From edmyers at stanford.edu Fri Sep 1 10:08:09 2006 From: edmyers at stanford.edu (Ed Myers) Date: Fri, 01 Sep 2006 10:08:09 -0700 Subject: Annual Lab Equipment Survey Message-ID: <6.2.5.6.2.20060901093701.0364cd10@stanford.edu> Labmembers, As SNF closes out the fiscal year and plans for the upcoming year, the question of equipment planning arises. During the past year the following equipment activities occurred. 1) A new Xenon Difluoride (XeF2) etcher was purchased by the faculty and installed. 2) A second PQuest was purchased. 3) A STS320 chlorine/fluorine parallel plate etcher capable of etching 6" wafers was received through donation. 4) A Spectral Ellipsometer was funded through an equipment grant. The PO has been placed and we are anticipating delivery in early November. . 5) Facilitated of the AMAT epi reactor and AMAT is in the middle of starting up the system. 6) Thermco Bank 2 was facilitated and maintenance is busy configuring the gas jungle and logic boards. 7) A 150mm process kit was purchased for STSetch2 through a donation. 8) Ge was plumbed to Thermco Bank 1 and Bank 2 to expand our SiGe deposition capability. 9) The Ellipsometer, Dektak's, Alpha Step and Sonogauge were rebuilt. 10) Wet Benches were rebuilt with water conserving dump rinse units and fire retardant deck surfaces. 11) RTP operating systems updated yielding better temperature control. 12) One replacement fire retardant wet benches and one solvent bench were received through donation. 13) Wbgen2 was installed. 14) Hitachi e-beam received extensive service. The question is what do the users feel should we focus on for the upcoming year. Please respond to Ed Myers (edmyers at stanford.edu) with your top 5 equipment needs, along with a couple of supporting sentences by Friday Sept. 15th. Your requests will be compiled and presented at the next Advisory Committee meeting. Thanks, Ed Myers The following list of equipment is from last years meeting. You might find the list useful in reminding you of some earlier equipment request. During the past year the facility has obtained the XF2 etcher, Spectral Ellipsometer and contact angle measurement tool. We just missed out on a new piece AFM when our top rated MRI proposal was passed over. NEW TECHNOLOGY 1) xenon difluoride Si etch -Installed and in use or highly selective, isotropic etching of Si. 2) deep dielectric etcher -for fast, anisotropic etching - such as optical elements in quartz 3) single wafer wet etch spinner -for experimenting with new clean chemistries (i.e., HBr, HI), small/unusual-sized substrates, non-silicon/CMOS substrates (without concerns of cross-contamination). 4) chemically assisted ion beam miller -chlorine assisted ion beam milling for GaAS and other materials were we don't have RIE capability. 5) microject laser cutting -for wafer cutting and scribing. Could be used for: inscribing unique identifyers on wafers, cutting out 4" substrates from large 8" rounds, cutting microchannels. Lateral line resolution is said to be on the order of 50 microns. 6) ion miller -for precession sputter etching of materials were we don't have RIE capability. Similar to item #4, the CAIBE system without any chemical assisted milling. 7) ion beam deposition of single or multicomponent insulating materials -Provides the ability to deposit materials such as quartz, silicon, silicon dioxide and silicon nitride. 8) light scattering z-potential -for measuring size distribution and surface charge of nano- and micro- particles in solution. 9) contact angle measurement -Recently purchased and currently is being set up. Useful in determining the level of surface cleanliness and phobicity of surfaces. 10) silane PECVD for poly Si, amorphous, Si3N4 - 11) post-cmp clean system 12) multiple film stack metrology -PO has been issued for a spectral ellipsometer which we has an early November delivery. 13) Ultratech flash laser anneal -For crystallization and annealing of films such as amorphous Si layers. 14) ALD for high k on III-V or silicon 15) temperature/bias CV tester -test station 16) deep chlorine etcher for GaAs 17) A second e-beam evaporator REPLACEMENT EQUIPMENT 1) electron beam lithography 2) wafer saw -Bringing in an outside service for extensive maintenance complaints on this tool dropped drastically during the past year. 3) parametric tester 4) modern AFM for pieces 5) new maskmaking machine OTHER 1) AMT epi installation -Facilities have been completed and the tool is being started up by AMAT. We are hopeful the system will be available later this year. 2) tungsten CVD modifications/install (existing system) -Tool was removed to make room for the XeF2 system. MISCELLANEOUS 1) 6" one of a kind tool set (drie, deposited oxide) -When installed, the STS320 etcher will be the last piece of equipment to provide all process modules for 6" wafers. 2) 6" reactive ion etcher -Received a donation of an STS320 parallel plate etch system with both chlorine and fluorine capbility. 