Ph.D. Oral Examination
Angie McConnell
angela.mcconnell at stanford.edu
Tue Apr 26 13:57:00 PDT 2005
Stanford University Ph.D. Oral Examination
"Thermal Properties of Micro- and Nanoscale Materials"
Angela D. McConnell
Mechanical Engineering Department
Thermosciences Division
Thornton 110
Friday, April 29, 2005
8:00 AM - 9:00 AM
(Refreshments at 7:45 AM)
In the drive to improve the performance of integrated circuits and
microelectromechanical systems (MEMS), device designers have continued to
decrease component dimensions to micrometer and nanometer
lengthscales. However, as devices become smaller, they tend to experience
increased thermal loads due to higher current densities generating heat in
smaller volumes. This results in elevated temperatures that are sufficient
to significantly influence device performance and also adversely affect
long-term reliability and stability. In this way, heat transfer has become
a critical design constraint that limits the performance of modern
electronic devices. Heat transport models with accurate thermal property
data are required to enable designers of integrated circuits and MEMS to
effectively manage heat transfer. This thesis details research into the
thermal properties of two materials at the micro- and nanoscale: thin
polycrystalline silicon films and carbon nanotubes.
Thin doped polycrystalline silicon films are common in MEMS and integrated
circuit applications. Previous studies show that film processing
conditions strongly influence the thermal conductivity by altering the
polysilicon microstructure, but existing thermal conductivity data for
doped polysilicon films in the literature is difficult to quantitatively
compare because relevant microstructural details such as impurity
concentrations and grain sizes and shapes are not reported. The current
study quantifies the relative effects of impurities and grain boundaries on
the thermal conductivity of LPCVD polysilicon films of thickness near 1
micron doped with boron and phosphorus at varying concentrations for a
range of temperatures. Thermal conductivity of the polysilicon films is
measured using Joule heating and electrical resistance thermometry in a
suspended membrane structure. The data shows strongly reduced thermal
conductivity values at all temperatures compared to similarly doped
single-crystal silicon films, indicating that phonon scattering on grain
boundaries is a dominant factor in the polysilicon thermal
resistance. Further analysis using a thermal conductivity model based on
the Boltzmann transport equation reveals that phonon transmission through
the grains is high at low temperatures, leading to large phonon mean free
paths and higher than expected thermal conductivity.
Carbon nanotubes represent a promising area for nanotechnology research and
development due to their high electrical conductivity, tensile strength,
and thermal conductivity. However, it is difficult to extract accurate
properties of an individual single-walled carbon nanotube (SWNT) from the
existing experimental data since most of the measurements are for bulk
specimens comprising multiple nanotubes. In the current study, thermal
conductance of an individual SWNT is measured using AC electrical
resistance thermometry in a MEMS-based device, which comprises a nanotube
bridging two heavily doped, free-standing polysilicon legs. Individual
nanotubes are grown directly on the device using chemical vapor deposition
with iron particles as the growth catalyst. Electrical measurements from
the setup are processed using a steady-periodic model of heat generation
and heat transfer in the structure to compute temperatures, heat fluxes and
thermal properties for the system. The measurement approach is validated
using thin silicon nitride filaments of known thermal conductivity. The
resulting data for an individual SWNT represents the intrinsic conductance
of an isolated nanotube. Comparing this with data for SWNT bundles from
the literature indicates that intertube coupling can decrease the intrinsic
conductance of the constituent nanotubes in a bundle by more than two
orders of magnitude.
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