responses on thermal stress
curlwang at stanford.edu
Thu Aug 5 14:33:58 PDT 2004
I sent out an email asking about multi-layer thin film thickness
and thermal stress. Thanks for all the responses! Here's a summary of what
Z.Q. Jiang et al., Thermal Stresses in Layered Electronic Assemblies. ASME
J. of Electronic Packaging, Vol 119(1997), pp.127-132.
Microsystem design" writen by Stephen D. Senturia, Kluwer Academic
Publishers. " Part III"
MSE 353 (Mechanical properties of thin films) and MSE 352 (thin film
stress analysis) class notes
-Use formula t1*s1+t2*s2+t3*s3+...=0 (t: film thickness; s: stress) to
design stress compensated film stack;
-the stress of each film is linearly proportion to the thickness
-room temperature depositions
Hope this would be useful to your research!
Department of Applied Physics, Stanford University
Stanford, CA 94305-4070
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