Local AVS Symposium on CMP, Thin Films & Plasma Etch

Jim McVittie mcvittie at snf.stanford.edu
Fri Oct 8 12:58:32 PDT 2004

The Local Chapter of the American Vaccuumm Society (AVS) is having three
one day symposiums next week in San Jose at the San Jose DoubleTree
Hotel.  The one day registration is $175, two day is $300 and all three
days are $400.

Oct 13   Annual CMP group symposium

Oct 14 Annual CMP group symposium

Oct 15 PEUG Annual Symposium "Challenges for the 65 nm Node"
8:30 - 9:10  "Nanoelectronic Materials and Devices beyond CMOS Scaling"
Yoshio Nishi, Stanford Nanofabrication Facility

9:10 - 9:50  "FEOL Challenges For The 65nm Node"
Ravindre Kapre, Cypress Semiconductor

9:50 - 10:30  "Front End Technology Direction at 65nm Node and Beyond"
Mohammad Mirabedini, LSI Logic

10:30 - 10:50  Break

10:50 - 11:30  "65nm and Beyond: Advanced Plasma Etching Technology"
Timothy Dalton, IBM

11:30 - 12:10  "Dual damascene porous ultra low-k etch development"
Ricky McGowan, Sematech

12:10 - 1:20  Lunch

1:20 - 2:00  "The Impact of New Process Control on Etch Limited Yield"
Kevin Monahan, KLA/Tencor

2:00 - 2:40  "Addressing Technology, Productivity, and Cost Challenges
of Post Etch Dry Processing for 65nm and Below Technology Nodes"
Hongching Shan, Mattson

2:40 - 3:00  "Tool and wafer level data for process optimization using
integrated metrology and in-situ sensors"
Andy Skumanich, Matt Davis, David Mui, John Yamartino, Applied Materials

3:00 - 3:20  "Study on Plasma Induced Damaged in High-Density
Plasma--For 65/90nm Technology Nodes"
Hanming Wu, David Gao, John Chen, Semiconductor Manufacturing
International Corporation (SMIC)

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