Wafer Diameter Reduction Service?

Parker, Sherwood sher at slac.stanford.edu
Fri Oct 20 17:55:19 PDT 2006

I can give you many references for laser drilling of HOLES in silicon wafers.  Two are Nucl. Instr. and Meth. A 513, p 345 (brief comment) and 504, p 149.  Many of the same considerations probably will apply to trenches, including the preliminary coating of the wafer with photoresist to protect it from molten etch products falling back.  If you are trying to make smaller wafers out of larger ones, you would still have the possible task of edge shaping.
Sherwood Parker


From: Mary Tang [mailto:mtang at stanford.edu]
Sent: Fri 10/20/2006 5:14 PM
To: Jonathan Edgar Roth; labmembers at snf.stanford.edu
Subject: Re: Wafer Diameter Reduction Service?

Hi Jon, et al --

I'm afraid I don't know specific service, but know many people do this,
so you should have responses (and if anyone wants to share them, please
send them to me and I'll post them on the website.)

But that said, one item that has been on our SNF equipment wishlist is
the Microjet Laser Cutter, by Synova (http://www.synova.ch).  This nifty
tool should be able to do this, and we've been told has been used to cut
channels of specific depth and drill holes in silicon and glass.  It
would be really great to use as a wafer scriber as well.  We've also
been told that it's reasonably priced (whatever that means, in the
microelectronics market.)  They've just opened a local facility,
probably for demos.

Does anyone have experience with this or similar tools?  If anyone is
interested in exploring the technical capabilities of this system into
this on behalf of SNF, let us know (we've never seen this, only heard
about it).  (Better yet, if someone has got some funding burning a hole
in their pocket and is interested in this tool...  we'd definitely want
to talk!)


Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
mtang at stanford.edu

Jonathan Edgar Roth wrote:
> Hi,
> Do any of you know of any companies that might be able to reduce the
> diameter of wafers, for example, cutting an 8" wafer down to two 4" wafers?
>  I'd appreciate any leads.
> Thanks,
> Jon

More information about the labmembers mailing list