Processing very thin substrates

Joseph McRae joe.mcrae at quswami.com
Mon Apr 2 11:19:01 PDT 2012


Does anyone have experience processing 'paper-thin' (~.05 mm) stainless steel round substrates? I am looking for any helpful hints in the areas of wafer bonding or fabricating wafer pockets to facilitate further processing.

Thanks,

Joe McRae
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://snf.stanford.edu/pipermail/labmembers/attachments/20120402/04835181/attachment.html>


More information about the labmembers mailing list