Bump bonding/unpackaged photodiode array

Peter Catrysse pcatryss at stanford.edu
Tue Apr 19 17:59:41 PDT 2005


> Subject: bump bonding/unpackaged photodiode array
> 
> We are building a readout prototype for photodiode arrays in standard CMOS
> 0.18u process and looking for companies who can offer
> 
> 1) bump bonding of photodiode array with a pitch better than 10um (at chip
> level)
> 2) unpackaged photodiode arrays
> 
> The chip consist of an array of 32x6 readout pixels; each pixel is
> 30ux140u
> and the total chip area is 2mmx2mm.
> 
> We appreciate if someone can point us to any company/facility that can
> help
> us in that regard. Please contact Sam Kavusi <skavusi at stanford.edu>.
> 
> Thanks,
> Sam Kavusi
> Research Assistant
> Room 257, Packard Electrical Engineering Building,
> 350 Serra Mall,
> Stanford, CA 94305
> Phone: (650) 725-9696
> Fax: (650) 724-3648
> Research page:
> http://isl.stanford.edu/groups/elgamal/group_research/sam/home_sam.html






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