Low temperature bonding
achandra at kovio.com
Tue Mar 6 11:49:27 PST 2012
I'm looking for a low temperature method to connect our IC to etched copper on PET. The bond pads on the die are Al and are 100x100um in size. The connection must be low resistance to both Al and Cu, and the bonding temperature must be <150C. Al ultrasonic wirebonding has been attempted, but ultrasonic can damage our die and the connection to copper can be variable. Any and all suggestios are welcome.
Thanks for the help,
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