Issue on wire bonding of my sample
jihwanan at stanford.edu
Wed Mar 16 23:30:27 PDT 2011
I got lots of replies when I asked about the connection between wire and
elctrode pad yesterday. Thanks.
But there is a issue in wire bonding my sample. My sample is ceramic, so it
is kind of brittle, and very thin (~60um). I'm a little afraid that
ultrasonic vibration of wire bonder might break it. Does anybody have
experience in wire bonding with this kind of sample ?
Thank you, all
Nanoscale Prototyping Laboratory (NPL)
Department of Mechanical Engineering
Stanford University, CA
cell : 650-862-0414
e-mail: jihwanan at stanford.edu
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