From tberg at stanford.edu Mon Jul 2 06:21:07 2007 From: tberg at stanford.edu (Ted Berg) Date: Mon, 02 Jul 2007 06:21:07 -0700 Subject: TGO testing Monday July 09 Message-ID: <4688FBC3.7010509@stanford.edu> Hello all, Just a forewarning we will be testing our Toxic gas alarm system on Monday July 09 beginning at 8:30 am this may temporarily disrupt gas flows. We will be standing by to re-enable. The testing should take no more than 2 hours. Please plan accordingly. Thanks for your understanding and patience.ted From mtang at stanford.edu Tue Jul 3 18:06:45 2007 From: mtang at stanford.edu (Mary Tang) Date: Tue, 03 Jul 2007 18:06:45 -0700 Subject: Uija's leaving Message-ID: <468AF2A5.6040108@stanford.edu> Hi everyone -- As you may have heard, Uija Yoon, our ace litho/training engineer, has retired (for a second time.) In her one-and-a-half years here, she touched a lot of lives. At her request, we had a quiet get-together (with healthy foods, of course) on her last day. Since then, a number of people have said they want to convey their good wishes, so we've posted a card on the door of the Fab (you may recognize Maurice's work, a favorite of Uija's). Please do take the chance to write a few words -- she will very much appreciate them. Uija may have left the workforce, but she promises to be back often, to keep in touch and teach us how to eat healthy and stay young! Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From chozone at stanford.edu Wed Jul 4 20:32:41 2007 From: chozone at stanford.edu (Cho, Hoon) Date: Wed, 4 Jul 2007 20:32:41 -0700 Subject: Reminder: Hoon Cho(chozone)'s oral defense tomorrow July 5th, 10am(Thursday), @CIS-X Audi Message-ID: <003a01c7beb5$24a83570$646418ac@chozone> Ph. D. Oral Examination Stanford University Low Power, Highly Scalable, Vertical Flash Memory Cell and MOSFET Hoon Cho Department of Electrical Engineering Adviser: Professor Krishna C. Saraswat Date: Thursday, July 5th, 2007 Time: 10:00am (Refreshments at 9:45am) Location: CIS-X Auditorium Abstract Conventional floating gate NOR flash memory faces serious scaling challenges. One of the impediments stems from the relative non-scalability of gate length due to large short channel effects (SCE) and an inability to scale the gate stack (leakage control requirements). On the transistors side, to mitigate the impending power crisis in modern ICs, multi-gate devices and having dynamic Vt adjustment are considered promising options. A vertical, 3D MOSFET paradigm, with current flow perpendicular to the wafer plane, provides a versatile option as both a low power, scalable transistor, as well as a scalable flash cell. The scalability in the case of flash cell is achieved by removing the gate length (non-lithographically defined) from the critical path by placing it in the direction perpendicular to the wafer plane, and through architecture level density enhancement. Whereas, a vertical double gate transistor (not a FINFET) is attractive because of the process complexity problems with the planar double gate (DG) FETs and width discretization issues with the FINFET structure. We experimentally demonstrate and characterize a sub-30nm body thickness, vertical channel, symmetric double gate MOSFETs which is highly versatile. We show it to function as a 1) scalable multi-bit NOR flash memory cell, 2) DGFET with the two gates tied together showing excellent short channel effect immunity, 3) a back-gated transistor with a dynamic Vt adjustment knob for low power, and as a 4) capacitorless, single transistor, DRAM. These devices are demonstrated on a bulk-silicon substrate as apposed to an SOI substrate, thus provide a low cost option. The devices are fueled by several key, unit process innovations, which in themselves exhibit the versatility of being independently implemented in other applications. The process innovations include: 1) a new spacer process capable of building hard masks of thicknesses down to 5nm; 2) a novel self-aligned process exploiting curvature dependent differential poly-silicon oxidation rates to make either thick field oxide at the vertical device corners, a drain contact to thin vertical bodies, and to achieve electrical isolation between the two gates on either side of a vertical device; 3) a novel drain contact process including etch stop and implant. Extensive MEDICITM and TSUPREM4TM simulations are used for device/process design. The process, in principle, is scalable down to sub-5nm body thicknesses, does not require CMP, and is capable of being integrated with a planar CMOS flow with minimal additional mask steps. Excellent electrical properties in the form of Id-Vd, Id-Vg and Ig-Vg are measured for both the vertical DGFET and for the multi-bit flash memory. For vertical DGFET, we also electrically measure a large Vt shift with an independent back bias on the second gate, a close to ideal subthreshold slope (64mV/decade) in the symmetric double gate operational mode, and retention times in excess of 25ms in the capacitorless DRAM operational mode. For the NOR flash memory, we also present fully functional devices exhibiting excellent program, erase, and retention. In addition, we extensively study the important effect of charge interference from the cell sharing the thin body in terms of device scalability, mitigating solutions, and even possibly exploiting it