Question: Need to backside etch after about 3um LPCVD LTO deposition?

[Kyunglok Kim]

Dear labmembers,

I had deposited 3um LPCVD LTO on the silicon wafers.
The next several steps for the wafers include ASML lithography and STS DRIE.
In this case, should I etch out the oxide on the backside of Si wafers? Or
can I use ASML and STS DRIE without backside etching on sample wafers?

Thanks,
Kyunglok
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