wafer laser cutting

Jim Hunter hunter at siliconlight.com
Wed Nov 17 08:56:41 PST 2010


All - Remy from APD gave me his contact info to forward on - contacting him directly for cutting services would be the most efficient.
Jim

Remy Daniels
Business Development
American Precision Dicing, Inc.
 
642 Giguere Ct
San Jose, Ca 95133

Work: 408-254-1600
Cell:    925-272-8009
Text:   408-206-4442
Fax:    408-254-0999
 
Standard Dicing : www.wafer-dicing.com
Laser Dicing : www.silicon-chips.com & www.wafer-coring-resizing.com
________________________________________
From: Sebastian J. Osterfeld [sjo at stanford.edu]
Sent: Wednesday, November 17, 2010 8:25 AM
To: labmembers at snf.stanford.edu
Subject: Re: wafer laser cutting

I've used American Precision Dicing in San Jose for this before. They
have a special laser inside a water jet, which means the cutting zone
won't melt. This way you don't introduce heat damage and more
importantly, the process won't form a melted edge bead, meaning your
cutout will still be perfectly flat. This is important if you want to
use contact masks. The cutting edge will be slightly serrated, though,
as if someone had drilled thousands of 0.2mm dia. holes to form the cut.

Sebastian


On 11/16/2010 6:00 PM, Angie Lin wrote:
> Hi all,
>
> Does anyone know of any good wafer laser cutting services in the
> area?  I'd like to cut a 2-inch round out of a Si wafer.
>
> Thanks for your help,
> Angie


--
Sebastian J. Osterfeld, Ph.D.
Shan X. Wang Group
Dept. of Materials Science&  Engineering
Stanford University

McCullough Building, Room 208A
476 Lomita Mall
Stanford, CA 94305-4045

Phone:  (650) 906-1946
Fax:    (650) 736-1984
Email:  sjo at stanford.edu
Office:    http://maps.google.com/maps?f=q&hl=en&q=w122.1732+n37.4275&ll=37.427502,-122.173204&spn=0.006296,0.013561&t=h


More information about the labmembers mailing list