ASML Presentation on 3D Align - Wed., 7/30, 1 pm CIS 101

Mary Tang mtang at
Tue Jul 29 07:59:12 PDT 2008

Greetings labmembers:

Paul Yick, the ASML site engineer, will be giving a short presentation 
about the 3-D align upgrade recently installed and qualified on the ASML 
system here at SNF.  3D align, by the way, is a custom feature not 
generally available on standard systems and we are fortunate that ASML 
has chosen to showcase this capability here. 

In brief:

3D-Align is an ASML Enabling Technology that combines Front-side 
alignment (FSA) and back-side alignment (BSA). It comprises of a 
special 3D-Align exposure table (with embedded optics for wafer 
alignment) and the electronics (and software) to route the alignment 
signal to the detector.


It is particularly useful for aligning device layers to thick epi, thick 
plated metal (in the case of MEMS devices) and color photoresist. It is 
cost effective as alignment marks are no longer printed on the 
front-side of the wafer & the number of process steps may also be reduced.


Normally, FTFA (Front-to-Front Alignment) is used on critical layers & 
BTBA (Back-to-Back Alignment) for non-critical layers. FTBA 
(Front-to-Back Alignment) is also a good alternative.

Paul's presentation will be on Wednesday, July 30, at 1 pm in CIS 101.

Your ASML Team

Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
mtang at

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