to increase the number of bits per cell. -------------- next part -------------- An HTML attachment was scrubbed... URL: From ljy at stanford.edu Thu Jul 5 11:25:51 2007 From: ljy at stanford.edu (Jung-Yong Lee) Date: Thu, 5 Jul 2007 11:25:51 -0700 Subject: diffuse transmittance Message-ID: <794cfe150707051125l44101bcdtae2b807a2522c61e@mail.gmail.com> Hi all, I am wondering if there is a UV-vis equipment which can measure diffuse transmittance on campus. -- Jung-Yong -------------- next part -------------- An HTML attachment was scrubbed... URL: From joongsun.park at stanford.edu Fri Jul 6 13:26:10 2007 From: joongsun.park at stanford.edu (Joong Sun Park) Date: Fri, 6 Jul 2007 13:26:10 -0700 Subject: Carbon sputtering Message-ID: <99cb71800707061326s2267b957i4dd06e7e863b8037@mail.gmail.com> Hi Labmembers, Does anyone know where I can do carbon sputtering or get sputtering service? I don't think I can do in SNF since we don't have carbon target. If someone knows company name or any information, please let me know. Thanks in advance Best, Joongsun -------------- next part -------------- An HTML attachment was scrubbed... URL: From amf at amfitzgerald.com Fri Jul 6 13:33:45 2007 From: amf at amfitzgerald.com (Alissa M. Fitzgerald) Date: Fri, 6 Jul 2007 13:33:45 -0700 Subject: Carbon sputtering In-Reply-To: <99cb71800707061326s2267b957i4dd06e7e863b8037@mail.gmail.com> Message-ID: <000d01c7c00c$f36791a0$0600a8c0@minicat> Hi Joongsun, LGA Thin Films in Foster City, CA can do it: www.lgafilms.com Best regards, Alissa Alissa M. Fitzgerald, Ph.D. Managing Member A.M. Fitzgerald & Associates, LLC 655 Skyway Suite 118 San Carlos, CA 94070 +1 (650) 592-6100 x101 phone +1 (650) 592-6111 fax www.amfitzgerald.com _____ From: joongsun.park at gmail.com [mailto:joongsun.park at gmail.com] On Behalf Of Joong Sun Park Sent: Friday, July 06, 2007 1:26 PM To: labmembers at snf.stanford.edu Subject: Carbon sputtering Hi Labmembers, Does anyone know where I can do carbon sputtering or get sputtering service? I don't think I can do in SNF since we don't have carbon target. If someone knows company name or any information, please let me know. Thanks in advance Best, Joongsun -------------- next part -------------- An HTML attachment was scrubbed... URL: From tberg at stanford.edu Mon Jul 9 06:45:45 2007 From: tberg at stanford.edu (Ted Berg) Date: Mon, 09 Jul 2007 06:45:45 -0700 Subject: TGO alarm testing Today at 8:30AM Message-ID: <46923C09.6040205@stanford.edu> Hello all, Just a reminder we will be testing the TGO alarms this morning from 8:30 for about 2 hours. Gases may goo off but we will try and reset them promptly. ted From tberg at stanford.edu Mon Jul 9 07:09:44 2007 From: tberg at stanford.edu (Ted Berg) Date: Mon, 09 Jul 2007 07:09:44 -0700 Subject: TGO Testing Message-ID: <469241A8.90906@stanford.edu> Hello All, During testing horns and lights may go off an announcement will be made to disregard. ted From karthikv at stanford.edu Mon Jul 9 14:49:30 2007 From: karthikv at stanford.edu (Karthik Vijayraghavan) Date: Mon, 9 Jul 2007 14:49:30 -0700 Subject: Does anyone have 110 Si / SOI wafers? Message-ID: Hi, If you do please contact me. I am waiting for my order to arrive and will be able to replace your wafers in 2 weeks time. Thanks, Karthik -- www.stanford.edu/~karthikv -------------- next part -------------- An HTML attachment was scrubbed... URL: From bli003 at student.ucr.edu Tue Jul 10 10:00:19 2007 From: bli003 at student.ucr.edu (bli003 at student.ucr.edu) Date: Tue, 10 Jul 2007 10:00:19 -0700 (PDT) Subject: Si (111) wafer Message-ID: <20070710100019.ATM74490@mh1.ucr.edu> Hi, I need some p-Si(111) wafers which are not carried in the stock room. If you happen to have some extra (5 wafers is ok) that I can borrow, I will really appreciate and will return to you as we ordered and got them. Thank you, Bei ============================== Graduate Student QSL Lab.,EngrII 228 Dept.of Electrical Engineering University of California Riverside, CA 92521 Ph.# (951) 827-6275 Fax# (951) 827-2425 http://qsl.ee.ucr.edu/ ============================== From mihirt at stanford.edu Tue Jul 10 14:09:17 2007 From: mihirt at stanford.edu (mihirt at stanford.edu) Date: Tue, 10 Jul 2007 14:09:17 -0700 Subject: Missing quartz beaker Message-ID: <20070710140917.1qo8oke3yhs08ko0@webmail.stanford.edu> Hello, I left my LDD-26W quartz beaker to dry on the Headway bench over the weekend. It has since gone missing. If you took it by mistake, please contact me to return it. These are expensive to replace! Thank you! -- Mihir Tendulkar Applied Physics PhD Candidate Nishi Group, Stanford University From kattsai at stanford.edu Tue Jul 10 19:48:57 2007 From: kattsai at stanford.edu (Katherine Tsai) Date: Tue, 10 Jul 2007 19:48:57 -0700 Subject: balance Message-ID: <1c62e49d0707101948u79d21640sfb06966c2e84b4a8@mail.gmail.com> Hi all, I need a balance with at least 0.1 mg precision. Does anyone have one that I could borrow temporarily? It would need to fit in a nitrogen box about 3' x 3' x 2'. Thanks, Katherine Tsai -------------- next part -------------- An HTML attachment was scrubbed... URL: From tdo at stanford.edu Wed Jul 11 16:06:54 2007 From: tdo at stanford.edu (Thomas O'Sullivan) Date: Wed, 11 Jul 2007 16:06:54 -0700 Subject: Hall Measurement Message-ID: <4695628E.40103@stanford.edu> Hi all, Does anyone