Regarding metal etching.
harris at snow.stanford.edu
Thu Mar 31 01:57:15 PDT 2011
The metals choice looks OK for most of what we do, but being able to easily do parts of wafers is absolutely critical.
On Mar 30, 2011, at 2:31 PM, Anu Chandran wrote:
> Hi All,
> This is a question for all who are/will be interested in metal etching. We are in the process of nailing down the specs for a new inductively coupled plasma metal etcher for SNF. I would like to solicit input from lab members as to what would be critical for them.
> In the wish list we already have the following:
> Metals to be etched :
> Au,Ag,Pt, Ti, Cr, Ni, Al
> Wafer Size:
> 4" to pieces
> Etch depth:
> up to 400nm
> 5% over wafer
> Shooting for <5nm rms. Seems like it varies a lot with metals and chemistry vs sputter etc.
> >85 deg
> Depends on chemistry and metal. Quite a range
> Please go ahead and add whatever you feel is important so that we can try to include it in the new system.
> Thanks a lot,
> Anu Chandran
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