Help: wafer bonding
ndhuang at stanford.edu
Mon Jan 23 10:54:01 PST 2006
We have some concerns regarding wafer metal-metal bonding. Does anyone
have experience of Au-Au or Au-Al bonding, or Au containing eutectic bond?
We are interested to keep the pressure and temperature down, since we have
Au fine-structures in the order of 10 um that we don't want to collapse.
In particular we are interested in a bonding recepie file for Au-? that
presumaby worked for someone, such that we don't have to start editing one
All suggestions are greatly appreciated.
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