know where I can access a Hall measurement system to measure doping concentration in a semiconductor sample? Thanks, Tom From msuggs at spsu.edu Wed Jul 11 16:08:34 2007 From: msuggs at spsu.edu (Maria Suggs) Date: Wed, 11 Jul 2007 19:08:34 -0400 (EDT) Subject: Through Wafer Etching using STS2 Message-ID: <20070711190834.ACB09498@mira.spsu.edu> Hi everybody, I'm an REU student working on through wafer etching characterization using STS2. I'm wondering if anybody has had experience in the past etching all the way through the wafer using STS2? If so, would you mind if I come and talk to you briefly about it? I'd like to get some feedback and suggestions from you before I proceed. Thanks for your time in advance, Maria Suggs From mwiemer at stanford.edu Sun Jul 15 12:39:40 2007 From: mwiemer at stanford.edu (Michael Wiemer) Date: Sun, 15 Jul 2007 12:39:40 -0700 Subject: CMP Message-ID: Hi All, Has anyone used a CMP service which they can recommend? I need to CMP planarize some Si / SiO2 4inch wafers. Thanks! -Mike -------------- next part -------------- An HTML attachment was scrubbed... URL: From mtang at stanford.edu Mon Jul 16 16:55:46 2007 From: mtang at stanford.edu (Mary Tang) Date: Mon, 16 Jul 2007 16:55:46 -0700 Subject: [Fwd: domestic water shutdown] Message-ID: <469C0582.2090105@stanford.edu> Labmembers: There will be a complete shutdown of domestic water tomorrow (Tuesday) morning scheduled from 6:30-8:30 am (see attached). Originally, the plan was to bypass the lab to allow normal operations; however, Facilities has just determined this will not be possible. The equipment that will be affected will be the LPCVD furnaces, sts dep, ald, and the wafersaw. Other equipment in the lab should not be affected. Restrooms and other facilities outside the lab will also be affected. Please plan accordingly. Your SNF lab staff -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu -------------- next part -------------- An embedded message was scrubbed... From: John Mendoza Subject: domestic water shutdown Date: Fri, 13 Jul 2007 10:22:23 -0700 Size: 2704 URL: From rissman at stanford.edu Mon Jul 16 17:31:45 2007 From: rissman at stanford.edu (Paul Rissman) Date: Mon, 16 Jul 2007 17:31:45 -0700 Subject: domestic water shutdown - CANCELLED Message-ID: <200707170031.l6H0VkXa017966@smtp-roam.Stanford.EDU> Labmembers, I have just received notice that the domestic water shutdown for tomorrow HAS BEEN CANCELLED. ALL LAB ACTIVITY SHOULD BE NORMAL. Facilities is trying to make modifications to ensure that lab functions will not be interrupted. We will let you know when we have more information. Sorry for any inconvenience. Paul Rissman >X-Sieve: CMU Sieve 2.3 >Delivered-To: rissman at stanford.edu >Delivered-To: rissman at snf.stanford.edu >Mailing-List: contact labmembers-help at snf.stanford.edu; run by ezmlm >X-No-Archive: yes >List-Post: >List-Help: >List-Unsubscribe: >List-Subscribe: >Delivered-To: mailing list labmembers at snf.stanford.edu >Delivered-To: moderator for labmembers at snf.stanford.edu >Date: Mon, 16 Jul 2007 16:55:46 -0700 >From: Mary Tang >User-Agent: Thunderbird 1.5.0.12 (Windows/20070509) >To: labmembers at snf.stanford.edu >Subject: [Fwd: domestic water shutdown] > >Labmembers: > >There will be a complete shutdown of domestic >water tomorrow (Tuesday) morning scheduled from >6:30-8:30 am (see attached). Originally, the >plan was to bypass the lab to allow normal >operations; however, Facilities has just >determined this will not be possible. The >equipment that will be affected will be the >LPCVD furnaces, sts dep, ald, and the >wafersaw. Other equipment in the lab should not >be affected. Restrooms and other facilities >outside the lab will also be affected. Please plan accordingly. > >Your SNF lab staff > >-- >Mary X. Tang, Ph.D. >Stanford Nanofabrication Facility >CIS Room 136, Mail Code 4070 >Stanford, CA 94305 >(650)723-9980 >mtang at stanford.edu >http://snf.stanford.edu > > > >Return-Path: >Received: from smtp1.stanford.edu (smtp1.Stanford.EDU [171.67.22.28]) > by pobox03.stanford.edu (Cyrus v2.3.7) with LMTPA; > Fri, 13 Jul 2007 10:22:45 -0700 >X-Sieve: CMU Sieve 2.3 >Received: by smtp1.stanford.edu (Postfix) > id 2FA1A4BDF4; Fri, 13 Jul 2007 10:22:45 -0700 (PDT) >Delivered-To: mtang at stanford.edu >Received: from smtp1.stanford.edu (localhost.localdomain [127.0.0.1]) > by localhost (Postfix) with SMTP id 237AB4C748 > for ; Fri, 13 Jul 2007 10:22:45 -0700 (PDT) >Received: from snf.stanford.edu (snf.Stanford.EDU [171.64.100.112]) > by smtp1.stanford.edu (Postfix) with SMTP id B680F4C76D > for ; Fri, 13 Jul 2007 10:22:44 -0700 (PDT) >Received: (qmail 17129 invoked by uid 20357); 13 Jul 2007 17:22:44 -0000 >Delivered-To: mtang at snf.Stanford.EDU >Received: (qmail 17126 invoked from network); 13 Jul 2007 17:22:44 -0000 >Received: from agp.stanford.edu (171.67.73.10) > by snf.stanford.edu with SMTP; 13 Jul 2007 17:22:44 -0000 >Received: from cis.stanford.edu ([171.64.100.178]) > by agp.stanford.edu with esmtp (Exim 4.43) > id 1I9Oqi-0000tZ-N0; Fri, 13 Jul 2007 10:22:36 -0700 >Received: by cis.Stanford.EDU (Postfix) > id B686413DAA; Fri, 13 Jul 2007 10:22:23 -0700 (PDT) >Delivered-To: cis-building-staff at cis.stanford.edu >Received: from agp.stanford.edu (agp.Stanford.EDU [171.67.73.10]) > by cis.Stanford.EDU (Postfix) with ESMTP id 9AEB613DA7 > for ; > Fri, 13 Jul 2007 10:22:23 -0700 (PDT) >Received: from eemail.stanford.edu ([171.64.88.33]) > by agp.stanford.edu with esmtp (Exim 4.43) > id 1I9OqW-0000oB-HU > for cis-building at cis.stanford.edu; Fri, 13 Jul 2007 10:22:24 -0700 >Received: from [171.64.88.67] (account mendoza [171.64.88.67] verified) > by eemail.stanford.edu (CommuniGate Pro SMTP 5.1.6) > with ESMTPA id 6691431 for > cis-building at cis.stanford.edu; Fri, 13 Jul 2007 10:22:25 -0700 >Message-ID: <4697B4CF.4020100 at ee.stanford.edu> >Date: Fri, 13 Jul 2007 10:22:23 -0700 >From: John Mendoza >User-Agent: Mozilla Thunderbird 1.0.7 (Windows/20050923) >X-Accept-Language: en-us, en >MIME-Version: 1.0 >To: cis building >Subject: domestic water shutdown >Content-Type: text/plain; charset=windows-1252; format=flowed >Content-Transfer-Encoding: 8bit > >There will be a domestic water shutdown next >Tuesday from 630am to 830am. Please make appropriate arrangements. > >*Building Manager: Please post notices* > >* * > >***SHUTDOWN*** > >* * > >*DOMESTIC WATER* > >*@* > >CIS > >*(04-050)* > >* * > >*TUESDAY 7/17/07 * > >*6:30 AM ? 8:30AM* > >* * > >*QUESTIONS REGARDING THIS SHUTDOWN MAY BE >DIRECTED TO VICKI VAUGHN @ 736-7928*** > > From mcvittie at cis.Stanford.EDU Wed Jul 18 09:39:28 2007 From: mcvittie at cis.Stanford.EDU (Jim McVittie) Date: Wed, 18 Jul 2007 09:39:28 -0700 (PDT) Subject: Seminar on Reactive Sputtering Message-ID: Special Seminar, Tuesday, July 24, 1:30 pm, CIS 101 Modeling of Reactive Sputtering Dr. Hans-Olof Blum, Thin Film Group, Solid State Electronics division The Angstrom Laboratory, Uppsala University, Sweden ( From his lab's web site) The basic model of the reactive sputtering process was first published in 1987 by Berg and Blom. It is based on basic gas kinetics and consists of a number of straightforward steady-state balance equations. Despite its simplicity, it has been proven to agree well with experimental observations and it is extremely useful for description of hysteresis in reactive sputtering. The model can predict variations in the sputtering rate, the composition of the deposited film, the partial pressure of the reactive gas, the fraction of the target surface covered by the compound, and the position of the hysteresis region. Moreover, it is very flexible and can easily be modified to account for sputtering using multiple targets, sputtering with several reactive gases, or multi-phase compound formation Our group continues in development of models for reactive sputtering processes. At present the dynamics of reactive sputtering has been studied. The original steady-state Berg's model has been extended in order to reproduce dynamical behaviour. It has been successfully applied to study dynamical effects on hysteresis curves, and to simulate reactive process with pulsing of reactive gas. Another research interest are high deposition rate processes for oxides. Several ways of eliminating hysteresis has been proposed based on simulations and successfully tested. As an example, reduction of target area or the use of a substoichiometric target may be mentioned. Modeling of Reactive Sputtering of Compound Materials S.Berg, H.O.Blom, T.Larsson, and C.Nender, J. Vac. Sci. Technol. A 5 (1987) 202 Modeling of the Reactive Sputtering Process. S. Berg, T. Nyberg, H.-O. Blom, and C. Nender., Handbook of Thin Film Process Technology, A5.3, IOP, (1998). -------------------------------------------------------------- Jim McVittie, Ph.D. Senior Research Scientist Allen Center for Integrated Systems Electrical Engineering Stanford University jmcvittie at stanford.edu Rm. 336, 330 Serra Mall Fax: (650) 723-4659 Stanford, CA 94305-4075 Tel: (650) 725-3640 From sanjah at stanford.edu Wed Jul 18 15:09:56 2007 From: sanjah at stanford.edu (Sanja Hadzialic) Date: Wed, 18 Jul 2007 15:09:56 -0700 Subject: Goodbye and thanks Message-ID: <20070718150956.xnqusyluko4kkg08@webmail.stanford.edu> Hi everybody, As some of you already know I'm going back to Norway tomorrow to finish up my phd there, and I just couldn't go without saying anything (I don't know what came over me - normally I'm such a silent person ;) When I came here a year and a half ago I never imagined that I would meet so many nice people and get so attached to Stanford. Frankly speaking, clean room life didn't look that appealing at all at the first glance, but thanks to all of you I had a lot of fun in there. Sure, there have been frustrating moments and broken wafers, but what I'll remember the most are the people. Thanks for all the interesting conversations and all the help and support - especially during my weeks on crutches - I don't know what I would have done if Eric wasn't always there to hold my doors open (in addition to answering all the hard fabrication questions :) I'm going to miss you guys - a LOT! Hope to see most people again when I come to visit in October. Oh, and if anybody should come to Norway for one reason or another, please feel free to contact me - I'm happy to show you around. My Norwegian email is: sanjah at unik.no Sanja :~) From jerabek at snf.stanford.edu Fri Jul 20 13:47:51 2007 From: jerabek at snf.stanford.edu (Paul Jerabek) Date: Fri, 20 Jul 2007 12:47:51 -0800 Subject: mask file names Message-ID: <000a01c7cb0f$3d2632d0$916540ab@czech1> To whom it may concern: This note is addressed to fans of