3) 6" poly etcher (Lam) 4) 6" Lam 480/490 multipurpose etcher 5) high pressure vapor deposition -for deposition of materials with vapor pressures higher than indium. From juanita.n.kurtin at intel.com Fri Sep 1 10:32:08 2006 From: juanita.n.kurtin at intel.com (Kurtin, Juanita N) Date: Fri, 1 Sep 2006 10:32:08 -0700 Subject: FW: Registration for GCEP Symposium ends September 8 Message-ID: <8BFFB719F0BB6B45864B25B35257F2D19B421D@orsmsx415.amr.corp.intel.com> For anyone interested in energy research... ________________________________ From: gcepevents-bounces at lists.stanford.edu [mailto:gcepevents-bounces at lists.stanford.edu] On Behalf Of GCEP Events Sent: Friday, September 01, 2006 10:18 AM To: gcepevents at lists.Stanford.EDU; gcep_faculty_by_school at lists.Stanford.EDU; gcep_pi_external at lists.Stanford.EDU Subject: Registration for GCEP Symposium ends September 8 REMINDER: Registration ends on Friday, September 8. Register now at http://gcep.stanford.edu/symposium. Developments in Fundamental Research Towards Reducing Greenhouse Gas Emissions from Energy Systems September 18-20, 2006 Frances C. Arrillaga Alumni Center Stanford University The Global Climate and Energy Project (GCEP) will hold its second energy research symposium featuring well-known speakers and leading researchers from Stanford and around the world. The three-day event is intended to provide a forum for the discussion of scientific results and developments that may lead to energy technologies with significantly reduced greenhouse gas emissions. Both GCEP-funded and outside investigators will give presentations highlighting the results of their innovative research. Several poster sessions will also be held to allow all GCEP investigators and their graduate students to provide details of their work. The keynote speaker will be Dr. Steve Chu, Director of the Lawrence Berkeley National Laboratory and 1997 winner of the Nobel Prize in Physics. His keynote address will open a session that will include presentations from Stanford and outside experts intended to set the stage for the meeting by providing an overall perspective of the background to the technical talks given during the conference. The agenda will cover the following topic areas: Monday, September 18 Morning - Global Energy Context Afternoon - Solar Energy Tuesday, September 19 Morning - Bioenergy Storage and Conversion Afternoon - Advanced Materials and Catalysts Wednesday, September 20 Morning - Carbon Mitigation, Capture, and Separation Afternoon - Carbon Storage The symposium is free and open to the Stanford community and other researchers and energy professionals. All attendees must register for the meeting by Friday, September 8, 2006. To register, please visit the symposium website at http://gcep.stanford.edu/symposium. Please contact Lauren Allan-Vail at (650) 724-6740 or gcepevents at stanford.edu if you have any questions or need more information. We look forward to seeing you at this event. Thank you. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- An embedded and charset-unspecified text was scrubbed... Name: ATT1278268.txt URL: From mtang at stanford.edu Tue Sep 5 09:31:54 2006 From: mtang at stanford.edu (Mary Tang) Date: Tue, 05 Sep 2006 09:31:54 -0700 Subject: Reminder: Enterprise Forum, 9/7/06 Message-ID: <44FDA67A.2050200@stanford.edu> Greetings labmembers -- Just a reminder that the first "Enterprise Forum", featuring Tallwood Ventures, will be held Thursday, at 11 am in the CISX Auditorium. This will be the first in series of such events facilitating information exchange and networking opportunities between the lab community and our SNF Affiliates. >From 11-12, will be a presentation about Tallwood, followed by an open Q&A session with its founder and some of its principals. From 12-1 will be lunch, breakout sessions, and opportunities for one-on-ones. Lunch will be provided for preregistrants. For more information about this Enterprise Forum, see http://snf.stanford.edu/Labmembers/Seminar.html Anyone with an interest in high tech business is welcome to attend. Please forward this invitation to labmates, friends, and acquaintances. -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mbaran at stanford.edu Tue Sep 5 16:12:09 2006 From: mbaran at stanford.edu (Maureen Baran) Date: Tue, 5 Sep 2006 16:12:09 -0700 Subject: Updating Temporary Access Cards to the CIS Building Message-ID: <20060905231210.210D14C448@smtp2.stanford.edu> Dear Labmembers, I am in the process of updating our Temporary Access Cards for the CIS building which contains the SNF lab, the Computer Lab 220, RF Lab Room 219 and the Testing Room 152. A temporary access card has a picture of the Stanford Campus on it, along with a 9 digit number that starts with 79000XXXX. If you have one of these cards please send me your card number, your name, the name of your company and what lab you have access to. If you are a student with a temporary access card please send me your number, your name, the name of your professor that you are working with and what lab you have access to. If I don't hear from you by the close of business on Tuesday, September 12th, your temporary access card will be deleted from the system and your privileges to use this building after business hours will be denied. Thank you in advance for taking the time to look into this matter. Sincerely, Maureen Maureen Baran Stanford Nanofabrication Facility Lab Services Administrator mbaran at stanford.edu 650-725-3664 -------------- next part -------------- An HTML attachment was scrubbed... URL: From lqs at cmsloans.com Thu Sep 14 03:08:18 2006 From: lqs at cmsloans.com (Richard Suarez) Date: Thu, 14 Sep 2006 12:08:18 +0200 Subject: zoo authentically Message-ID: <001a01c6d7e6$bc9159c7$48b8a150@ejjlaw.uk> Pat ran about from plot to plot and kissed everything. Why, yer great-great-grandmother, Old Mrs. Oh, Judy, she said the pink curtains in the Big Parlour were fadedand shabby. And dont be saying a word toinny one about this business av the parsley bed. Pat, after a rapturous kiss for mother, tip-toed over to thecradle, trembling with excitement. Pat found it hard to be reconciled to it. Old Tom Drinkwine shuffled up here and asked me to be hisfourth missus, so he did. She skipped along the lane, light-hearted again, eating herraisins. Sure and didnt I have the fine proposal the othernight. Pat, after a rapturous kiss for mother, tip-toed over to thecradle, trembling with excitement. Well, it dobe yer dads turn for a fact, and Rachel is a better name thanGreta inny day. One disgracelike that was enough in a family. Sure and we know how to trate fairies at Silver Bush. Pat had nomemory of ever having been up before sunrise in her life. Innyhow, its tonight or niver widthat moon. He says helikes a quiet life and I do, too. You would have to get up before you went to bed if youmeant to get ahead of Judy. Theres no knowing what bad luck we might be having if we forgotit. Yell not be intinding to put the swate wee cratur ina basket? To be away from Silver Bush foreight hours five days out of every week was a tragedy to her. Pat had nomemory of ever having been up before sunrise in her life. They liked her much better in her old drugget but Judy tastedher day of state. Oh, oh, and well you know it is, said Judy. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: nostalgia.gif Type: image/gif Size: 13606 bytes Desc: not available URL: From edmyers at stanford.edu Mon Sep 11 12:47:08 2006 From: edmyers at stanford.edu (Ed Myers) Date: Mon, 11 Sep 2006 12:47:08 -0700 Subject: Fwd: Annual Lab Equipment Survey Message-ID: <6.2.5.6.2.20060911124024.02798cd0@stanford.edu> Labmembers, This is a reminder to send in your equipment request/suggestions for the next year. So far the response rate has been extremely low. Don't let the vocal few, over shadow the voices of many. Please respond to edmyers at stanford.edu or simply hit the reply button (not the reply all button). Thanks, Ed >Date: Fri, 01 Sep 2006 10:08:09 -0700 >To: Labmembers at snf.stanford.edu >From: Ed Myers >Subject: Annual Lab Equipment Survey > >Labmembers, > >As SNF closes out the fiscal year and plans for the upcoming year, >the question of equipment planning arises. During the past year the >following equipment activities occurred. > >1) A new Xenon Difluoride (XeF2) etcher was purchased by the faculty >and installed. >2) A second PQuest was purchased. >3) A STS320 chlorine/fluorine parallel plate etcher capable of >etching 6" wafers was received through donation. >4) A Spectral Ellipsometer was funded through an equipment >grant. The PO has been placed and we are anticipating delivery in >early November. . >5) Facilitated of the AMAT epi reactor and AMAT is in the middle of >starting up the system. >6) Thermco Bank 2 was facilitated and maintenance is busy >configuring the gas jungle and logic boards. >7) A 150mm process kit was purchased for STSetch2 through a donation. >8) Ge was plumbed to Thermco Bank 1 and Bank 2 to expand our SiGe >deposition capability. >9) The Ellipsometer, Dektak's, Alpha Step and Sonogauge were rebuilt. >10) Wet Benches were rebuilt with water conserving dump rinse units >and fire retardant deck surfaces. >11) RTP operating systems updated yielding better temperature control. >12) One replacement fire retardant wet benches and one solvent bench >were received through donation. >13) Wbgen2 was installed. >14) Hitachi e-beam received extensive service. > >The question is what do the users feel should we focus on for the >upcoming year. Please respond to Ed Myers (edmyers at stanford.edu) >with your top 5 equipment needs, along with a couple of supporting >sentences by Friday Sept. 15th. Your requests will be compiled and >presented at the next Advisory Committee meeting. > >Thanks, >Ed Myers > >The following list of equipment is from last years meeting. You >might find the list useful in reminding you of some earlier >equipment request. During the past year the facility has obtained >the XF2 etcher, Spectral Ellipsometer and contact angle measurement >tool. We just missed out on a new piece AFM when our top rated MRI >proposal was passed over. > >NEW TECHNOLOGY >1) xenon difluoride Si etch -Installed and in use or highly >selective, isotropic etching of Si. >2) deep dielectric etcher -for fast, anisotropic etching - such as >optical elements in quartz >3) single wafer wet etch spinner -for experimenting with new clean >chemistries (i.e., HBr, HI), small/unusual-sized substrates, >non-silicon/CMOS substrates (without concerns of cross-contamination). >4) chemically assisted ion beam miller -chlorine assisted ion beam >milling for GaAS and other materials were we don't have RIE