responses on thermal stress

Ke Wang curlwang at stanford.edu
Thu Aug 5 14:33:58 PDT 2004


Hello All,

I sent out an email asking about multi-layer thin film thickness
and thermal stress. Thanks for all the responses! Here's a summary of what
I got.

Resources:

Z.Q. Jiang et al., Thermal Stresses in Layered Electronic Assemblies. ASME
J. of Electronic Packaging, Vol 119(1997), pp.127-132.

Microsystem design" writen by Stephen D. Senturia, Kluwer Academic
Publishers. " Part III"

MSE 353 (Mechanical properties of thin films) and MSE 352 (thin film
stress analysis) class notes

Ideas/Experiences:

-Use formula t1*s1+t2*s2+t3*s3+...=0 (t: film thickness; s: stress) to
design stress compensated film stack;

-the stress of each film is linearly proportion to the thickness

-room temperature depositions

Hope this would be useful to your research!

Ke

_____________________________________________
Ke Wang
PHD Candidate
Department of Applied Physics, Stanford University

CISX B113-14
Stanford, CA 94305-4070

Phone: (650)723-8040












More information about the labmembers mailing list