metal delamination during lift-off?
arguicha at stanford.edu
Mon Oct 20 23:16:13 PDT 2008
Has anyone ever experienced problems with metallization layers peeling
away during lift-off? I am trying to contact thin (~100 nm) regions
of Si with most of the electrode area in contact with SiO2. Using the
standard lift-off process flow outlined on SNF's website, I have tried
Pd - which supposedly has less than stellar edhesion to SiO2 - and Ni
which has good SiO2 adhesion. Both were deposited with Innotec. In
both attempts, the metals peeled off during the acetone bath step.
Any suggestions would be greatly appreciated.
More information about the labmembers