Mechanics of Surface Effects in Nanoscale Device-Making and Manufacturing

Beth Pruitt pruitt at
Thu Nov 20 11:33:15 PST 2008

ME395 seminar today in Gates B12 at 4:15  (11/20)

K. Jimmy Hsia
Department of Mechanical Science and Engineering
University of Illinois at Urbana-Champaign
Urbana, IL 61801, USA
kjhsia at

Mechanics of Surface Effects in Nanoscale Device-Making and Manufacturing
Nanoscale science and technology has been an important frontier in 
research and development in the past decade. Miniaturization is the 
major driving force behind these research activities. As the 
characteristic dimensions of devices and MEMS/NEMS components become 
smaller, however, the surface to volume ratio of these components 
increases significantly. Consequently, many surface phenomena, such 
as capillary interactions and surface adhesion, become increasingly 
important. Many scientific issues of these phenomena can be best 
understood using a mechanics approach. In this talk, I will use two 
particular case studies to demonstrate that mechanics can indeed be a 
powerful tool to help understand these phenomena and provide guidance 
for nanomanufacturing and device-making. One case study considers the 
self-assembling process of a 3-D photovoltaic device made of thin 
silicon foil. The other studies the collapse of PDMS contact printing 
stamps. In both cases, models were developed to help understand the 
mechanisms controlling the behavior of these processes. Critical 
parameters emerge naturally from these analyses which can be used to 
guide the device formation and manufacturing of nanoscale components.

About the Speaker: Dr. K. Jimmy Hsia is Professor of Mechanical 
Science and Engineering at the University of Illinois at 
Urbana-Champaign where he has been on the engineering faculty for the 
past 16 years. He received his B.S. in Engineering Mechanics from 
Tsinghua University, Beijing, China, and his Ph.D. in Mechanical 
Engineering from MIT. He has been a Visiting Scientist at the 
Max-Planck Institute for Metals Research in Stuttgart, Germany, a 
Visiting Professor at Nagoya University in Japan, and a Visiting 
Professor at Shenyang National Laboratory for Materials Research in 
China. His research interests include deformation and failure 
mechanisms of materials at ambient and elevated temperatures, 
nano/micromechanics of materials, and nanoscale phenomena in 
biomaterials. He has served as Guest Editor/Co-Editor for several 
special issues of Materials Science and Engineering. He is recipient 
of an NSF Research Initiation Award, a Max-Planck Society 
Scholarship, and a Japan Society for Promotion of Science Fellowship. 
 From 2005-2007, Jimmy Hsia served as the Founding Director of Nano 
and Bio Mechanics & Materials Program in the Directorate for 
Engineering at the National Science Foundation (NSF). At NSF, he was 
actively involved in establishing the initiative of "Cellular and 
Biomolecular Engineering" for the new Office of Emerging Frontiers in 
Research and Innovation. He also participated in the Interagency 
Modeling and Analysis Group (IMAG) involving NSF, NIH, NASA, and DoE 
programs, and other multi-agency activities. Jimmy Hsia returned to 
teaching at the University of Illinois in Fall of 2007. He has been 
named an Associate of Center for Advanced Study at UIUC since August 
of 2008.
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