp at snowmass.Stanford.EDU Thu Feb 28 14:54:51 2002 From: grupp at snowmass.Stanford.EDU (Dan Grupp) Date: Thu, 28 Feb 2002 14:54:51 -0800 (PST) Subject: Looking for book... Message-ID: Does anyone have: Schroder, Dieter K. Semiconductor material and device characterization / Dieter K. Schroder. 1998. [QC611 .S335 1998 -- 1 copy in ENG/CHECKEDOUT] Thanks, DAn --------------------------------------------------------------------------- Dr. Daniel Grupp Center for Integrated Systems Stanford University Stanford, CA 94305 (650) 724-6911 FAX: 723-4659 --------------------------------------------------------------------------- From mahnaz at snf.stanford.edu Thu Feb 28 15:56:54 2002 From: mahnaz at snf.stanford.edu (Mahnaz Mansourpour) Date: Thu, 28 Feb 2002 15:56:54 -0800 Subject: Loss of humidity control in photo Message-ID: <3C7EC3C5.9DF51977@snf.stanford.edu> Hello all, I have been notified that Cogen plant will be performing their annual Maintenance on the pumps which supply the cooling for our humidity control in the photo area. The system will be down from 0700 on Friday, 3/1/02, through 1200 on Tuesday, 3/5/02. In addition to this, on Saturday, 3/2/02, from 0700 through 1700, steam heating to the building will be lost. This action will also affect temperature/humidity control. I strongly suggest try to use the YEs oven and spin the resist tonight if you can, other wise only do non critical layers. I apologize for any inconvenience this may cause Mahnaz From shott at snf.stanford.edu Thu Feb 28 23:18:32 2002 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: 1 Mar 2002 07:18:32 -0000 Subject: Coral reboot Message-ID: <20020301071832.1930.qmail@snf.stanford.edu> I just rebooted the Coral servers. It appears as if the "new members can't start COral" but bit us again. We are working hard to track it down but, thus far, it has proved elusive. I apologize for the inconvenience. John