From apal at stanford.edu  Sat Sep  1 22:05:46 2012
From: apal at stanford.edu (Ashish Pal)
Date: Sat, 1 Sep 2012 22:05:46 -0700 (PDT)
Subject: Urgent need of silicon <111> wafer
In-Reply-To: <2072817270.22885523.1346561107943.JavaMail.root@zm09.stanford.edu>
Message-ID: <26013125.22891892.1346562346369.JavaMail.root@zm09.stanford.edu>

Hi,
We are in urgent need of <111> 4-inch silicon wafers in next few days. Either N- or P-type wafers would work. If anybody has some spare ones and willing to give us, we will be very grateful. We can pay for the wafers or order some more.

Please dont hesitate to contact me at 650-714-4565 or to reply to this e-mail if you can help us with the wafers.  

Best Regards
Ashish



From ashutosh.shastry at gmail.com  Sun Sep  2 12:36:21 2012
From: ashutosh.shastry at gmail.com (Ashutosh Shastry)
Date: Sun, 2 Sep 2012 12:36:21 -0700
Subject: Jim b
Message-ID: <E985C535-71C9-475D-8EE5-B898145F9F95@gmail.com>



Sent from my iPhone


From jwb2005 at stanford.edu  Wed Sep  5 16:46:50 2012
From: jwb2005 at stanford.edu (John Bumgarner)
Date: Wed, 05 Sep 2012 16:46:50 -0700
Subject: Reminder: Coral software information update meeting (Badger)
In-Reply-To: <503298D2.90303@stanford.edu>
References: <503298D2.90303@stanford.edu>
Message-ID: <5047E46A.2010401@stanford.edu>

Just a reminder of the update tomorrow.  See below.

Regards,  John


-------- Original Message --------
Subject: 	Coral software information update meeting (Badger)
Date: 	Mon, 20 Aug 2012 13:06:42 -0700
From: 	John Bumgarner <jwb2005 at stanford.edu>
To: 	labmembers at snf.stanford.edu



Hello all,

Stanford has invested significantly in producing an upgraded version of
Coral lab management software, now called Badger.  SNF is planning to
convert to this during the winter shutdown.

Badger maintains a similar look to Coral and the same functionality, but
with some improvements.

I have asked Michael Bell to provide an introduction and update to all
the interested lab members on Sept 6 at 10 am in the AllenX conference
room, 101X.  Please attend if you want to learn more.

Regards,

John




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From mtang at stanford.edu  Thu Sep  6 06:29:03 2012
From: mtang at stanford.edu (Mary Tang)
Date: Thu, 06 Sep 2012 06:29:03 -0700
Subject: Process Clinic today @11
Message-ID: <5048A51F.9020008@stanford.edu>

Hi all --

Just a reminder of the Process Clinic, today, at 11 am in the cube area 
near Maureen's office.  Bring process questions, process run sheets, 
mask layouts, etc.  Staff will be on hand to brainstorm ideas.  (After 
the Badger presentation in the Auditorium at 10 am.)

Your SNF Staff


From edmyers at stanford.edu  Thu Sep  6 13:53:14 2012
From: edmyers at stanford.edu (Ed Myers)
Date: Thu, 06 Sep 2012 13:53:14 -0700
Subject: Fwd: Fwd: Plasma-Therm Technical Workshop: Fundamentals of Plasma
 Processing (Etching and Deposition)
In-Reply-To: <503FA4AE.7060004@stanford.edu>
References: <503FA4AE.7060004@stanford.edu>
Message-ID: <50490D3A.1000102@stanford.edu>

All,

Thank you for the tremendous support.  As of now, registration is 
officially closed.

I have received a number of inquires regarding acknowledgement of 
registration.  The web site was not configured to send out any 
acknowledgements.  If you successfully completed the registration form, 
then your attendance has been captured and we are planning on your 
attendance.

Those on the waiting list who registered prior to noon today, should 
plan on attending.  We may have slightly overbooked the seats, but we 
will not know until everyone arrives.

Plasma-Therm and SNF look forward to seeing everyone on Monday.
Regards,


-------- Original Message --------
Subject: 	Fwd: Plasma-Therm Technical Workshop: Fundamentals of Plasma 
Processing (Etching and Deposition)
Date: 	Thu, 30 Aug 2012 10:36:46 -0700
From: 	Ed Myers <edmyers at stanford.edu>
To: 	labmembers at snf.stanford.edu



All,

Due to the overwhelming response, we have reached the allowable 
occupancy level in the conference room.  I encourage you to still sign 
up, but please be aware it will be on a waiting list status.

I also encourage those who have registered and know they will not be 
attending the full two days to let me know.  I'm sure you don't want to 
be responsible for preventing anyone from attending.

Regards,
Ed

-------- Original Message --------
Subject: 	Plasma-Therm Technical Workshop: Fundamentals of Plasma 
Processing (Etching and Deposition)
Date: 	Thu, 09 Aug 2012 16:28:22 -0700
From: 	Ed Myers <edmyers at stanford.edu>
To: 	labmembers at snf.stanford.edu
CC: 	Lishan, David (Plasma-Therm LLC) <david.lishan at plasmatherm.com>



All,

SNF and Plasma-Therm would like to invite you and your team members to
attend the Plasma-Therm Technical Workshop: Fundamentals of Plasma
Processing (Etching and Deposition) to be held at the Stanford
University on September 10 and 11, 2012.

