Vendor Presentation: Latest laser dicing technologies, Wed. 2 pm

Mary Tang mtang at stanford.edu
Tue Apr 26 18:03:21 PDT 2011


Dear labmembers:

At the invitation of one of your fellow labmembers, representatives from 
Disco Hi-Tec will be here Wednesday, April 27 at 2 pm for a technical 
presentation about advances in laser dicing.  This will be in the Allen 
101/Linvill conference room.  Here is a description of the presentation:

With recent advances in cutting, grinding, and polishing processes 
beyond abrasives, there is a great deal of enabling technologies suited 
to next generation products. Examples include Stealth Dicing, a 
completely dry, nearly particle free, high edge quality process using 
laser to singulate sensitive devices such as MEMS. Additionally, the 
drive for ultra thin wafers has produced several thinning and stress 
relief methods resulting in die thinner than 25um. This presentation 
will provide an overview of several new processes geared towards the 
unique requirements of cutting edge technologies.


All are welcome.

Your SNF Staff
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