capability. >5) microject laser cutting -for wafer cutting and scribing. Could >be used for: inscribing unique identifyers on wafers, cutting out >4" substrates from large 8" rounds, cutting microchannels. Lateral >line resolution is said to be on the order of 50 microns. >6) ion miller -for precession sputter etching of materials were we >don't have RIE capability. Similar to item #4, the CAIBE system >without any chemical assisted milling. >7) ion beam deposition of single or multicomponent insulating >materials -Provides the ability to deposit materials such as quartz, >silicon, silicon dioxide and silicon nitride. >8) light scattering z-potential -for measuring size distribution and >surface charge of nano- and micro- particles in solution. >9) contact angle measurement -Recently purchased and currently is >being set up. Useful in determining the level of surface >cleanliness and phobicity of surfaces. >10) silane PECVD for poly Si, amorphous, Si3N4 - >11) post-cmp clean system >12) multiple film stack metrology -PO has been issued for a spectral >ellipsometer which we has an early November delivery. >13) Ultratech flash laser anneal -For crystallization and annealing >of films such as amorphous Si layers. >14) ALD for high k on III-V or silicon >15) temperature/bias CV tester -test station >16) deep chlorine etcher for GaAs >17) A second e-beam evaporator > >REPLACEMENT EQUIPMENT >1) electron beam lithography >2) wafer saw -Bringing in an outside service for extensive >maintenance complaints on this tool dropped drastically during the past year. >3) parametric tester >4) modern AFM for pieces >5) new maskmaking machine > >OTHER >1) AMT epi installation -Facilities have been completed and the tool >is being started up by AMAT. We are hopeful the system will be >available later this year. >2) tungsten CVD modifications/install (existing system) -Tool was >removed to make room for the XeF2 system. > >MISCELLANEOUS >1) 6" one of a kind tool set (drie, deposited oxide) -When >installed, the STS320 etcher will be the last piece of equipment to >provide all process modules for 6" wafers. >2) 6" reactive ion etcher -Received a donation of an STS320 parallel >plate etch system with both chlorine and fluorine capbility. >3) 6" poly etcher (Lam) >4) 6" Lam 480/490 multipurpose etcher >5) high pressure vapor deposition -for deposition of materials with >vapor pressures higher than indium. From mbaran at stanford.edu Tue Sep 12 14:52:31 2006 From: mbaran at stanford.edu (Maureen Baran) Date: Tue, 12 Sep 2006 14:52:31 -0700 Subject: Last Call for Temporary Access Card #s to CIS and the Lab (79000XXXX) Message-ID: <20060912215231.8292B4C5B6@smtp2.stanford.edu> Dear Labmembers, This is a gentle reminder that if you have a Temporary Access Card to the CIS building and to the Lab and you haven't responded to my original note that went out on the 5th of September - please do so. I have replied to everyone that has sent me their Access Card # so, if I haven't received a reply note from me then, you haven't sent me your Temporary Access Card number yet. I will be deleting all 79000XXXX cards that have not been updated in the last week as of the close of today. Again, if you have received a reply note from me regarding your card update, please do not send me your number again. Thank you again for all that helped me complete this update on the temporary card. Sincerely, Maureen Maureen Baran Stanford Nanofabrication Facility Lab Services Administrator mbaran at stanford.edu 650-725-3664 -------------- next part -------------- An HTML attachment was scrubbed... URL: From ehkim at stanford.edu Tue Sep 12 16:18:04 2006 From: ehkim at stanford.edu (Eun-Ha Kim) Date: Tue, 12 Sep 2006 16:18:04 -0700 Subject: University Ph.D. Dissertation Defense (September 15th) - Eun-Ha Kim Message-ID: <00f101c6d6c1$b2ad6ca0$316340ab@eunha> Stanford University Ph.D. Dissertation Defense Low Resistance Contacts to Laser Annealed Junctions for Nano-scaled Devices Eun-Ha Kim Department of Materials Science and Engineering, Stanford University Thesis Advisor: Prof. James D. Plummer Date: Friday, September 15th, 2006 Time: 3:00 pm (Refreshments served at 2:45 pm) Location: Packard 101, Stanford University, CA 94305 As MOS devices scale down to smaller dimensions, contact resistance will dominate the overall series resistance associated with current flow from source to drain. This thesis research has concentrated on issues of reducing the contact resistance, which include contact resistance measurement, contact material formation, and methods to increase doping concentration in silicon. By performing two dimensional current flow simulations, we have found that the common structures do not ensure accuracy in extracting contact resistivities from measured contact resistances, due to parasitic and intrinsic current crowding. In order to accurately extract contact resistivities for this study, the transmission line structure was modified by etching the silicide to avoid the sidewall contact contribution. As a contact material to silicon, nickel silicide (NiSi) has become our choice because it forms at temperatures as low as 400 degrees C with small silicon consumption. We have investigated the reaction