Micronic Laser Maskwriter. When deciding on a name for your file, please, do avoid obvious names such as mask;wafer;layout;final;version, etc. Also keep in mind Micronic runs on an older version of UNIX operating system and as such has a limit on number of characters in a file name (22) , your file name can't start with a number or capital letter and UNIX is case sensitive. These limitations also apply to the cell names. You must also avoid using spaces in your file names Thank you for your cooperation -Paul J. -------------- next part -------------- An HTML attachment was scrubbed... URL: From mmlee at stanford.edu Sun Jul 22 16:04:35 2007 From: mmlee at stanford.edu (Meredith M. Lee) Date: Sun, 22 Jul 2007 16:04:35 -0700 Subject: Free 'Frontiers in Optics' conference registration and OSA membership (first replies) Message-ID: <9fa245520707221604w633ccaeao753bd96d1ffeea0@mail.gmail.com> Greetings, Stanford and Berkeley OSA (Optical Society of America) Student Chapters are organizing volunteers for the Frontiers in Optics (FiO)/ Laser Science XXIII conference that will be held Sept 16-20, 2007 in San Jose, CA. Anyone volunteering a total of 12 hours will receive free conference registration for the entire week and complimentary membership to OSA. Notably, each technical session needs just ONE monitor, so if you want to meet a specific session chair and/or get exposure to a certain area, sign up quickly! Details at: http://spreadsheets.google.com/pub?key=pD49AggXFtic_WRjBZMZLRg&gid=0 (this shows what slots are still open). Note the tabs -- there are 3 spreadsheets to look at before emailing us your name, address and email to sign up. Please feel free to forward to anyone who might be interested! Thanks, -Stanford Student OSA http://student-osa.stanford.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From mtang at stanford.edu Mon Jul 23 13:15:54 2007 From: mtang at stanford.edu (Mary Tang) Date: Mon, 23 Jul 2007 13:15:54 -0700 Subject: Seminar on CAD tools for MEMS: Tuesday, July 31, 2 pm, CISX Auditorium Message-ID: <46A50C7A.4080603@stanford.edu> Dr. Mary Ann Maher, of SoftMEMS LLC, will be here to discuss the suite of SoftMEMS CAD tools originally designed for MEMS layouts, but with applicability to IC's as well. One of the most interesting features of the SoftMEMS is its ability to generate 3-D cross-sections at any physical point on the CAD layout -- and at any point in the process using standard simulators. This will be held in the CISX Auditorium on Tuesday, July 31, at 2 pm. ********************************************************************************************* Recent advances in computer aided design for MEMS, MOEMS, RF-MEMS and Microfluidics will be discussed in this seminar. A CAD tool that allows designers to create MEMS and NEMS mask layouts in the L-Edit and Cadence environments by adding special tools for designers to create MEMS primitives, such as splines, fillets and general equation-based curves and recover* *shapes such as circles and torii from multi-sided polygons found in formats such as GDS II will be described. Tools* *to automate tasks that are time-consuming such as generating holes and dimples to properly release MEMS structures and automatic generation of typical MEMS structures such as comb-drives and springs are also presented. A way in which 3D geometric models of MEMS devices can be made automatically from the L-Edit or Cadence layouts and a fabrication process description that can be entered by the user will be described. Emulation of surface and bulk micromachining process steps such as material deposit, etch, mechanical polish, diffusion, growth, electroplating and wafer manipulation steps will be explained. Transfer of generated models to finite element programs such as ANSYS and COMSOL/FEMLAB will be demonstrated. A system for adding boundary conditions to the layout for automatic transfer to the FEM environment will also be shown. Furthermore, a description of how to perform mixed MEMS/IC schematic capture and simulation with models for MEMS devices in standard simulators such as Cadence, Tanner, Agilent and Matlab will be presented. A library of composable MEMS models will be described parameterized by process parameters, material properties and device dimensions. The models are represented with signals in the 6DOF-mechanical, thermal, magnetic, fluidic, optical, and electro-static domains and are written in languages such as SPICE, C-code, Verilog-A or Matlab. Finally, the talk will describe methods for automatically creating models of MEMS devices from data from finite element simulators using model order reduction techniques. A live demo of the CAD tool will be given with examples from Optical MEMS, RF MEMS, Microfluidics. About the speaker: *Dr. Mary Ann Maher,* received her PhD from Caltech in 1989 in the area of semiconductor device modeling. She pursued post doctoral studies at the CSEM in Neuchatel, Switzerland, where she studied analog memories and designed low power analog ICs with on-chip sensors for artificial vision applications. At Tanner Research she began the simulation and modeling group and launched Tanner?s T-Spice analog circuit simulator product. As Director of Advanced Products, she brought to market Tanner?s MEMS Pro microsystem and MCM Pro multi-chip module and packaging design tool suites. Moving