The Workshop is intended to provide understanding and insight to those
working with plasma etching and deposition processes and equipment. The
goal is to help researchers make faster progress on projects requiring
plasma processing. The course has been very well received at Harvard, UC
Berkeley, UCLA, Notre Dame, USF, IMRE, Israel, and Lund University.
Graduate students, post docs, professors, and staff have all found the
material useful.

The format encourages questions and we hope attendees take advantage of
the opportunity for networking and discussing their projects. The
workshop is meant to encourage cooperation within the academic and
industrial research communities.

Please be assured that the course is not an advertisement about
Plasma-Therm products.  Aside from a very brief 15 min introduction to
Plasma-Therm, the rest of the day is dedicated to education on
fundamentals and advanced etching and plasma-enhanced chemical vapor
deposition technology. Presentation materials are equally useful to
those that do and do not have our equipment.

Details regarding the Workshop objectives, agenda, location, and speaker
can be found on the attached flyer.

Please note that the workshop is free and registration is requested
online by August 31, 2012 at the website:
http://www.surveymonkey.com/s/FPQLZPQ

Regards,
SNF Staff and Plasma-Therm







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From mbaran at stanford.edu  Thu Sep  6 14:39:10 2012
From: mbaran at stanford.edu (Maureen Baran)
Date: Thu, 6 Sep 2012 14:39:10 -0700 (PDT)
Subject: Lost Car Keys and Phone - Please Claim
Message-ID: <001101cd8c78$0a2fee90$1e8fcbb0$@stanford.edu>

Dear All,

 

A concerned lab member found keys and phone at the coral workstation near
Uli and Jeannie's office.  If these items are yours please come by my
cubicle # 41 and claim.

 

Maureen

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From yoonjungster at gmail.com  Thu Sep  6 15:47:45 2012
From: yoonjungster at gmail.com (Esther Chang)
Date: Thu, 6 Sep 2012 15:47:45 -0700
Subject: Question on thin crystalline SiC growth
Message-ID: <CAKZ9CMSybrCsB91Zkxrj90q8JH6Rw-wjoUwTRFSZ_-4Ri8ALEw@mail.gmail.com>

Dear lab members,

Does anyone have any experience in depositing very thin (~5nm or less) SiC
film or carbonizing the Si surface in CVD machine?

Your help will be greatly appreciated.

-- 
Kind Regards,
Esther Chang
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From bhuff at stanford.edu  Mon Sep 10 08:50:52 2012
From: bhuff at stanford.edu (Brett Huff)
Date: Mon, 10 Sep 2012 08:50:52 -0700
Subject: SNF Tool Discipline Disqual Policy
Message-ID: <A532CFB5-FF45-4F12-8AB7-258341DBF079@stanford.edu>

Labmembers,
	
	The attached policy is being provided for your review.  It is open to SNF User feedback for the next two weeks.  At that time any accepted modifications will be incorporated and the document will be added to the SNF WIKI for future education and disciplinary reference.




Brett E. Huff
SNF Clean Room Manager
Stanford University
?510-612-8670
bhuff at stanford.edu

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From bhuff at stanford.edu  Mon Sep 10 09:06:10 2012
From: bhuff at stanford.edu (Brett Huff)
Date: Mon, 10 Sep 2012 09:06:10 -0700
Subject: SNF Policy for Incoming Wafer Contamination Evaluation
Message-ID: <CDB759DD-3B4A-4F0C-A833-9EC2DB20E937@stanford.edu>

Labmembers,
	
	The attached policy is being provided for your review.  It is open to SNF User feedback for the next two weeks.  At that time any accepted modifications will be incorporated and the document will be added to the SNF WIKI for future reference.




Brett E. Huff
SNF Clean Room Manager
Stanford University
?510-612-8670
bhuff at stanford.edu

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From pradeep.nataraj at gmail.com  Mon Sep 10 09:46:20 2012
From: pradeep.nataraj at gmail.com (Pradeep Nataraj)
Date: Mon, 10 Sep 2012 09:46:20 -0700
Subject: SNF Policy for Incoming Wafer Contamination Evaluation
In-Reply-To: <CDB759DD-3B4A-4F0C-A833-9EC2DB20E937@stanford.edu>
References: <CDB759DD-3B4A-4F0C-A833-9EC2DB20E937@stanford.edu>
Message-ID: <CAEhDSuaV=Zk=AAdpWCG2-ymFsYi=2k_diQv1bw93AMXTfw4rmw@mail.gmail.com>

Bret,
Not to be rude, but how do we know the current contamination levels on the
clean tools in SNF?
SNF needs to do its own TXRF reports on clean tools, before going after
users.
Please let me know.

