Metal dep help
jreid at silecs.com
Fri Apr 18 16:41:25 PDT 2003
1) Going with a low pressure deposition with high power may at least
get you a decent contact for your geometry (1.8-2.0 mTorr). Keep
the power high.
2) Al reflow during dep above 400C. Ti wetting layer helps.
3) Bias sputtering at Seaway Semiconductor in Livermore (www.seawaysemi.com)
or UHV Sputtering in San Jose.
4) If you want to go the CVD route, Seaway can again help. Go with
a sputtered TiN or Ti/TiN liner followed by CVD W deposition.
> From: "Anthony Flannery" <afflannery at attbi.com>
> Reply-To: "Anthony Flannery" <afflannery at attbi.com>
> Date: Fri, 18 Apr 2003 10:57:40 -0700
> To: "Rajesh Gupta" <rajesh at t-ram.com>, <labmembers at snf.stanford.edu>
> Subject: Re: Metal dep help
> I had good step coverage results with Al using a heavy DC bias sputter
> deposition at Lance Goddard. If you mention me he will remember what he did.
> They have to reconfigure a machine to do the dep so the turnaround can take
> a week to 10 days based on their current work flow. In order to prevent
> surface damage, I had him hold the DC bias until the first 50 nm had been
> Good luck
> Tony Flannery
> ----- Original Message -----
> From: "Rajesh Gupta" <rajesh at t-ram.com>
> To: <labmembers at snf.stanford.edu>
> Sent: Friday, April 18, 2003 10:12 AM
> Subject: Metal dep help
> I am having step coverage issues for my metal deposition (Al-Si) over
> contact openings 0.4um width and height.(vertical side-walls). Resulting in
> open contacts.
> Does anyone know of an outside source that can do some CVD type of metal
> deposition on 4inch wafers(Ex. Ti, TiW, or W)?
> Any suggestions on how I could resolve this problem, either with SNF
> equipment or outside vendor?
> I will verymuch appreciate your help/suggestions. Thanks in advance.
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