to MEMSCAP, she became the company?s CTO and she is now the CEO of SoftMEMS LLC. -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From kattsai at stanford.edu Mon Jul 23 13:31:43 2007 From: kattsai at stanford.edu (Katherine Tsai) Date: Mon, 23 Jul 2007 13:31:43 -0700 Subject: anyone have SU8-2002 and/or SU8 developer? Message-ID: <1c62e49d0707231331na0daee1k819debd6b0878a74@mail.gmail.com> Does anyone have some SU8-2002 that he/she would be willing to share? Also, does anyone have developer for SU8 from Microchem that could be shared? We could make arrangements to split the costs or I could replace any amount used. Thanks, Katherine Tsai -------------- next part -------------- An HTML attachment was scrubbed... URL: From pleu at stanford.edu Tue Jul 24 09:45:19 2007 From: pleu at stanford.edu (Paul Leu) Date: Tue, 24 Jul 2007 09:45:19 -0700 Subject: tylan bpsg Message-ID: <028301c7ce12$05ac9c80$1105d580$@edu> Hi, Is someone aware of a vendor or equipment which can deposit doped silicon oxide like tylanbpsg, except accept Au-contaminated wafer pieces? Thanks! Paul -------------- next part -------------- An HTML attachment was scrubbed... URL: From mahnaz at stanford.edu Tue Jul 24 16:43:43 2007 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Tue, 24 Jul 2007 16:43:43 -0700 Subject: Yellow filter Message-ID: <46A68EAF.60806@stanford.edu> Hello all, We are missing the yellow filter for the microscope sitting across from Nikon. Have you seen it? The size of this filter slightly larger than the one we have so please if you know the where about of the filter let me know. If the part is broken, leave me the broken parts- at this time is easier for me to fix a broken part till I get a new one made. mahnaz From rissman at stanford.edu Tue Jul 24 22:11:10 2007 From: rissman at stanford.edu (Paul Rissman) Date: Tue, 24 Jul 2007 22:11:10 -0700 Subject: POCl3 release tonight Message-ID: <200707250511.l6P5BCEd028691@smtp-roam.Stanford.EDU> There was a release of POCl3 from Tylan6 at approximately 7 pm this evening. The lab was evacuated and the release was halted when Eric Perozziello cut off the nitrogen supply to the bubbler. John Shott and I arrived shortly after the evacuation. We checked the sensors at the TGO monitoring computer and could find no response at the sensor nearest to the tube, above wbdiff, or at the sensor in the bubbler exhaust. John then used a handheld sensor to check the bubbler and the area at the front of the tube where the leak occurred and found no detectable gas. The maintenance group will further investigate the cause of the release in the morning. The lab was reopened at about 8:15. From vishal at thorrn.com Wed Jul 25 15:57:50 2007 From: vishal at thorrn.com (Vishal Singhal) Date: Wed, 25 Jul 2007 15:57:50 -0700 Subject: dxf to gerber In-Reply-To: References: Message-ID: Does any one know of any good freeware to convert output from L-Edit (DXF, GDSII, CIF, PostScript) into gerber. Thanks, Vishal -------------- next part -------------- An HTML attachment was scrubbed... URL: From mtang at stanford.edu Wed Jul 25 16:05:40 2007 From: mtang at stanford.edu (Mary Tang) Date: Wed, 25 Jul 2007 16:05:40 -0700 Subject: dxf to gerber In-Reply-To: References: Message-ID: <46A7D744.2050304@stanford.edu> Hi Vishal -- Although not freeware, the leftside CAD computer has LinkCAD (http://www.linkcad.com), which allows conversion for all those formats. Because of our license (we got it back when it was only $25), there are a couple of odd things, particularly with the visualization feature - let us know if you have problems and we'll show you the workarounds. Mary Vishal Singhal wrote: > Does any one know of any good freeware to convert output from L-Edit > (DXF, GDSII, CIF, PostScript) into gerber. > > Thanks, > Vishal > -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From edmyers at stanford.edu Wed Jul 25 16:24:40 2007 From: edmyers at stanford.edu (Ed Myers) Date: Wed, 25 Jul 2007 16:24:40 -0700 Subject: Fwd: RE: Sopra porosimetry Message-ID: <6.2.5.6.2.20070725161914.01e6e880@stanford.edu> Labmembers, Sopra will be on site to present their work on using ellipsometery to quantify film porosity. Attached is an abstract of their work. I have reserved CIS101 on Friday, July 27th at 1pm for their presentation. Please forgive the late notice, and join us for the presentation. Regards, Ed >From: "Laurent Kitzinger" >To: "'Ed Myers'" >Subject: RE: Sopra porosimetry >Date: Wed, 25 Jul 2007 12:16:46 -0700 > > >Hi Ed, > > > >Our porosimetry expert from france is in town this week. > >If there is any interest,we would be more than happy to give a talk on > >the technique on Friday . > > > >Please let me know your thoughts, > > > >Regards , > >Laurent > > -------------- next part -------------- A non-text attachment was scrubbed... Name: ABG- Abstract EPA TiO2- Stanford.doc Type: application/msword Size: 152064 bytes Desc: not available URL: From apettes at stanford.edu Thu Jul 26 15:44:52 2007 From: apettes at stanford.edu (Anthony M. Pettes) Date: Thu, 26 Jul 2007 15:44:52 -0700 Subject: ITO Wafer Vendors Message-ID: <000001c7cfd6$94594da0$8e2842ab@pettesmacbook> If anyone has information on reliable vendors for ITO coated 4" glass wafers it would be greatly appreciated. We have been using a vendor in Maine that has been unsatisfactory. Thank you -------------- next part -------------- An HTML attachment was scrubbed... URL: From sergei at scipp.ucsc.edu Thu Jul 26 22:29:41 2007 From: sergei at scipp.ucsc.edu (Sergei Kachiguin) Date: Thu, 26 Jul 2007 22:29:41 -0700 Subject: ITO Wafer Vendors In-Reply-To: <000001c7cfd6$94594da0$8e2842ab@pettesmacbook> References: <000001c7cfd6$94594da0$8e2842ab@pettesmacbook> Message-ID: <46A982C5.7030908@scipp.ucsc.edu> Following Chris Storment's tip we used to buy pretty decent ITO coated 4" glass wafers from TFD. http://www.tfdinc.com/ Good luck, Sergei Anthony M. Pettes wrote: > If anyone has information on reliable vendors for ITO coated 4? glass > wafers it would be greatly appreciated. We have been using a vendor in > Maine that has been unsatisfactory. > > Thank you > From edmyers at stanford.edu Fri Jul 27 08:38:52 2007 From: edmyers at stanford.edu (Ed Myers) Date: Fri, 27 Jul 2007 08:38:52 -0700 Subject: Fwd: RE: Sopra porosimetry Message-ID: <6.2.5.6.2.20070727083837.03b38f80@stanford.edu> >Labmembers, > >Sopra will be on site to present their work on using ellipsometery >to quantify film porosity. Attached is an abstract of their work. > >I have reserved CIS101 on Friday, July 27th at 1pm for their presentation. > >Please forgive the late notice, and join us for the presentation. > >Regards, >Ed > > >>From: "Laurent Kitzinger" >>To: "'Ed Myers'" >>Subject: RE: Sopra porosimetry >>Date: Wed, 25 Jul 2007 12:16:46 -0700 >> >> >Hi Ed, >> > >> >Our porosimetry expert from france is in town this week. >> >If there is any interest,we would be more than happy to give a talk on >> >the technique on Friday . >> > >> >Please let me know your thoughts, >> > >> >Regards , >> >Laurent >> > > > -------------- next part -------------- A non-text attachment was scrubbed... Name: ABG- Abstract EPA TiO2- Stanford1.doc Type: application/msword Size: 152064 bytes Desc: not available URL: From tberg at stanford.edu Fri Jul 27 11:29:41 2007 From: tberg at stanford.edu (Ted Berg) Date: Fri, 27 Jul 2007 11:29:41 -0700 Subject: Loaner Alphastep is here Message-ID: <46AA3995.8050802@stanford.edu> Metrology Equip just left a loaner alphstep. Preliminary indications are the stage was driven too far down and jammed it. please use caution and stage manipulator to load wafers. This is a delicate tools and repairs are costly. thanks,ted From huangzb at stanford.edu Mon Jul 30 08:55:28 2007 From: huangzb at stanford.edu (Zubin Huang) Date: Mon, 30 Jul 2007 08:55:28 -0700 Subject: PECVD outside vendors Message-ID: <012001c7d2c2$0d278290$0a01fea9@zubinlaptop> Hi, Can anyone suggest some PECVD vendors outside the lab? The one STS PECVD in CIS is down for several weeks and we are trying to hit a deadline in three weeks. Thanks, Zubin -------------- next part -------------- An HTML attachment was scrubbed... URL: From amf at amfitzgerald.com Mon Jul 30 10:34:45 2007 From: amf at amfitzgerald.com (Alissa M. Fitzgerald) Date: Mon, 30 Jul 2007 10:34:45 -0700 Subject: PECVD outside vendors In-Reply-To: <012001c7d2c2$0d278290$0a01fea9@zubinlaptop> Message-ID: <001501c7d2cf$ec9f13e0$0600a8c0@minicat> Hi Zubin, Try Strataglass in Mountain View: www.strataglass.us We use them all the time and get consistently good results. Regards, Alissa Alissa M. Fitzgerald, Ph.D. Managing Member A.M. Fitzgerald & Associates, LLC 655 Skyway Suite 118 San Carlos, CA 94070 +1 (650) 592-6100 x101 phone +1 (650) 592-6111 fax www.amfitzgerald.com _____ From: Zubin Huang [mailto:huangzb at stanford.edu] Sent: Monday, July 30, 2007 8:55 AM To: labmembers at snf.stanford.edu Subject: PECVD outside vendors Hi, Can anyone suggest some PECVD vendors outside the lab? The one STS PECVD in CIS is down for several weeks and we are trying to hit a deadline in three weeks. Thanks, Zubin -------------- next part -------------- An HTML attachment was scrubbed... URL: From mtang at stanford.edu Mon Jul 30 10:42:09 2007 From: mtang at stanford.edu (Mary Tang) Date: Mon, 30 Jul 2007 10:42:09 -0700 Subject: PECVD outside vendors In-Reply-To: <012001c7d2c2$0d278290$0a01fea9@zubinlaptop> References: <012001c7d2c2$0d278290$0a01fea9@zubinlaptop> Message-ID: <46AE22F1.40202@stanford.edu> Hi Zubin, et al -- Here are some resources that other labmembers use. In each case, you would have to create a PO (cannot recharge your SNF account): For other NNIN Sites, here's a process capability list: http://www.nnin.org/nnin_process2.html For contacts at each NNIN site, see: http://www.nnin.org/nnin_site.html UC Berkeley Microlab: http://microlab.berkeley.edu/ They offer some limited processing support. The contact person is Sia Parsa. Commercial resource: http://www.strataglass.us/ They are local (in Mountain View) and can offer quick turnaround, depending on the film. Mary -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu Zubin Huang wrote: > Hi, > > Can anyone suggest some PECVD vendors outside the lab? The one STS > PECVD in CIS is down for several weeks and we are trying to hit a > deadline in three weeks. > > Thanks, > Zubin From mtang at stanford.edu Mon Jul 30 11:40:35 2007 From: mtang at stanford.edu (Mary Tang) Date: Mon, 30 Jul 2007 11:40:35 -0700 Subject: Seminar on CAD tools for MEMS: Tuesday, July 31, 2 pm, CISX Auditorium Message-ID: <46AE30A3.6040406@stanford.edu> *****Reminder***** Dr. Mary Ann Maher, of SoftMEMS LLC, will be here to discuss the