Pradeep



On Mon, Sep 10, 2012 at 9:06 AM, Brett Huff <bhuff at stanford.edu> wrote:

> Labmembers,
>  The attached policy is being provided for your review.  It is open to
> SNF User feedback for the next two weeks.  At that time any accepted
> modifications will be incorporated and the document will be added to the
> SNF WIKI for future reference.
>
>
>
>
> Brett E. Huff
> SNF Clean Room Manager
> Stanford University
> ?510-612-8670
> bhuff at stanford.edu
>
>
>
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From rcalvo at stanford.edu  Mon Sep 10 20:44:28 2012
From: rcalvo at stanford.edu (Reyes)
Date: Mon, 10 Sep 2012 20:44:28 -0700
Subject: ITO deposition for transparent conductive electrodes
Message-ID: <CAAAAsA2-j_tzGjWkC2VxXWtfJdJsFe1PjaxJAgJCXvMoB9_-+A@mail.gmail.com>

Dear labmembers,

 does anyone deposit ITO (indium tin oxide) for optically transparent gate
electrodes?
If so, which technique do you use? We would like to use it with a material
where we can not exceed 80 degrees Celsius during processing. Does anyone
think this is possible?

Thanks in advance!

Reyes

Dr. Reyes Calvo
Marie Curie IOF Postdoctoral Fellow
Goldhaber-Gordon Lab
Geballe Laboratory for Advanced Materials
McCullough Building, 476 Lomita Mall
Stanford University
Stanford, CA 94305-4045
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From jaehlee at stanford.edu  Thu Sep 13 11:25:51 2012
From: jaehlee at stanford.edu (Jae Hyung Lee)
Date: Thu, 13 Sep 2012 11:25:51 -0700
Subject: Fwd: [ee-doctorate] Oral Exam Announcement: Jae Hyung Lee
In-Reply-To: <5052215C.1010901@ee.stanford.edu>
References: <5052215C.1010901@ee.stanford.edu>
Message-ID: <CACY7+FMiFWQ0pdcOJpshduLgNpKVDuanuXVssX34Syq4OFRo8w@mail.gmail.com>

Dear lab members,

I would like to invite you all to my defense talk on Sep 24th 9 am on
Monday. Thank you very much!

Best,
Jae

---------- Forwarded message ----------
From: Student Services <studentservices at ee.stanford.edu>
Date: Thu, Sep 13, 2012 at 11:09 AM
Subject: [ee-doctorate] Oral Exam Announcement: Jae Hyung Lee
To: ee-students at lists.stanford.edu


 PhD Dissertation Defense

 *Microfabricated Thermionic Energy Converters for Solar Electricity
Generation*

 Jae Hyung Lee
 Department of Electrical Engineering
 Advisor: Prof. Roger T. Howe

 Monday September 24th 2012
 09:15 am
 (Refreshments at 09:00 am)

 Location: Paul G. Allen Building Annex (CIS-X) Auditorium

Abstract:

 Solar is the most attractive renewable energy source because it has the
potential to meet global energy demands and is present everywhere. However,
existing solar cells can be inefficient due to heat generated while
converting solar light to electricity. Our novel approach to solid-state
solar power, thermionic energy converters (TECs), are unique heat engines
that convert heat directly to electricity at very high temperatures. This
energy conversion process is based on thermionic emission?the evaporation
of electrons from conductors at high temperatures. In its simplest form,
the converter consists of two electrodes in the parallel-capacitor geometry
and uses the thermionically-emitted current to drive a useful load. In
addition, by using a p-type semiconductor material in the emitter
electrode, the extra conduction band carrier population created by
photoexcitation can enable a new type of electron emission process called
photon-enhanced thermionic emission (PETE) process. Microfabricated TECs
(?-TECs) could be used as efficient topping cycles in future concentrated
solar thermal power plants as well as for residential co-generation using
natural gas.
 This talk will cover four key areas of my research on ?-TECs. I will
discuss our prototypes of the mechanically and thermally robust ?-TECs,
including the optimal emitter-collector gap calculation, structural design,
and device fabrication, as well as our recent approach for the stand-alone
(encapsulated) ?-TECs. I will also introduce the work function lowering
technique through barium & barium oxide coating on the SiC emitter, and the
first observation of photon-enhanced thermionic emission from a thin-film
microfabricated emitter. Finally, I will talk about our recent fabrication
development of smart-cut layer transfer using Spin-on-Glass (SoG).



--
EE students mailing list
ee-students at lists.stanford.edu
https://mailman.stanford.edu/mailman/listinfo/ee-students

_______________________________________________
ee-doctorate mailing list
ee-doctorate at lists.stanford.edu
https://mailman.stanford.edu/mailman/listinfo/ee-doctorate
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From shott at stanford.edu  Thu Sep 13 12:57:23 2012
From: shott at stanford.edu (John Shott)
Date: Thu, 13 Sep 2012 12:57:23 -0700
Subject: https://snf.stanford.edu/SNF will be down early tomorrow morning
 ...
Message-ID: <50523AA3.8010401@stanford.edu>

SNF Lab Members:

The portion of our web site available under https://snf.stanford.edu/SNF 
(AKA "the wiki") will be down early tomorrow morning starting at about 6 
a.m. for upgrades to the underlying Plone content management system.

These upgrades may take as much as 2-3 hours.  The remainder of the 
snf.stanford.edu and everything related to running Coral and/or 
xReporter will be fully functional during that entire time.