between 10 nm-thick Ni films and Si substrates. By performing rapid thermal anneals (RTA) at temperatures from 270 to 400 degrees C, we have observed the formation of Ni2Si and its transformation into the low resistivity phase of NiSi. Compared two RTA schemes of spike and soak in terms of the effective time, the spike anneals, which can be performed at higher temperatures with shortened anneal time, show reduced effective times for Ni diffusion. This suggests that spike anneals can improve junction characteristics while maintaining low resistance silicide films in the source/drain region. The use of millisecond laser annealing has been investigated in this work. Low contact resistivities between 5 10-8 and 10-7 ohm-cm2 have been demonstrated on NiSi contacts to the laser annealed silicon, while a limit at 10-7 ohm-cm2 was noticed from the RTA samples. The obtained contact resistivities below 10-7 ohm-cm2 represent that active concentrations above the solubility limit (2 1020 /cm3) were achieved at the contact interface by the laser. Because of the ability to form NiSi contacts at low temperatures, it appears that supersaturated dopings maintain active and thus reduce the contact resistance. The laser annealing technique combined with low temperature NiSi contact formation shows promise in creating low resistance contacts for devices in technology nodes smaller than 45 nm. -------------- next part -------------- An HTML attachment was scrubbed... URL: From katsuo at umich.edu Wed Sep 13 15:55:50 2006 From: katsuo at umich.edu (Katsuo Kurabayashi) Date: Wed, 13 Sep 2006 18:55:50 -0400 Subject: [Fwd: RE: DARPA HI-MEMS: call for postdocs and research scientist] Message-ID: <7.0.1.0.0.20060913185308.045e2ab8@umich.edu> Dear SNF Lab Users: There is a postdoc position available at University of Michigan. Please see the attached. Katsuo Kurabayashi >-----Original Message----- >From: Michel M. Maharbiz [mailto:maharbiz at eecs.umich.edu] Sent: >Monday, September 11, 2006 4:57 PM >To: maharbiz at eecs.umich.edu >Subject: DARPA HI-MEMS: call for postdocs and research scientist > >Colleagues, >Please forward and/or pass this on to interested folks. > >I thought I'd get the word out a bit early that we're hiring >postdocs and a research scientist for the upcoming DARPA HI-MEMS >work at the University of Michigan. Start date should be sometime in >October, so please contact me soon if interested. > >Attached PDF flyer has all the details. > >Thank you! >michel > >-- >********************************* >Michel M. Maharbiz >2406 EECS >EECS Department >University of Michigan, Ann Arbor >Ann Arbor, MI 48109-2122 > >734 - 615 - 4469 (office) >734 - 649 - 0253 (cell) > >maharbiz at eecs.umich.edu > >www.eecs.umich.edu/maharbiz >********************************* ************************************************************* Katsuo Kurabayashi, Ph.D. Associate Professor Department of Mechanical Engineering Department of Electrical Engineering & Computer Science University of Michigan Room 2272 G.G. Brown Lab Ann Arbor, MI 48109-2125 Tel: (734) 615-5211 Fax: (734) 647-3170 e-mail: katsuo at umich.edu Web: http://www-personal.umich.edu/~katsuo *************************************************************** -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Michigan_Positions_DARPA_HIMEMS.pdf Type: application/octet-stream Size: 59732 bytes Desc: not available URL: From shott at stanford.edu Thu Sep 14 09:49:51 2006 From: shott at stanford.edu (John Shott) Date: Thu, 14 Sep 2006 09:49:51 -0700 Subject: Imminent replacement of aging SNF computer ... Message-ID: <4509882F.8030504@stanford.edu> An HTML attachment was scrubbed... URL: From mtang at stanford.edu Thu Sep 14 15:25:28 2006 From: mtang at stanford.edu (Mary Tang) Date: Thu, 14 Sep 2006 15:25:28 -0700 Subject: Invitation to an open discussion: "Training" Message-ID: <4509D6D8.1040109@stanford.edu> Greetings labmembers -- Some concerned lab citizens have initiated a series of discussions with SNF staff about issues which we think may be of general concern to the whole lab... So, we would like to invite you to a discussion about "training" at SNF -- how we can better educate lab and staff members about contamination, cleanroom hygiene, fabrication processing, and just plain, good engineering practices. We hope this will initiate a series of regular discussions where staff and lab members can work together to make this lab a better place to be. This discussion is scheduled for tomorrow (Friday, Sept. 15) at 2 pm in CIS 201. Hope to see you there! Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From sjo at stanford.edu Sun Sep 17 10:47:32 2006 From: sjo at stanford.edu (Sebastian J. Osterfeld) Date: Sun, 17 Sep 2006 10:47:32 -0700 Subject: Tips for drilling holes into Pyrex Wafer? In-Reply-To: <4509D6D8.1040109@stanford.edu> References: <4509D6D8.1040109@stanford.edu> Message-ID: <450D8A34.9060301@stanford.edu> Dear SNF Lab users, I am considering drilling holes into a 4" Pyrex or glass wafer. Last time I checked, doing this in-house wasn't quite feasible. What places can you recommend to have this done? Ideally, the place would: - Have a fast turnaround time - Do single 4" wafers at reasonable cost - Accept some kind of layout file for this job As far as the holes are concerned, I'd go with whatever is available, but ideally: - They'd be around 800 microns in diameter - They'd be flush with the surface within 50 microns (i.e. limited laser rim formation) Thanks! -- Sebastian J. Osterfeld PhD. Student / Shan X. Wang Group Dept. of Materials Science & Engineering From arguicha at stanford.edu Mon Sep 18 12:13:01 2006 From: arguicha at stanford.edu (Alex R. Guichard) Date: Mon, 18 Sep 2006 12:13:01 -0700 Subject: active isolation Message-ID: <450EEFBD.5080301@stanford.edu> Hello all: This is an odd question, but does anyone have an active or passive isolation table (like Table Stable or Minus-K) that they are not using right now? Thanks, Alex -- Alex R. Guichard Ph.D Candidate Dept. of Mat. Sci. and Eng. Stanford University (M)919-434-6906 (F)650-724-9851 (O) 650-723-6352 (L)650-723-6466 I am running a marathon to raise money for Leukemia and Lymphoma research! Support my efforts at: http://www.active.com/donate/tntsvmb/alexg From ahazeghi at stanford.edu Mon Sep 18 14:33:36 2006 From: ahazeghi at stanford.edu (Arash Hazeghi) Date: Mon, 18 Sep 2006 14:33:36 -0700 Subject: Timer Message-ID: Hello, I had a digital timer with my coral login (ahazeghi) printed on the back, the timer has disappeared from my bin since last week, please let me know in case you find it or if you have borrowed it please bring it back. Thank you, Arash ------------------------------------------------------------------------ -- Arash Hazeghi PhD Candidate Stanford Center for Integrated Systems, 420 Via Palou Mall, CIS-X 300 tel: 650-725-0418 mobile: 650-353-1866 http://www.stanford.edu/group/nanoelectronics/index.htm From jwc at snf.stanford.edu Mon Sep 18 17:56:54 2006 From: jwc at snf.stanford.edu (James Conway) Date: Mon, 18 Sep 2006 17:56:54 -0700 Subject: Tips for drilling holes into Pyrex Wafer? In-Reply-To: <450D8A34.9060301@stanford.edu> References: <4509D6D8.1040109@stanford.edu> <450D8A34.9060301@stanford.edu> Message-ID: <450F4056.7000702@snf.stanford.edu> ValleyDesign.com Santa Cruz, CA They can handle all sorts of glass and crystalline wafer fabrication, polishing, and machining task with excellent quality. James Conway SNF CIS 31 8:30 - 9:30 AM daily 650-725-7075 Sebastian J. Osterfeld wrote: > Dear SNF Lab users, > > I am considering drilling holes into a 4" Pyrex or glass wafer. Last > time I checked, doing this in-house wasn't quite feasible. What places > can you recommend to have this done? > > Ideally, the place would: > - Have a fast turnaround time > - Do single 4" wafers at reasonable cost > - Accept some kind of layout file for this job > > As far as the holes are concerned, I'd go with whatever is available, > but ideally: > - They'd be around 800 microns in diameter > - They'd be flush with the surface within 50 microns (i.e. limited > laser rim formation) > > Thanks! > > -------------- next part -------------- An HTML attachment was scrubbed... URL: From mtang at stanford.edu Tue Sep 19 16:22:49 2006 From: mtang at stanford.edu (Mary Tang) Date: Tue, 19 Sep 2006 16:22:49 -0700 Subject: Invitation to an open discussion: "Training" Message-ID: <45107BC9.2010704@stanford.edu> Greetings labmembers -- You are invited to a discussion about "training" at SNF -- how we can better educate lab and staff members about contamination, cleanroom hygiene, fabrication processing, and just plain, good engineering practices. We hope to make this a series of regular discussions where staff and lab members can work together to make this lab a better place to be. The next discussion is scheduled for Friday, Sept. 22 at 3 pm in CIS 201. Hope to see you there! Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From rcrane at stanford.edu Thu Sep 21 11:25:34 2006 From: rcrane at stanford.edu (Dick Crane) Date: Thu, 21 Sep 2006 11:25:34 -0700 Subject: STSetch is up Message-ID: <4512D91E.2080701@stanford.edu> STSetch users: STSetch is now up, operational, qualified and ready for use. The long downtime is over. Hooray. So why did the repair take twelve weeks? Our STSetch is an early version of this tool type and is fairly unique in its component particulars and software. A repair made several years ago had an incorrect configuration which eventually failed and led to additional faults. The additional faults effectively masked the root cause from both our in house maintenance staff and STS' USA field service staff. After many weeks of downtime the problems have been solved by a senior, factory design engineer (BSEE, PhD CSE) who spent a week plus troubleshooting the system. All appears to be in order plus several small problems have been repaired. Sorry the record downtime in completing this repair, Dick From shott at stanford.edu Sat Sep 23 14:55:23 2006 From: shott at stanford.edu (John Shott) Date: Sat, 23 Sep 2006 14:55:23 -0700 Subject: Migration to the new snf hardware is complete. Message-ID: <4515AD4B.9040402@stanford.edu> An HTML attachment was scrubbed... URL: From kimsangb at stanford.edu Sat Sep 23 18:26:30 2006 From: kimsangb at stanford.edu (SangBum Kim) Date: Sat, 23 Sep 2006 18:26:30 -0700 Subject: transparency mask Message-ID: <001201c6df78$76d26f90$a9b50c80@anavel> Dear