suite of SoftMEMS CAD tools originally designed for MEMS layouts, but with applicability to IC's as well. One of the most interesting features of the SoftMEMS is its ability to generate 3-D cross-sections at any physical point on the CAD layout -- and at any point in the process using standard simulators. This will be held in the CISX Auditorium on Tuesday, July 31, at 2 pm. ********************************************************************************************* Recent advances in computer aided design for MEMS, MOEMS, RF-MEMS and Microfluidics will be discussed in this seminar. A CAD tool that allows designers to create MEMS and NEMS mask layouts in the L-Edit and Cadence environments by adding special tools for designers to create MEMS primitives, such as splines, fillets and general equation-based curves and recover* *shapes such as circles and torii from multi-sided polygons found in formats such as GDS II will be described. Tools* *to automate tasks that are time-consuming such as generating holes and dimples to properly release MEMS structures and automatic generation of typical MEMS structures such as comb-drives and springs are also presented. A way in which 3D geometric models of MEMS devices can be made automatically from the L-Edit or Cadence layouts and a fabrication process description that can be entered by the user will be described. Emulation of surface and bulk micromachining process steps such as material deposit, etch, mechanical polish, diffusion, growth, electroplating and wafer manipulation steps will be explained. Transfer of generated models to finite element programs such as ANSYS and COMSOL/FEMLAB will be demonstrated. A system for adding boundary conditions to the layout for automatic transfer to the FEM environment will also be shown. Furthermore, a description of how to perform mixed MEMS/IC schematic capture and simulation with models for MEMS devices in standard simulators such as Cadence, Tanner, Agilent and Matlab will be presented. A library of composable MEMS models will be described parameterized by process parameters, material properties and device dimensions. The models are represented with signals in the 6DOF-mechanical, thermal, magnetic, fluidic, optical, and electro-static domains and are written in languages such as SPICE, C-code, Verilog-A or Matlab. Finally, the talk will describe methods for automatically creating models of MEMS devices from data from finite element simulators using model order reduction techniques. A live demo of the CAD tool will be given with examples from Optical MEMS, RF MEMS, Microfluidics. About the speaker: *Dr. Mary Ann Maher,* received her PhD from Caltech in 1989 in the area of semiconductor device modeling. She pursued post doctoral studies at the CSEM in Neuchatel, Switzerland, where she studied analog memories and designed low power analog ICs with on-chip sensors for artificial vision applications. At Tanner Research she began the simulation and modeling group and launched Tanner?s T-Spice analog circuit simulator product. As Director of Advanced Products, she brought to market Tanner?s MEMS Pro microsystem and MCM Pro multi-chip module and packaging design tool suites. Moving to MEMSCAP, she became the company?s CTO and she is now the CEO of SoftMEMS LLC. -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From mtang at stanford.edu Tue Jul 31 11:40:51 2007 From: mtang at stanford.edu (Mary Tang) Date: Tue, 31 Jul 2007 11:40:51 -0700 Subject: CAD Presentation today, at 2 pm Message-ID: <46AF8233.9030207@stanford.edu> Just a reminder: Dr. Mary Ann Maher, of SoftMEMS LLC, will be here to discuss the suite of SoftMEMS CAD tools originally designed for MEMS layouts, but with applicability to IC's as well. One of the most interesting features of the SoftMEMS is its ability to generate 3-D cross-sections at any physical point on the CAD layout -- and at any point in the process using standard simulators. GREAT FOR ANIMATING PROCESS FLOWS!! This will be held in the CISX Auditorium on Tuesday, July 31, at 2 pm. More detail at: http://snf.stanford.edu/cgi-bin/ezmlm-cgi?mss:2831:200707:clddpfibfjjdlkmfeebm -- Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA 94305 (650)723-9980 mtang at stanford.edu http://snf.stanford.edu From pleu at stanford.edu Tue Jul 31 14:57:08 2007 From: pleu at stanford.edu (Paul Leu) Date: Tue, 31 Jul 2007 14:57:08 -0700 Subject: tylan boron and phosphorus Message-ID: <00ec01c7d3bd$be0b9be0$3a22d3a0$@edu> Hi, Does anyone have tylan boron and tylan phosphorus recipes and the doping concentration obtainable through these various recipes? Thanks! Paul -------------- next part -------------- An HTML attachment was scrubbed... URL: From xzhuang at stanford.edu Tue Jul 31 15:04:50 2007 From: xzhuang at stanford.edu (Steve Zhuang) Date: Tue, 31 Jul 2007 15:04:50 -0700 Subject: seeking advices on covering narrow trenches Message-ID: <20070731150450.w2muq9zl0c0sww8c@webmail.stanford.edu> Dear Labmembers, I'm wondering if anyone has experience with covering narrow trenches that are 2-3um wide and a few millimeters long with a layer of protective material. My device will operate in water, and I need to protect these trenches so that no water or the protective material can get into them. Please let me know if you have any suggestions. Thanks you! Steve Zhuang Khuri-Yakub Group