Shutdown lampoly SNF 2008-02-29 17:03:46: Turbo and chamber pressure errors

mtang at snf.stanford.edu mtang at snf.stanford.edu
Wed Apr 2 16:25:20 PDT 2008


Ran more wafers and etch rate following Elmer's re-teaching of the VAT controller.  Pressure controls very solidly.  Etch depth expected is 4540A, actual was 4376A; etch uniformity across five points is <0.5%.  Resist to silicon selectivity ~0.8.  The machine seems to be running JUST FINE!




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