labmembers, I ordered a Mylar transparency mask from ArtnetPro, which is recommended by snf website (http://snf.stanford.edu/Process/Masks/mylar.html). It works fine, but it seems that there are some stains (2~5um size) on the transparency where it should be clear and those stains actually get patterned on the photoresist. Is there a solution to prevent it from patterning? Should I order different type transparency paper? Can I out-focus the small stains which are much smaller than the actual pattern (~850um)? Thanks, SangBum -------------- next part -------------- An HTML attachment was scrubbed... URL: From sandrews at Intermolecular.com Mon Sep 25 10:34:54 2006 From: sandrews at Intermolecular.com (Scott Andrews) Date: Mon, 25 Sep 2006 10:34:54 -0700 Subject: Hall probe Message-ID: Does anyone know if there is any place on or off campus where I can get access to a Hall probe measurement system? Thanks, Scott -------------- next part -------------- An HTML attachment was scrubbed... URL: From rohank at stanford.edu Tue Sep 26 17:13:43 2006 From: rohank at stanford.edu (Rohan D. Kekatpure) Date: Tue, 26 Sep 2006 17:13:43 -0700 Subject: White light ellipsometry Message-ID: <1159316023.4519c237d80d9@webmail.stanford.edu> Dear all, I am looking to determine the refractive index and the extinction coefficient (n and k) of my transparent films in the visible wavelength range. Can anybody recommend a place (academic or commercial) where I can get such a measurement done? Thanks very much in advance -Rohan From rohank at stanford.edu Tue Sep 26 17:13:43 2006 From: rohank at stanford.edu (Rohan D. Kekatpure) Date: Tue, 26 Sep 2006 17:13:43 -0700 Subject: White light ellipsometry Message-ID: <1159316023.4519c237d11a9@webmail.stanford.edu> Dear all, I am looking to determine the refractive index and the extinction coefficient (n and k) of my transparent films in the visible wavelength range. Can anybody recommend a place (academic or commercial) where I can get such a measurement done? Thanks very much in advance -Rohan From eap at gloworm.Stanford.EDU Tue Sep 26 15:24:06 2006 From: eap at gloworm.Stanford.EDU (Eric Perozziello) Date: Tue, 26 Sep 2006 15:24:06 -0700 (PDT) Subject: Adcom meeting Message-ID: I was told that today at the Adcom meeting, a comment was made that "Industrial users can't be bothered to show up" (or similar). But, I don't think we were invited as a group! I hope that the faculty isn't under the impression that we don't care. We've been trying to have meetings with lab management a lot lately to discuss issues in the lab, and would welcome a discussion that includes faculty. From mtang at stanford.edu Wed Sep 27 09:47:21 2006 From: mtang at stanford.edu (Mary Tang) Date: Wed, 27 Sep 2006 09:47:21 -0700 Subject: Adcom meeting In-Reply-To: References: Message-ID: <451AAB19.6080603@stanford.edu> Hi Eric, et al -- I'm taking the liberty of answering, as Paul Rissman is on vacation now. Yes, there was an SNF Advisory Committee meeting yesterday -- and yes, I'm afraid industrial labmembers were not invited as a group... As SNF Director, it is Prof. Nishi's perogative to select who gets invited to participate. As I understand it, he chose to model his invitation list, in part, after Katalin Voros' approach at the Berkeley Microlab that the faculty get to "vote with their dollars". Prof. Nishi started with the list of the 15-20 faculty accumulating the largest lab bills over the course of a couple of years. Then, he added in some other faculty with complementary expertise/programs who have demonstrated strong support for SNF and are strategically important for SNF's interests. And recently, at Paul Rissman's request on behalf of Dave Burns/Alissa Fitzgerald's ad hoc labmembers committee, he began inviting some industrial groups. The groups he selected were those 3-4 industrial organizations accumulating the largest lab bills over the course of a couple of years (just like the faculty.) Analagous to the faculty, company principals from Acorn, Kovio, and Unity Semiconductor were invited (other than us humble staff, I think the only person on the invitation list who even has a Coral account was Alissa, by virtue of her leadership role with the Labmembers' Committee.) Members of the AdCom are welcome to send representatives in their place and many do. (I don't believe the comment you refer to was intended to express criticism of industrial groups, but utter disappointment, as Paul Rissman has tried to build bridges between the communities. When it was pointed out that Paul Clifton was there representing Acorn, he (Rissman) immediately apologized.) Discussions at the SNF AdCom are not meant to be "closed door" but by the same token, not posted on the website for public consumption. Paul Rissman has presented his AdCom meeting slides to Labmembers' Committee meetings and shared them with any interested lab and staff members. If you or anyone else is interested in yesterday's discussion, please do make sure to get in touch with him (he's due back late next week.) I do believe that faculty really do appreciate our industrial labmembers' support and vested interests in the lab and lab community, particularly since for the most part everyone (include