etching high aspect ratio vias using STS etcher
xzhuang at stanford.edu
Sat Mar 10 09:51:42 PST 2007
Does anyone have experience in etching high aspect ratio vias using STS or
STS2 etcher? I'd like to etch 20-um diameter, 400-um deep vias on an SOI
wafer, and the etching would stop at the burried oxide layer. Is this
doable? Which recipe is best suited for this particular process?
Any input will be highly appreciated.
Thanks a lot!!
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