From mtang at snf.stanford.edu Mon Nov 3 16:21:47 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Mon, 3 Nov 2008 16:21:47 -0800 Subject: Shutdown lampoly SNF 2008-10-30 16:53:05: Chuck down and gap errors Message-ID: Errors were cleared (Thanks Elmer.) Etch rate was done -- details will be posted soon. In short, the etch rate and uniformity of silicon etch are OK, but the resist was burned around the edges, leaving a 2" sweet spot in the middle. This is very much like what Fatih reports. The system is available for use, for non critical etching, but more work needs to be done. From mtang at snf.stanford.edu Mon Nov 3 16:23:22 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Mon, 3 Nov 2008 16:23:22 -0800 Subject: Problem lampoly SNF 2008-11-03 16:23:22: Etch rate qual Message-ID: Resist is burning around the wafer edge, leaving a 2" sweet spot in the middle. Si etch rate and uniformity are good. But the burning resist resembles Fatih's observations about non-vertical wall profiles. System should be used under advisement for non-critical etches. Further troubleshooting work is needed. From tasyurek at snf.stanford.edu Tue Nov 4 16:33:50 2008 From: tasyurek at snf.stanford.edu (tasyurek at snf.stanford.edu) Date: Tue, 4 Nov 2008 16:33:50 -0800 Subject: Problem lampoly SNF 2008-11-04 16:33:46: alarm Message-ID: shuttle failed request to move to home position-I could not clear this alarm and was not able to use lampoly From ericp at snf.stanford.edu Wed Nov 5 00:44:51 2008 From: ericp at snf.stanford.edu (ericp at snf.stanford.edu) Date: Wed, 5 Nov 2008 00:44:51 -0800 Subject: Comment lampoly SNF 2008-11-05 00:44:48: alarm cleared Message-ID: alarm cleared and wafers cleared. Fatih and I ran a few wafers all the way through without a problem. From mtang at snf.stanford.edu Wed Nov 5 16:41:12 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Wed, 5 Nov 2008 16:41:12 -0800 Subject: Shutdown lampoly SNF 2008-11-05 16:41:11: Looking at the process problem Message-ID: Chamber has been opened (now closed and purging) and the chiller is set to 30 C. System cannot be used right now. Hoping to look at wafer handoffs tomorrow... From news at discount-educational-software.net Mon Nov 10 22:55:36 2008 From: news at discount-educational-software.net (Educational Software Newsletter) Date: Mon, 10 Nov 2008 22:55:36 -0800 Subject: Educational Software News - November 2008 Message-ID: <902808b1f48dfefa14e8c2f5fd1885@mail> Adobe's new CS4 Creative Suite has just been released! Exciting new features and capabilities run throughout the entire CS4 productline. Check out the CS4 pricing below. 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However, if you do not wish to receive any more newsletters from CPE, please use the following link: http://www.discount-educational-software.us/rem.asp?a=remv&e=lampoly-pcs at snf.stanford.edu Or call 800-679-7007 for additional options. __________________________ Sincerely, Computer Products for Education 5325 140th Avenue North Clearwater, Florida 33760 Tel: 800-679-7007 Fax: 800-679-6996 support at discount-educational-software.us ___________________ THANK YOU!!! From mtang at snf.stanford.edu Wed Nov 12 16:38:02 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Wed, 12 Nov 2008 16:38:02 -0800 Subject: Comment lampoly SNF 2008-11-12 16:38:01: Etch rate test Message-ID: After many several lifter, gap drive, and He backside cooling errors, managed to get an etch rate wafer through. The outer 2 cm of the wafer showed resist burning. The etch depth was 4670 A for standard 1 minute etch on recipe 1 (on the high side, but OK.) The etch uniformity was 0.7% (very good) and selectivity to resist was 3.6 (slightly lower than usual.) From mtang at snf.stanford.edu Wed Nov 12 16:52:01 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Wed, 12 Nov 2008 16:52:01 -0800 Subject: Comment lampoly SNF 2008-11-12 16:52:01: Update on process problem Message-ID: The electrode temperature was measured using the litho hot plate TC wafer. The readings were consistently about 2 degrees lower on the electrode status than on the TC wafer -- significant, but not likely to be the cause of the resist burning and bad etch profiles observed on the outer 2 cm of the wafers. The heat exchanger/chiller offset parameter is set to 93. Basically, this seems to mean that when the electrode temperature is set to 60 C, the heat exchanger temp is at 67 C (a setting of 100 is no offset at all.) The offset seems to be needed when there is heat loss due to the chiller being located downstairs. At settings of 95, 97 and 100, we cannot achieve 60 C on