staff) share the same concerns about our lab. I hope that we can all work together constructively to address them. Thanks, Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu Eric Perozziello wrote: >I was told that today at the Adcom meeting, a comment was made that >"Industrial users can't be bothered to show up" (or similar). > >But, I don't think we were invited as a group! > >I hope that the faculty isn't under the impression that >we don't care. We've been trying to have meetings with lab management >a lot lately to discuss issues in the lab, and would welcome >a discussion that includes faculty. > > > > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mbaran at stanford.edu Thu Sep 28 10:47:13 2006 From: mbaran at stanford.edu (Maureen Baran) Date: Thu, 28 Sep 2006 10:47:13 -0700 Subject: Found Electronic Gadget in the Lab Message-ID: <20060928174714.092714C0F3@smtp1.stanford.edu> Dear Labmembers: If you have misplaced one of your Electronic Gadgets (and you are sure you left home with it today) please come to cubicle 41 and claim it. Maureen Maureen Baran Stanford Nanofabrication Facility Lab Services Administrator mbaran at stanford.edu 650-725-3664 -------------- next part -------------- An HTML attachment was scrubbed... URL: From suriadi at stanford.edu Thu Sep 28 15:18:11 2006 From: suriadi at stanford.edu (Arief Suriadi Budiman) Date: Thu, 28 Sep 2006 15:18:11 -0700 Subject: Cr2O3 Removal/etching In-Reply-To: <447CA557.2030006@stanford.edu> Message-ID: <001801c6e34b$fc04e770$0100000a@BEARBOOK> Dear fellow labmembers, I'm wondering if somebody might be able to help me with info about how to do Cr2O3 (Chromium Oxide) etching/removal - what chemistry, and etch rate. I have a single crystal Cr (disk of 10mm dia and 2mm thickness), which has not been kept in vacuum sealed environment. So we think there has got to be a few hundreds Angstroms of native Cr oxide grown on the surface, which we would like to remove. I am certainly looking forward to hearing back from you. Thanks and best regards, Arief ------------------------------------------------------------------- Arief Suriadi Budiman Ph.D Candidate Dept. Of Materials Science & Engineering Stanford University, CA http://www.stanford.edu/~suriadi Advanced Light Source (ALS) Ernest Orlando Lawrence Berkeley National Laboratory e-mail : asbudiman at lbl.gov http://www.als.lbl.gov ------------------------------------------------------------------- From beinnmuir at stanford.edu Thu Sep 28 15:45:14 2006 From: beinnmuir at stanford.edu (Beinn Muir) Date: Thu, 28 Sep 2006 15:45:14 -0700 Subject: Silanisation of PECVD oxide Message-ID: <1159483514.451c507aa7ffa@webmail.stanford.edu> Dear Labmembers, I am working on silanising a 100 nm thick PECVD silicon dioxide layer using a monochlorosilane. The surface after silane deposition should be hydrophobic (contact angle 60-70 degrees), but it is still hydrophilic. A untreated wafer (native oxide, piranha cleaned) underwent the same silanisation conditions and the functionalisation was successful. I am not sure if this is an issue of the wafer surface history (wafers cleaned in piranha prior to silanisation, but have undergone other processing with polymer layers which are removed by the piranha), the surface roughness of the PECVD oxide, or the reactivity of the monochlorosilane with the PECVD surface. A brief literature search revealed that others have deposited various silanes on PECVD oxide successfully, and that this SiOx surface should have a higher concentration of silanol groups -- which is good for the silanisation reaction. Any thoughts, comments or suggestions are most welcome. Best regards, Beinn... From dtyeh at stanford.edu Fri Sep 29 23:51:30 2006 From: dtyeh at stanford.edu (David Yeh) Date: Fri, 29 Sep 2006 23:51:30 -0700 Subject: measuring high voltage I-V curves Message-ID: Hi, Does anyone work on high voltage ICs or devices where you need to measure I-V curves? I need to measure some high voltage transistor-like devices that go up to 500V and record it to computer. Does anyone know where I can get such equipment? Thanks, David From kimsangb at stanford.edu Sat Sep 30 00:33:50 2006 From: kimsangb at stanford.edu (SangBum Kim) Date: Sat, 30 Sep 2006 00:33:50 -0700 Subject: coral is not working Message-ID: <000b01c6e462$c6019c00$a9b50c80@anavel> Dear labmembers, Coral is not working right now. Remote coral is not working also. You might want to check whether the system is up before you get in the lab. Thanks, SangBum -------------- next part -------------- An HTML attachment was scrubbed... URL: From bmurray at stanford.edu Sat Sep 30 10:33:49 2006 From: bmurray at stanford.edu (Bill Murray) Date: Sat, 30 Sep 2006 10:33:49 -0700 Subject: Coral is UP! In-Reply-To: <000b01c6e462$c6019c00$a9b50c80@anavel> References: <000b01c6e462$c6019c00$a9b50c80@anavel> Message-ID: <1159637629.451eaa7d101f5@webmail.stanford.edu> Labmembers, I have identified the problem and resolved it. Coral is up and running again. Bill Quoting SangBum Kim : > Dear labmembers, > > > > Coral is not working right now. Remote coral is not working also. You > might > want to check whether the system is up before you get in the lab. > > > > Thanks, > > SangBum > >