Arif Sanli Ergun
sanli at stanford.edu
Tue May 10 11:45:55 PDT 2005
Does anyone have experience with Gold to Aluminum contact.
I'm trying to put gold on Aluminum pads for easier wire bonding.
The Aluminum is deposited with gryphon (100 % Al). Then, I do
lift-off lithography and evaporate Ti/Pt/Au. The lift-off goes very well,
but Ti/Pt/Au does not stick to Al very well: it peels off while trying
to wire-bond. Any ideas why, and how to prevent it?
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