These changes will be the first step in addressing the sluggish response 
that you see on that portion of the web site.

Let me know if you have any questions and thank you for your continued 
support,

John



From edmyers at stanford.edu  Fri Sep 14 10:23:35 2012
From: edmyers at stanford.edu (Ed Myers)
Date: Fri, 14 Sep 2012 10:23:35 -0700
Subject: Etcher Installation Update
Message-ID: <50536817.1000905@stanford.edu>

All,

I am please to announce that we have crossed the most significant 
hurdles in the etcher installation project.  We have two of the three 
County signatures required for completion of the installation project.  
The two signatures we have are the most difficult to obtain.  I 
anticipate receiving the final signature early next week.  The timing 
works out well as both Oxford and Plasma-Therm are scheduled to begin 
the process start-up on all four tools next week.  I anticipate the 
start-up effort to take one or two weeks for all the tools.  Once the 
tools pass the companies start-up procedures they will be released to 
the SNF.

Having the tools released to the SNF does not mean they are ready for 
general use.  The performance of the tools need to be documented (some 
companies call this finger printing of the tool).  The idea is to 
capture the performance of items such as pump down curves, leak-up 
rates, source power curves, heating and cooling rates, pressure vs. 
flow, etc...  Once this is accomplished we will need to look at the 
robustness of the standard, factory recommended recipes.  This will 
involve running some DoE experiments of the base recipes.  The object 
here is to understand and document the various input parameters with the 
resulting outputs.  While this information is being collected we will 
work with lab member community to identify specific etching needs which 
need to be developed.  We will assemble the requests and develop simple 
screening and Response Surface DoE's to help us develop a suite of recipes.

In order to expedite the learning process, I am asking interested lab 
members, who are willing to help define, run and characterize the 
resulting DoE wafer splits.  If you are willing to contribute to the 
community knowledge base please contact Ed Myers.  If you have specific 
needs for your etch, please send me these requirements so we can add it 
the required development list.

As a reminder the new etch tools include:
Plasma-Therm dielectric etcher
Plasma-Therm metal etcher
Plasma-Therm deep silicon etcher
Oxford III-V or compound semiconductor etcher

Regards,
SNF Staff


From nperez at stanford.edu  Fri Sep 14 15:19:39 2012
From: nperez at stanford.edu (Jeannie Perez)
Date: Fri, 14 Sep 2012 15:19:39 -0700
Subject: Cell  phone found in gowning room
Message-ID: <5053AD7B.9070502@stanford.edu>

See Maurice in his office.
JP
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From vijayp at stanford.edu  Mon Sep 17 09:34:50 2012
From: vijayp at stanford.edu (Vijay Parameshwaran)
Date: Mon, 17 Sep 2012 09:34:50 -0700 (PDT)
Subject: Wet etch strip of Ti/Al/Ni/Au stack
In-Reply-To: <908599824.93611603.1347899337010.JavaMail.root@zm02.stanford.edu>
Message-ID: <53951051.93640005.1347899690189.JavaMail.root@zm02.stanford.edu>

Hi SNF people,

I would like to strip a metal stack of Ti/Al/Ni/Au with a wet etching recipe, but I'm not too sure what chemicals would be best suitable.  

My original thought was to remove the Au, Ni, and Al layers with aqua regia solution, and then remove the Ti layer with dilute HF, but I am not sure if this will work.  

Does anyone with experience have any better ideas?

Thanks,

Vijay Parameshwaran
vijayp at stanford.edu  


From hector at AsylumResearch.com  Mon Sep 17 13:47:53 2012
From: hector at AsylumResearch.com (Hector Cavazos)
Date: Mon, 17 Sep 2012 20:47:53 +0000
Subject: help with platinum silicide
Message-ID: <5A653CAD436BD74F8BAD5CA6872A3475F2EF3D@Ex2010.AsylumResearch.com>

Does anyone out there know of a good vendor who implants platinum into silicon?

Thanks,
Hector

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From edmyers at stanford.edu  Wed Sep 19 16:31:11 2012
From: edmyers at stanford.edu (Ed Myers)
Date: Wed, 19 Sep 2012 16:31:11 -0700
Subject: SNF etcher are fully permitted
Message-ID: <505A55BF.9090507@stanford.edu>

All,

We are pleased to report all four of the new etchers (dielectric, metal, 
deep silicon and the III-V) have completed the county permitting 
process.  We are now able to turn on all of the dozen, or so gases 
plumbed to the systems.  What remains ahead of us is the vendor start-up 
of the tools and our etch process characterizations.

At this time, Plasma-Therm is doing their installation start-up tests on 
the dielectric and metal etchers.  Their deep silicon process engineer 
will be on site next week.  It is the expectation of Plasma-Therm that 
all three of their etchers will be released to us by Friday, Sept. 
28th.  The Oxford III-V etcher is running a little slower.  I have a 
commitment from Oxford today saying they will have someone on site by no 
later than Monday, Sept. 24th to complete the tool installation and 
start-up.  I believe the Oxford is running about a week behind the 
Plasma-Therm systems and expect it to be released around Friday, Oct. 5th.

