MEMS Packaging Seminar, Today, 11 am, CIS 101

Mary Tang mtang at
Mon Nov 3 08:27:56 PST 2008

*/WaFER LEVEL Vacuum/Hermetic Packaging of MEMS Devices/**//*

The purpose of this talk is to give an overview of MEMS packaging 
technologies developed at the Wireless Integrated Microsystems (WIMS) 
center at the University of Michigan. ePack, Inc. is a spin out of the 
University of Michigan—a short description of this company will be given 
at the end of the talk. ePack helps companies and researchers implement 
packaging technologies in order to encourage the commercialization of 
their MEMS devices.

Two sets of packaging technologies will be discussed. I) Low temperature 
wafer-level packaging processes for vacuum/hermeticity will be presented 
including various solder bonding and localized heating technologies. 
Vacuum pressures lower than 10 mTorr were achieved with yields as high 
as high as 90% and 3 years of package reliability data. II) A harsh 
environment robust micromechanical technology (HERMIT) for vibration, 
shock and thermal isolation as well as vacuum packaging. This technology 
involves flip chipping MEMS devices onto another wafer which has 
specially designed vibration/shock/thermal isolation structures where 
another substrate is then used for batch encapsulation of the devices. 
This technology was a DARPA funded project was specially developed for 
high performance gyroscopes, but can be applied to any type of MEMS device.

These technologies are a culmination of several bonding processes, 
feed-through technologies and various special materials.

*Jay Mitchell* is president and co-founder of ePack Corp., a company 
providing packaging services and expertise to companies and researchers 
in order to bring MEMS devices to market. He finished his doctorate in 
January of 2008. In the fall of 2002, he began the Ph.D. program at the 
University of Michigan in mechanical engineering. In his research he 
developed a Au-Si eutectic wafer-level packaging process and a low 
temperature localized heating technique for the hermetic/vacuum 
packaging of MEMS and microsystems. In 2000 and 2001, he worked for 
Movaz Networks in the testing and design of micromirrors for 
telecommunications applications. He received his B.S. and M.S. from Case 
Western Reserve University in 1999 and 2000, respectively. His research 
interests include: MEMS, micromachining technologies, micromachined 
sensors, actuators, and micropackaging.

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