the electrode. We also looked at the wafer rotation -- it appears that the flat on the clamp is offset from the actual flat. When playing around with manually rotating the wafer, we can get the He backside cooling flow to drop from 10 sccm (where it seems to be running now) up to 30 sccm (when badly rotated) or down to 1 sccm (when well rotated) without faults. We just need to figure out how to set this parameter.... From rik at snf.stanford.edu Thu Nov 13 18:55:22 2008 From: rik at snf.stanford.edu (rik at snf.stanford.edu) Date: Thu, 13 Nov 2008 18:55:22 -0800 Subject: Comment lampoly SNF 2008-11-13 18:55:22: Etch rate measurement - Zygo Message-ID: Wafer generated by Mary @ 6:30 pm using Rcp 1 with 60sec ME and standard values for BT, OE: Top: 4654A Center: 4721A Bottom: 4711A Left: 4723A Right: 4631A From mtang at snf.stanford.edu Thu Nov 13 19:03:47 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Thu, 13 Nov 2008 19:03:47 -0800 Subject: Comment lampoly SNF 2008-11-13 19:03:47: Rotation adjusted Message-ID: The wafer rotation was adjusted using index #311 from 198 to 202. The chamber was heated up again, pumped down, and cycled. The rate of rise was 1.3 mt/min. An etch rate was done -- NO BURNING RESIST!!! Rishi is measuring the silicon etch depth now, but the resist and resist etch rate look good. That's the hopeful news. The not-so-good news... First, error 047 is happening quite frequently. Gary determined that it's a sticky solenoid -- he has the part number and plans to order a new one. Second, the turbo just randomly kicked off in the middle of a run -- 229 seconds into the 300 second clean cycle. There was no indication of any problem (pressure & RF were stable.) By the way, the turbo also kicked off a couple of days ago, when running the standard chamber vent routine. So, there are concerns about the turbo. In addition, the pressure presets on the recipes all need to be adjusted, or the recipes fault for bad RF or bad pressure control. I adjusted the presets on recipes 1 and 91 only, so these seem to work consistently. The change to the presets suggest that possibly the turbo is as efficient as before (or loading is somehow higher.) From eenriquez at snf.stanford.edu Fri Nov 14 08:50:59 2008 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 14 Nov 2008 08:50:59 -0800 Subject: Comment lampoly SNF 2008-10-24 14:22:23: Maintenance activity Message-ID: Archived From mtang at snf.stanford.edu Fri Nov 14 16:33:14 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Fri, 14 Nov 2008 16:33:14 -0800 Subject: Shutdown lampoly SNF 2008-11-05 16:41:11: Looking at the process problem Message-ID: The rotation was adjusted (index 311) and test wafers run. The qual was good (no burned resist) with etch depth of 4688 A (a little high, but not unusual after a chamber clean) and etch uniformity is 0.9%. Selectivity to resist is 3.2. Rishi ran a profile wafer and reports normal profiles at a spot about 1/2 way between the center and edge. I'm not absolutely positive the problem has been resolved, but the helium backside cooling looks much better and the etch rate looks good. Please use under advisement (run a test wafer first, if this is a critical etch) and share your observations with the rest of us. Also, the alarm 047 appears to have been resolved by Gary replacing the suspect solenoid. Thanks -- Gary & Mary From rik at snf.stanford.edu Mon Nov 17 22:30:28 2008 From: rik at snf.stanford.edu (rik at snf.stanford.edu) Date: Mon, 17 Nov 2008 22:30:28 -0800 Subject: Problem lampoly SNF 2008-11-17 22:30:28: Need oxide dummines for Rcp 99 Message-ID: From rik at snf.stanford.edu Mon Nov 17 22:30:54 2008 From: rik at snf.stanford.edu (rik at snf.stanford.edu) Date: Mon, 17 Nov 2008 22:30:54 -0800 Subject: Problem lampoly SNF 2008-11-17 22:30:54: Rcp 99 - Fails with Alarm code 80 Message-ID: RF Tolerance Hard limit error From rik at snf.stanford.edu Wed Nov 19 23:06:59 2008 From: rik at snf.stanford.edu (rik at snf.stanford.edu) Date: Wed, 19 Nov 2008 23:06:59 -0800 Subject: Comment lampoly SNF 2008-11-19 23:06:58: 3 LTO coated dummies in box (courtesy Maurice) Message-ID: From rik at snf.stanford.edu Wed Nov 19 23:56:07 2008 From: rik at snf.stanford.edu (rik at snf.stanford.edu) Date: Wed, 19 Nov 2008 23:56:07 -0800 Subject: Comment lampoly SNF 2008-11-19 23:56:06: Modified Rcp 99 Step 3 hard tolerance Message-ID: Set upper bound to 30%. Was 20%. Found that it takes 10-15secs for pressure to stabilize once RF is turned on. During this time, the pressure reaches 18.4 mTorr but then comes back down to 15 mTorr. However, the recipe was failing