Nano Interconnect Technology Seminar

Jim McVittie mcvittie at snf.stanford.edu
Mon Jun 7 10:42:40 PDT 2004


Special Seminar

Thursday, June 10, 2004
11:00 AM
CISX 338

Nano Interconnect Technology - Looking at the End of the Roadmap
Werner Pamler, Infineon Technologies, Corporate Research, Munich,
Germany

Moving along the International Roadmap of Semiconductors we will be
facing a series of severe challenges: keeping the resistivities small in
spite of size effects, lowering the dielectric constant of insulators,
and reducing the thickness of diffusion barriers. The nano-interconnects
group at Infineon Corporate Research has the task to assess these
challenges. This presentation will give an overview of these activities.
Emphasis will be placed upon air gap technology where selective ozone /
TEOS deposition may overcome some of the drawbacks of other approaches.

This presentation is a NSF/SRC Engineering Research Center for
Environmentally Benign Semiconductor Manufacturing TeleSeminar. The
slides will be posted to ERC's website prior to the seminar
(http://www.erc.arizona.edu) >>>> follow the Weekly Seminars link for
current presentation.


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