mvikram at stanford.edu
Sat May 14 09:46:57 PDT 2005
I am trying to pattern gold on silicon with a lift-off process. I have features etched in my wafer varying between 15-50 mic deep. When I try to spin LOL2000 after HMDS prime, I notice that I dont get a conformal coating on the devices.
I had a similar problem with PR earlier and eventually found I needed to have atleast 7 mic resist to prevent it from running off the trenches.
Has anyone seen this problem or has any recommendations? Any inputs will be greatly appreciated.
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