Etching small features in Si
Rohan D. Kekatpure
rohank at stanford.edu
Tue Nov 2 13:07:18 PST 2004
I am trying to etch ~ 200-250nm wide trenches in Silicon with an aspect
ratio of about 1:2 to 1:3. I have an oxide hard mask and it is not critical
that I stop perfectly on some material (eg., oxide etc). About 5 degrees
tilt in the sidewalls is also tolerable. I am looking for a first order
guess on what chemistry (Fluorine, Chlorine, SF6 etc) to use and which
instrument would be best suited for this purpose.
Thank you in advance!
More information about the labmembers