Al/Au contact

Arif Sanli Ergun sanli at stanford.edu
Tue May 10 11:45:55 PDT 2005


Hi labmembers,
Does anyone have experience with Gold to Aluminum contact.
I'm trying to put gold on Aluminum pads for easier wire bonding.
The Aluminum is deposited with gryphon (100 % Al). Then, I do
lift-off lithography and evaporate Ti/Pt/Au. The lift-off goes very well,
but Ti/Pt/Au does not stick to Al very well: it peels off while trying
to wire-bond.  Any ideas why, and how to prevent it?

Sanli





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