Once the tools are released, it is up the staff and the SNF community to 
drive the characterization of the etches.  The date for full release of 
the systems depends on how much manpower we can pull together to work 
through the characterizations.  Each etch vendor has recommended recipes 
for the more common etches.  We need to verify and document the 
performance for each of these recipes.  This requires the correct 
substrate material stacks, photolithography masking, etch recipe splits, 
metrology for etch rates, selectivity, CD loss, sidewall profiles, 
documentation of the operation procedures and updating the wiki.  Each 
recipe could take two full, hard weeks to collect all of this 
information.  When you multiply four etchers with multiple recipes, the 
total characterization time expands quickly.  If we all pull together we 
could start opening these systems up to the community by the end of 
October.

Regards,
SNF Staff


From shott at stanford.edu  Thu Sep 20 06:55:59 2012
From: shott at stanford.edu (John Shott)
Date: Thu, 20 Sep 2012 06:55:59 -0700
Subject: MS patches for IE 0-day
Message-ID: <505B206F.3030100@stanford.edu>

SNF Lab Members:

Earlier this week a zero-day bug affecting Microsoft Internet Explorer 
(their browser) was reported.  Microsoft has just released an emergency 
fix for this problem and will likely have a second, more comprehensive 
patch, tomorrow.  If you use Internet Explorer on a Windows desktop or 
laptop you are at risk.

Here is a message from John Gerth in the Computer Science department who 
keeps on top of such things.  The first link in his post that starts 
with blogs.technet.com will take you to an article which has a like to 
the Microsoft Fix it 50939 that addresses this issue.  This Fix it will 
not require a reboot of your machine and I suggest that you install it 
at your earliest convenience.

While this vulnerability has nothing directly to do with SNF or Coral, I 
sent it out in hopes of preventing you and your machines from being 
adversely affected by exploits taking advantage of this flaw.  Also, I 
trust that SNF staff will not only apply this patch to their own laptops 
and desktops, but to lab equipment running Windows that may also have 
Internet Explorer.

Thank you for your attention,

John

-------- Original Message --------
Subject: 	[GECOS] MS patches for IE 0-day
Date: 	Thu, 20 Sep 2012 00:29:43 -0700
From: 	John Gerth <gerth at graphics.stanford.edu>
Organization: 	Stanford University
To: 	SOE - GECOS <gecos at island.stanford.edu>



There's an emergency fixit available today....full patch due Friday Sep 21
   http://blogs.technet.com/b/msrc/archive/2012/09/19/internet-explorer-fix-it-available-now-security-update-scheduled-for-friday.aspx

SANS...
   http://isc.sans.edu/diary/IE+Fixes+Available/14134
Krebs...
   http://krebsonsecurity.com/2012/09/microsoft-issues-stopgap-fix-for-ie-0-day-flaw/

-- 
John Gerth      gerth at graphics.stanford.edu  Gates 378   (650) 725-3273
_______________________________________________
GECOS mailing list
GECOS at island.stanford.edu
http://island.stanford.edu/cgi-bin/mailman/listinfo/gecos

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From mahnaz at stanford.edu  Thu Sep 20 08:29:27 2012
From: mahnaz at stanford.edu (Mahnaz Mansourpour)
Date: Thu, 20 Sep 2012 08:29:27 -0700
Subject: process clinic
Message-ID: <505B3657.1030106@stanford.edu>

Hello all,


Just a reminder of the Process Clinic, today, at 11 am in the cube area 
near Maureen's office.  Bring process questions, process run sheets, 
mask layouts, etc.  Staff will be on hand to brainstorm ideas.

Staff


From bhuff at stanford.edu  Thu Sep 20 13:42:25 2012
From: bhuff at stanford.edu (Brett Huff)
Date: Thu, 20 Sep 2012 13:42:25 -0700
Subject: Make up in the SNF cleanroom.  Not allowed under any circumstance.
References: <EDC4C3DF-D1CF-4BD1-AB9A-059FC550E1C0@stanford.edu>
Message-ID: <0719545F-3531-4505-BD05-C24CE8C7A3EF@stanford.edu>

SNF Lab Members,
	
	The image below is of a brand new cleanroom hood.  Although I have no direct evidence or the funds to go after proving it, this is typical stain caused by make up, destroying this hood.

Please!  User know that make up along with many hair care products are not allowed in the fab.  If a user is found wearing make up they will be asked to exit the fab immediately and may also
be subject to fab disciplinary action such as being excluded from fab access.

If you are giving a tour inside the fab to non-lab personnel, please be responsibility and exclude individuals when obviously not dressed with proper attire (shoes) or when make up may be present.  



