seminar: Materials and Technology for Monolithic Instruments May 20 (Tue) 4-5pm CISX-101

Peter Chen jwpchen at stanford.edu
Wed May 14 04:26:30 PDT 2008


Materials and Technology for Monolithic Instruments

Speaker:
Dr. Jeremy A. Theil, Process Integration Manager, Optisolar, Hayward, CA
94544

Abstract:
As CMOS process technology has matured over the past few years, a novel 
trend that has emerged is one in which new materials and structures are 
incorporated into or onto the integrated circuit to create novel 
devices. Monolithic instruments are systems that combine conventional
integrated circuits with novel solid-state components so they can
interact with the physical environment. Such systems can achieve cost
and performance enhancements through integration and miniaturization.
Examples include a-Si:H photodiode arrays, OLED-based microdisplays,
integrated biological and chemical detection systems, integrated optical 
and photonic systems, and digital micromirror displays. A non-exhaustive 
  list of materials include those that can be incorporated into 
integrated circuits such as (i) deposited semiconductors including 
a-Si:H and microcrystalline silicon; (ii) OLED materials; (iii) 
chemically active and inert conductors; and (iv) organic conductors; (v) 
biocompatible materials; and (vi) magnetic thin films. This presentation 
briefly touches upon recent trend in monolithic instrument device and 
applications and new fabrication techniques that are CMOS fab compatible.

BIOGRAPHY
Jeremy Theil is senior scientist and process integration manager at
Optisolar, Inc., where he works on high performance a-Si:H photovoltaic
modules for multi-MW solar farm installations.
Previously, he has worked at Agilent Technologies and Hewlett-Packard
where his focus was on advanced process technologies for mixed signal
integrated circuits, and monolithic instrument technology and 
applications. While there, he developed the state-of-the-art a Si:H
photodiode array technology for advanced CMOS imager applications. Prior
to joining Hewlett-Packard, he worked at Johnson Controls developing
thin film gas diffusion barriers. He received his Ph.D. in Materials
Science and Engineering from North Carolina State University, and is an 
author of more than 33 papers and 43 patents.



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