Wafer Diameter Reduction Service?

[Mary Tang]

Hi Jon, et al --

I'm afraid I don't know specific service, but know many people do this, 
so you should have responses (and if anyone wants to share them, please 
send them to me and I'll post them on the website.)

But that said, one item that has been on our SNF equipment wishlist is 
the Microjet Laser Cutter, by Synova (http://www.synova.ch).  This nifty 
tool should be able to do this, and we've been told has been used to cut 
channels of specific depth and drill holes in silicon and glass.  It 
would be really great to use as a wafer scriber as well.  We've also 
been told that it's reasonably priced (whatever that means, in the 
microelectronics market.)  They've just opened a local facility, 
probably for demos.

Does anyone have experience with this or similar tools?  If anyone is 
interested in exploring the technical capabilities of this system into 
this on behalf of SNF, let us know (we've never seen this, only heard 
about it).  (Better yet, if someone has got some funding burning a hole 
in their pocket and is interested in this tool...  we'd definitely want 
to talk!)

Mary



-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu



Jonathan Edgar Roth wrote:
> Hi,
> Do any of you know of any companies that might be able to reduce the
> diameter of wafers, for example, cutting an 8" wafer down to two 4" wafers?
>  I'd appreciate any leads.
> Thanks,
> Jon
>