Brett E. Huff
SNF Clean Room Manager
Stanford University
?510-612-8670
bhuff at stanford.edu
> 
> 
> 

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From jaehlee at stanford.edu  Thu Sep 20 19:34:00 2012
From: jaehlee at stanford.edu (Jae Hyung Lee)
Date: Thu, 20 Sep 2012 19:34:00 -0700
Subject: Reminder - Oral Exam Announcement: Jae Hyung Lee
Message-ID: <CACY7+FOeZ8bRi+GZ0keV_pf=v+UT3N5E64BCjWABe-S5MSysPg@mail.gmail.com>

---------- Forwarded message ----------
From: Student Services <studentservices at ee.stanford.edu>
Date: Thu, Sep 13, 2012 at 11:09 AM
Subject: [ee-doctorate] Oral Exam Announcement: Jae Hyung Lee
To: ee-students at lists.stanford.edu


 PhD Dissertation Defense

 *Microfabricated Thermionic Energy Converters*

 Jae Hyung Lee
 Department of Electrical Engineering
 Advisor: Prof. Roger T. Howe

 Monday September 24th 2012
 09:15 am
 (Refreshments at 09:00 am)

 Location: Paul G. Allen Building Annex (CIS-X) Auditorium

Abstract:

 Thermionic energy converters (TECs) are unique heat engines that convert
heat directly to electricity at very high temperatures. This energy
conversion process is based on thermionic emission?the evaporation of
electrons from conductors at high temperatures. In its simplest form, the
converter consists of two electrodes in the parallel-capacitor geometry and
uses the thermionically-emitted current to drive a useful load. In
addition, by using a p-type semiconductor material in the emitter
electrode, the extra conduction band carrier population created by
photoexcitation can enable a new type of electron emission process called
photon-enhanced thermionic emission (PETE) process. Microfabricated TECs
(?-TECs) could be used as efficient topping cycles in future concentrated
solar thermal power plants as well as for residential co-generation using
natural gas.
 This talk will cover four key areas of my research on ?-TECs. I will
discuss our prototypes of the mechanically and thermally robust ?-TECs,
including the optimal emitter-collector gap calculation, structural design,
and device fabrication, as well as our recent approach for the stand-alone
(encapsulated) ?-TECs. I will also introduce the work function lowering
technique through barium & barium oxide coating on the SiC emitter, and the
first observation of photon-enhanced thermionic emission from a thin-film
microfabricated emitter. Finally, I will talk about our recent fabrication
development of smart-cut layer transfer using Spin-on-Glass (SoG).



--
EE students mailing list
ee-students at lists.stanford.edu
https://mailman.stanford.edu/mailman/listinfo/ee-students

_______________________________________________
ee-doctorate mailing list
ee-doctorate at lists.stanford.edu
https://mailman.stanford.edu/mailman/listinfo/ee-doctorate
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From jweisse at stanford.edu  Fri Sep 21 09:50:43 2012
From: jweisse at stanford.edu (Jeffrey M. Weisse)
Date: Fri, 21 Sep 2012 09:50:43 -0700 (PDT)
Subject: HF compatible conductivity meter
In-Reply-To: <1040137099.81521353.1348245942189.JavaMail.root@zm06.stanford.edu>
Message-ID: <1768294464.81525601.1348246243269.JavaMail.root@zm06.stanford.edu>

Dear Labmembers,

Does anyone have access to a solution conductivity meter that is compatible with HF?  I have a solution of 1:1 49%HF:Ethanol that I would like to measure its conductivity.

Thank you,

Jeff



From kwankyup at stanford.edu  Mon Sep 24 10:31:10 2012
From: kwankyup at stanford.edu (Kwan Kyu Park)
Date: Mon, 24 Sep 2012 10:31:10 -0700
Subject: SNF Policy for Incoming Wafer Contamination Evaluation
In-Reply-To: <CDB759DD-3B4A-4F0C-A833-9EC2DB20E937@stanford.edu>
References: <CDB759DD-3B4A-4F0C-A833-9EC2DB20E937@stanford.edu>
Message-ID: <5855747B-6FAD-4F3D-8449-5389A6A0A172@stanford.edu>

Dear Brett,

Overall, we agree that having good contamination control is critical to the SNF. 
Our group (Khuri-Yakub group) has many users, who will be affected by the policy, so we would like to add some questions and make comments and suggestions to the proposed policy. 

- Certified clean tool on campus, but outside of the SNF.
Wafers are processed at a shared facilities on campus such as the Ginzton micro-fabrication facility (Nano Building) and the Stanford Nanocharacterization Lab (Nano building) and users' own labs. How does the policy apply to these facilities on campus? It would be helpful if some of these tools and processes are considered to be clean.

- If there are certified clean labs, the policy should state that a list of clean labs will be maintained on the SNF website. It will be very helpful for many users if the list of the information is posted and updated by staff members.  

- The policy stated that "If certification procedures are not deemed sufficient by SNF staff, TXRF requirements and success criteria will apply." Before the implementation of the policy, we would like to see examples of the certification procedure on the SNF website for all users. 

- Frequency of the submission of the information (including TXRF).
In the case of an off-campus vendor, in which we regularly process wafers, will we still need to submit TXRF every time? Guidelines for the frequency of submission of data to SNF/CCB Spec Mat should be specified before implementation. 

- TXRF source.
Similarly, a list of vendors for TXRF data could be posted on the SNF website. 

- Applicable process. 
Currently, the policy only directly refers to films deposited outside of SNF but it is assumed all incoming wafers are subject to the policy. This should be clearly stated to include all outside processing.  