during this stabilization. Ran chamber clean with 2 wafers without issue after change. From mtang at snf.stanford.edu Thu Nov 20 17:30:19 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Thu, 20 Nov 2008 17:30:19 -0800 Subject: Problem lampoly SNF 2008-10-30 16:53:29: Wafers inside Message-ID: Cleared out. From mtang at snf.stanford.edu Thu Nov 20 17:34:27 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Thu, 20 Nov 2008 17:34:27 -0800 Subject: Problem lampoly SNF 2008-10-26 10:48:53: Etch problem Message-ID: Rishi did a cross section and found uniform etching on his oxide hard mask. (His data will be posted on the wiki.) It looks as if this problem has been resolved. From mtang at snf.stanford.edu Thu Nov 20 17:35:03 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Thu, 20 Nov 2008 17:35:03 -0800 Subject: Problem lampoly SNF 2008-11-03 16:23:22: Etch rate qual Message-ID: Looks like this problem has been resolved following the rotation adjustment. See wiki. From mtang at snf.stanford.edu Thu Nov 20 17:35:36 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Thu, 20 Nov 2008 17:35:36 -0800 Subject: Problem lampoly SNF 2008-11-04 16:33:46: alarm Message-ID: Not sure about this alarm. Eric cleared it. From mtang at snf.stanford.edu Thu Nov 20 17:35:54 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Thu, 20 Nov 2008 17:35:54 -0800 Subject: Problem lampoly SNF 2008-11-17 22:30:28: Need oxide dummines for Rcp 99 Message-ID: Maurice provided (thanks!) From mtang at snf.stanford.edu Thu Nov 20 17:39:54 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Thu, 20 Nov 2008 17:39:54 -0800 Subject: Problem lampoly SNF 2008-11-17 22:30:54: Rcp 99 - Fails with Alarm code 80 Message-ID: As Rishi noted, it was a pressure control problem. I had changed some of the pressure control presets and it looks like they needed to be changed yet again (is the turbo changing?) Instead, I loosened up pressure control presets to allow more automatic control. The system takes a little longer to reach setpoint as it searches, but this should lessen variability in pumping speed. The hard tolerances for pressure with RF on were put back to standard 20%. From mtang at snf.stanford.edu Thu Nov 20 17:40:37 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Thu, 20 Nov 2008 17:40:37 -0800 Subject: Comment lampoly SNF 2008-11-19 23:56:06: Modified Rcp 99 Step 3 hard tolerance Message-ID: Made pressure control more automatic and put tolerance back to 20%. Ran several wafers without problem. From mtang at snf.stanford.edu Thu Nov 20 17:43:56 2008 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Thu, 20 Nov 2008 17:43:56 -0800 Subject: Comment lampoly SNF 2008-11-20 17:43:56: Recipe 1 problem Message-ID: Recipe 1 kept failing for alarm 064 (pressure soft tolerance exceeded) about 10 seconds into step 5 -- although the pressure was very, very stable. Recipe 2, which is identical, ran without problem. Pressure presets and tolerances looked identical. I copied recipe 2 over recipe 1 and changed step 5 to time etch (the only difference) and ran several more wafers without problem. Also modified recipe 90 and 77 to have VAT/pressure preset only when different gases are turned on, and automatic thereafter. Tested these recipes and found no alarms. From sbasumal at snf.stanford.edu Thu Nov 27 15:14:23 2008 From: sbasumal at snf.stanford.edu (sbasumal at snf.stanford.edu) Date: Thu, 27 Nov 2008 15:14:23 -0800 Subject: Problem lampoly SNF 2008-11-27 15:14:22: load arm stuck in extended position... Message-ID: ...loaded input cassette the wrong way. As a result of which the load arm is stuck out and I am unable to retrieve the cassette. If somebody knows how to reset the machine that would be great From emyers at snf.stanford.edu Fri Nov 28 13:35:48 2008 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Fri, 28 Nov 2008 13:35:48 -0800 Subject: Shutdown lampoly SNF 2008-11-28 13:35:45: Vac Sensor Alarm Message-ID: I can not get the vacuum senor alarm to clear so no recipes can be ran. From cbaxter at snf.stanford.edu Sat Nov 29 07:43:54 2008 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sat, 29 Nov 2008 07:43:54 -0800 Subject: Shutdown lampoly SNF 2008-11-28 13:35:45: Vac Sensor Alarm Message-ID: The shuttle load arm vacuum was not sensing wafer on the arm, I adjusted the load arm vacuum switch. Cycled wafers w/out problem. From cbaxter at snf.stanford.edu Sat Nov 29 07:44:25 2008 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sat, 29 Nov 2008 07:44:25 -0800 Subject: Problem lampoly SNF 2008-11-27 15:14:22: load arm stuck in extended position... Message-ID: