thickness vs. thermal expansion match

Yahong Yao yy7343 at hotmail.com
Thu Jul 29 09:27:22 PDT 2004


Hi Ke,

Please take a look at the book "Microsystem design" writen by Stephen D. 
Senturia, Kluwer Academic Publishers. " Part III" of the book can give you 
some hint.

Hope it helps.

Yahong



>From: Ke Wang <curlwang at stanford.edu>
>To: labmembers at snf.stanford.edu
>Subject: thickness vs. thermal expansion match
>Date: Wed, 28 Jul 2004 17:05:17 -0700 (PDT)
>
>Hello labmembers,
>
>This is probably a fab 101 question. I'm depositing a stack of films
>(poly, oxide, nitride), and I wish to have their thermal expansion
>coefficients matched, thus minimizing the stress. I know the relative
>proportions of film thickness will be critical. But the question is, how
>to actually calculate that? Or is it entirely empirical?
>Thanks a lot!
>
>Ke
>
>_____________________________________________
>Ke Wang
>PHD Candidate
>Department of Applied Physics, Stanford University
>
>CISX B113-14
>Stanford, CA 94305-4070
>
>Phone: (650)723-8040
>
>
>

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