- Current contamination level of the SNF
As the other user suggested last week, we are also interested in the current status of our machine. It will also be valuable information to the all users in SNF and the SNF/CCB members.

I don't think all the information needs to be included in the policy. However, more detailed information should be posted in SNF website for the users, who do not have significant or any experience with TXRF or more generally processing and contamination.

Regards, 

Kwan-Kyu

__________________________
Kwan-Kyu Park, Ph. D.
Research Associate
E. L. Ginzton Laboratory, 
Center for Nanoscale Science and Engineering
345 Via Peublo
Stanford University
Stanford, CA 94305
Tel: 650-353-1376
email: kwankyup at stanford.edu






On Sep 10, 2012, at 9:06 AM, Brett Huff wrote:

> Labmembers,
> 	
> 	The attached policy is being provided for your review.  It is open to SNF User feedback for the next two weeks.  At that time any accepted modifications will be incorporated and the document will be added to the SNF WIKI for future reference.
> 
> <Incoming Wafer Contamination Policy.doc>
> 
> 
> Brett E. Huff
> SNF Clean Room Manager
> Stanford University
> ?510-612-8670
> bhuff at stanford.edu
> 

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From kwankyup at stanford.edu  Mon Sep 24 10:33:32 2012
From: kwankyup at stanford.edu (Kwan Kyu Park)
Date: Mon, 24 Sep 2012 10:33:32 -0700
Subject: SNF Tool Discipline Disqual Policy
In-Reply-To: <A532CFB5-FF45-4F12-8AB7-258341DBF079@stanford.edu>
References: <A532CFB5-FF45-4F12-8AB7-258341DBF079@stanford.edu>
Message-ID: <BC32B23F-338F-4312-A3DF-9DD73F7058A3@stanford.edu>

Dear Brett, 

I understand this new policy is for documenting the disqualification of a user from a tool, that was done before occasionally. 

I would suggest to include the SNF Faculty Director and the offending user's supervisor in the communication during the investigation. I think they should know how the user violated the rule and how the disqualification is decided, before they get the email notification of the final decision.

In addition, there should be a formal appeal process that can handle any conflict or disagreement. 

Regards, 

Kwan-Kyu 
__________________________
Kwan-Kyu Park, Ph. D.
Research Associate
E. L. Ginzton Laboratory, 
Center for Nanoscale Science and Engineering
345 Via Peublo
Stanford University
Stanford, CA 94305
Tel: 650-353-1376
email: kwankyup at stanford.edu






On Sep 10, 2012, at 8:50 AM, Brett Huff wrote:

> Labmembers,
> 	
> 	The attached policy is being provided for your review.  It is open to SNF User feedback for the next two weeks.  At that time any accepted modifications will be incorporated and the document will be added to the SNF WIKI for future education and disciplinary reference.
> 
> <Tool Discipline Disqual Policy.docx>
> 
> 
> Brett E. Huff
> SNF Clean Room Manager
> Stanford University
> ?510-612-8670
> bhuff at stanford.edu
> 

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From bhuff at stanford.edu  Mon Sep 24 11:28:10 2012
From: bhuff at stanford.edu (Brett Huff)
Date: Mon, 24 Sep 2012 11:28:10 -0700
Subject: Data Clean Corp our new cleanroom cleaning services to start Saturday, Sept 29th from 12-7am.  SNF will be closed.
Message-ID: <74CCEF94-6506-43E6-BA5A-91BE838A5801@stanford.edu>

All,
	SNF Closure, Saturday, September 29 from 12 - 7 am.


	Data Clean Corp is currently scheduled to be here this Friday night / Saturday morning to perform what will be a monthly cleaning service.
The SNF facility will be closed from 12:00 am and reopening at 7:00 am.  Please plan your late night activities accordingly.   
I will be onsite supervising at this time if you have an emergency need for access please contact me by my cell below to 
discuss your needs.  I will allow unloading of long run activities but you must schedule it with me.

Please, if you have substrates and other clutter about that can be "put away" it will help to maximize the quality of the cleaning services provided.
They will not work near open substrates or other areas where in their judgement they may impact someones efforts.  
I will be present to disposition items as needed to get the best clean for our money.  

Your bins will be the safest location and undisturbed.

I will be onsite for this activity and in the cleanroom for the evening.

This month will be a single Friday closure for horizontal surfaces and floors.  
Once per Quarter we will close two Friday nights for a "Quarterly" which includes ceiling and wall cleaning.  Likely in Oct.

Anyone like working 12-7?
Brett E. Huff
SNF Clean Room Manager
Stanford University
?510-612-8670
bhuff at stanford.edu

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From mtang at stanford.edu  Mon Sep 24 14:19:55 2012
From: mtang at stanford.edu (Mary Tang)
Date: Mon, 24 Sep 2012 14:19:55 -0700
Subject: Construction activity in the cleanroom, Tuesday morning (9/25/12)
Message-ID: <5060CE7B.7030303@stanford.edu>

Dear labmembers --

Exterior lab doors will be open and shut momentarily Tuesday morning for 
inspections.  Please do be aware of this activity, as you may want to 
avoid working in those areas while the lab doors are inspected.  The 
contractor will be escorted by staff.  We will try to keep disruption to 
a minimum and we don't anticipate any major breach to the cleanroom 
integrity.  Inspections should be done by mid-morning.

