Adhesion layer question

Morgan Mager mager at stanford.edu
Fri Jul 1 12:15:13 PDT 2005



Hi,
   I have a process where I want to deposit gold contact pads on a silicon
surface, but I can't use Ti or Cr for the adhesion layer. I can't use Ti
because my process subsequently involves a TMAH etch and I've heard that
TMAH attacks Ti. And I can't use Cr because my process later involves
stripping a different Cr layer. Does anyone know of another adhesion
material for Au that isn't attacked by TMAH or chrome etchant? Thanks.

-Morgan



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