FW: Tuesday Sept. 27th IEEE MEMS event at CISX

zhi liu zhiliu at stanford.edu
Sun Sep 25 22:32:02 PDT 2005


 

 

---------------------------------------------------------

IEEE WIE and the Nanotech Council present

MEMS

Micro Electro Mechanical Systems

Guest speakers: Alissa Fitzgerald, Ph.D., & Anthony Flannery, Ph. D.


This unique talk will cover the following: 

*	A gentle introduction to MEMS (MEMS primer for those new to the
field) 

*	An in depth talk about a specific MEMS application:  Large-scale
Integrated Mirror Array for Optical Communications

 

Driven by the dot-com era need for communications bandwidth, Micro-Optical
Electrical Mechanical Systems (MOEMS) promised new advantages for
telecommunication companies. While market conditions caused many of the
ventures in this area to fall short of investor expectations, many new
advances were made in the area of MEMS fabrication and design during the
optical MEMS bubble. Presented here is the large-scale integration of
electronics with MOEMS mirrors. A novel design was conceived in which
integrated electronics driving 1200 mirrors dissipate only 2W, or under 400
µW for each electrode. The process includes a novel bulk micromachining
process and electronic integration through wafer bonding.

 


When:

September 27, 2005
6: 00 to 8:30 PM


Donation:

This event is FREE.  You do not need to be a member to attend.  Donations
are welcome to help cover refreshment costs. Please RSVP to k.chin at ieee.org.


Agenda:

6:00-6:30 pm networking and refreshments
6:30-7:15 pm Intro/Prime!

 r on 

 MEMS, Alissa Fitzgerald of  A. M. Fitzgerald & Associates

7:30-8:15 pm Large-scale Integrated Mirror Array for Optical Communications,
Anthony Flannery of Invensense


Where:

Stanford University's CISX Auditorium (Center for Integrated Systems
Extension)
Directions at:   <http://www-cis.stanford.edu/misc/directions.html>
http://www-cis.stanford.edu/misc/directions.html

About the speakers:


Anthony F. Flannery Jr.

Mr. Flannery received his B.A. in chemistry from Princeton University. He
received his MSEE at Stanford University. At Stanford his research focused
on the development of PECVD silicon carbide for environmentally hardened
chemical and pressure sensors. Other significant accomplishments include the
use of dry film lithography for non-planar substrates, stress control in
deposited films. and laser ablation for patte! ! rning on MEMS substrates.

In June of 2003 he joined the founding team of Invensense. Invensense
successfully raised $8 million in April of 2004. As Director of Development,
he was co-inventor of a novel silicon bulk micromachining process which
included a hermetic seal achieved by wafer bonding with a custom ASIC.
Prior to Invensense, he was with Transparent Networks where he managed the
successful development of the world’s largest integrated mirror array for
optical communications. 

 

Alissa Fitzgerald

As the founder of A. M. Fitzgerald & Associates, Alissa Fitzgerald provides
technical consulting services to clients ranging from one-person start-ups
to companies in the Fortune 500.  Her areas of expertise include mechanical
design and analysis for advanced applications; sensor systems; MEMS design
and fabrication; materials science; and reliability testing. She has worked
on projects as diverse as MEMS sensors for spacecraft and medical
applications, condition-based maintenance systems for military helicopters,
and the study of hot electron injection into PECVD dielectrics. 

She has been employed by the Jet Propulsion Laboratory, Orbital Sciences
Corporation, Signal Processing Associates, and Sensant Corporation. Dr.
Fitzgerald received her bachelor and master degrees from the Massachusetts
Institute of Technology and her doctorate from Stanford University.

Dr. Fitzgerald has numerous journal publications and holds two patents.  She
is a member of the American Society of Mechanical Engineers and the
Materials Research Society and has been a reviewer for the Journal of
MicroElectroMechanical Systems, Sensors & Actuators: A, and the Materials
Research Society Symposium Proceedings.

For more info see website at:  http://ewh.ieee.org/r6/scv/wie/ 

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