Just some background:  This is one of the last remaining tasks of the 
SNF Renovation project.  Starting in November, doors throughout the lab 
and the building will be replaced or ugpraded to meet current fire 
regulations.

If you have questions or concerns,  please contact your favorite staff 
member --

Your SNF Staff

-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
Paul G. Allen Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu



From mbaran at stanford.edu  Wed Sep 26 09:38:07 2012
From: mbaran at stanford.edu (Maureen Baran)
Date: Wed, 26 Sep 2012 09:38:07 -0700 (PDT)
Subject: Found NetApp Black Tote Bag in Conference Room 101 - Please Claim if Yours
Message-ID: <010401cd9c05$5464e3c0$fd2eab40$@stanford.edu>

Dear All,

A black tote bag with NetApp go further, faster logo on the front has been
found in the Allen Conference 101 and given to me for safe keeping.  If
this sounds like sometime you have misplace come by my cubicle #41 and
claim it.

 

Maureen

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From bhuff at stanford.edu  Thu Sep 27 11:58:21 2012
From: bhuff at stanford.edu (Brett Huff)
Date: Thu, 27 Sep 2012 11:58:21 -0700
Subject: Fab Closure Reminder:  Friday Night - Saturday Morning (Midnight to 7:00am)
Message-ID: <F0FD4CC9-0274-4491-880D-AEC80AB72422@stanford.edu>

Reminder that there will not be access to the SNF cleanroom Friday night at midnight until 7:00am Saturday morning.
The fab will be closed for its first professional monthly cleaning.

Please feel to direct any question you may have, my way.

Brett E. Huff
SNF Clean Room Manager
Stanford University
?510-612-8670
bhuff at stanford.edu

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From yueguo at stanford.edu  Fri Sep 28 13:55:57 2012
From: yueguo at stanford.edu (yueguo)
Date: Fri, 28 Sep 2012 13:55:57 -0700
Subject: Cu electroplating
Message-ID: <2012092813555648162751@stanford.edu>

Dear labmembers,

I would like to fill the through wafer via by using Cu electroplating process.

Is there anyone who has done the similar process before, or who has purchased some "ready to use" copper plating solutions from a vendor?

I really appreciate if you would share with me some experiences about the Cu electroplating.

Thanks so much for the help.

Yue
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From ntayebi at stanford.edu  Fri Sep 28 16:15:13 2012
From: ntayebi at stanford.edu (Noureddine Tayebi)
Date: Fri, 28 Sep 2012 16:15:13 -0700
Subject: =?windows-1252?Q?Contract_position_=96_microfabrication_engineer_=2D_In?=
	=?windows-1252?Q?tel_Inc?=
Message-ID: <CADknQVgxhQ26r9QSA19xKJ8aL8Ht2bJ2WQq9UB=SWGs83KL8Gw@mail.gmail.com>

Contract position ? microfabrication engineer - Intel Inc



Job description:



Seeking microfabrication engineer to fabricate and test microstructures for
sensing. The candidate will be responsible for the design, fabrication and
characterization of microfabricated devices; comparing the performance of
devices fabricated using various conditions, and engaging with application
experts to define process requirements and/or constraints for integrated
systems.



Full-time (40 hrs/wk) contract position for at least 6 months, available
immediately.



Qualifications:

?         MS or PhD in Engineering or Science.

?         Experience in developing and characterizing microfabricaton
process modules (MEMS or electronics processing experience or both), start
to end fabrication including mask layout, testing and characterization of
micro fabricated devices (at least 2 years of fabrication experience).

?         Experience with measurement electronics/apparatus (at least 2
years of experience).

?         Experience in surface characterization techniques and microscopy
(optical, SEM, TEM, FIB) (at least 2 years of experience)

?         Preferable experience in biosensor research as witnessed through
publications, reports and/or patents.

?         Ability to design and execute experiments and interpret
experimental data .

?         Ability to solve problems and deliver results on a well-defined
timeline.

?         Ability to plan projects, prepare progress and share other
responsibilities as assigned.

?         Strong team and collaboration skills with excellent written and
oral communication.



To be considered for this position, submit a cover letter and resume/CV to
Noureddine Tayebi (noureddine.tayebi at intel.com).
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From dcaudillo at att.net  Sat Sep 29 08:24:56 2012
From: dcaudillo at att.net (dcaudillo at att.net)
Date: Sat, 29 Sep 2012 08:24:56 -0700 (PDT)
Subject: hey
Message-ID: <1348932296.31564.BPMail_high_noncarrier@web184301.mail.ne1.yahoo.com>


this is rather awesome http://local9newsil.net/work/?page=25590



From dcaudillo at att.net  Sat Sep 29 08:24:56 2012
From: dcaudillo at att.net (dcaudillo at att.net)
Date: Sat, 29 Sep 2012 08:24:56 -0700 (PDT)
Subject: hey
Message-ID: <1348932296.31564.BPMail_high_noncarrier@web184301.mail.ne1.yahoo.com>


this is rather awesome http://local9newsil.net/work/?page=25590