wafer laser cutting
hunter at siliconlight.com
Wed Nov 17 08:56:41 PST 2010
All - Remy from APD gave me his contact info to forward on - contacting him directly for cutting services would be the most efficient.
American Precision Dicing, Inc.
642 Giguere Ct
San Jose, Ca 95133
Standard Dicing : www.wafer-dicing.com
Laser Dicing : www.silicon-chips.com & www.wafer-coring-resizing.com
From: Sebastian J. Osterfeld [sjo at stanford.edu]
Sent: Wednesday, November 17, 2010 8:25 AM
To: labmembers at snf.stanford.edu
Subject: Re: wafer laser cutting
I've used American Precision Dicing in San Jose for this before. They
have a special laser inside a water jet, which means the cutting zone
won't melt. This way you don't introduce heat damage and more
importantly, the process won't form a melted edge bead, meaning your
cutout will still be perfectly flat. This is important if you want to
use contact masks. The cutting edge will be slightly serrated, though,
as if someone had drilled thousands of 0.2mm dia. holes to form the cut.
On 11/16/2010 6:00 PM, Angie Lin wrote:
> Hi all,
> Does anyone know of any good wafer laser cutting services in the
> area? I'd like to cut a 2-inch round out of a Si wafer.
> Thanks for your help,
Sebastian J. Osterfeld, Ph.D.
Shan X. Wang Group
Dept. of Materials Science& Engineering
McCullough Building, Room 208A
476 Lomita Mall
Stanford, CA 94305-4045
Phone: (650) 906-1946
Fax: (650) 736-1984
Email: sjo at stanford.edu
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