From lwchang at snf.stanford.edu Tue Jun 2 15:20:06 2009 From: lwchang at snf.stanford.edu (lwchang at snf.stanford.edu) Date: Tue, 2 Jun 2009 15:20:06 -0700 Subject: Problem lampoly SNF 2009-06-02 15:20:05: not sensing input cassette Message-ID: From cbaxter at snf.stanford.edu Tue Jun 2 16:05:46 2009 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Tue, 2 Jun 2009 16:05:46 -0700 Subject: Problem lampoly SNF 2009-06-02 15:20:05: not sensing input cassette Message-ID: Recovered wafer from chamber... From eenriquez at snf.stanford.edu Wed Jun 3 06:32:45 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Jun 2009 06:32:45 -0700 Subject: Comment lampoly SNF 2009-03-31 15:06:41: Installed water filter Message-ID: Archived From eenriquez at snf.stanford.edu Wed Jun 3 06:33:15 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Jun 2009 06:33:15 -0700 Subject: Comment lampoly SNF 2009-04-06 11:12:09: one cassette missing Message-ID: Archived From eenriquez at snf.stanford.edu Wed Jun 3 06:33:23 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Jun 2009 06:33:23 -0700 Subject: Comment lampoly SNF 2009-04-06 16:24:18: found cassette in litho area Message-ID: Archived From eenriquez at snf.stanford.edu Wed Jun 3 06:33:32 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Jun 2009 06:33:32 -0700 Subject: Comment lampoly SNF 2009-04-24 09:04:23: Gas#8 changed from Ar to N2 Message-ID: Archived From eenriquez at snf.stanford.edu Wed Jun 3 06:33:44 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Jun 2009 06:33:44 -0700 Subject: Comment lampoly SNF 2009-05-02 19:09:47: Couldn't find the quartz wafer for clean recipe #99 Message-ID: Archived From eenriquez at snf.stanford.edu Wed Jun 3 06:33:52 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Jun 2009 06:33:52 -0700 Subject: Comment lampoly SNF 2009-05-07 14:36:56: Backside He is OK Message-ID: Archived From eenriquez at snf.stanford.edu Wed Jun 3 06:34:01 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Jun 2009 06:34:01 -0700 Subject: Comment lampoly SNF 2009-05-13 18:12:55: Needs qual Message-ID: Archived From eenriquez at snf.stanford.edu Wed Jun 3 06:34:12 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 3 Jun 2009 06:34:12 -0700 Subject: Comment lampoly SNF 2009-05-19 15:11:20: Etch Rate Message-ID: Archived From tura at snf.stanford.edu Sun Jun 7 15:53:21 2009 From: tura at snf.stanford.edu (tura at snf.stanford.edu) Date: Sun, 7 Jun 2009 15:53:21 -0700 Subject: Shutdown lampoly SNF 2009-06-07 15:53:20: 2" wafer stuck in chamber Message-ID: I was etching 2" wafers on 4" dummies, one of the 2" wafers went inside the etch chamber but didn't come out. From eenriquez at snf.stanford.edu Mon Jun 8 13:57:34 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 8 Jun 2009 13:57:34 -0700 Subject: Shutdown lampoly SNF 2009-06-07 15:53:20: 2" wafer stuck in chamber Message-ID: Vented the chamber and recovered the user's wafer. Cycle purged the chamber and ran a Clean. From tura at snf.stanford.edu Mon Jun 8 17:32:27 2009 From: tura at snf.stanford.edu (tura at snf.stanford.edu) Date: Mon, 8 Jun 2009 17:32:27 -0700 Subject: Shutdown lampoly SNF 2009-06-08 17:32:26: The Water Chiller Has Failed!! Message-ID: Dummies ran fine, I was just about to put my device wafers and I saw the alarm! From mdickey at snf.stanford.edu Tue Jun 9 06:01:03 2009 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Tue, 9 Jun 2009 06:01:03 -0700 Subject: Shutdown lampoly SNF 2009-06-08 17:32:26: The Water Chiller Has Failed!! Message-ID: Topped off lower electrode for the chiller From tura at snf.stanford.edu Tue Jun 9 12:33:30 2009 From: tura at snf.stanford.edu (tura at snf.stanford.edu) Date: Tue, 9 Jun 2009 12:33:30 -0700 Subject: Comment lampoly SNF 2009-06-09 12:33:30: Burns PR Message-ID: It starts burning photoresist after processing 6-7 wafers. At that point the chamber is quite warm to the touch. I waited 30min to cool it down, it still burns photoresist but to a less extent. From rik at snf.stanford.edu Fri Jun 12 04:27:08 2009 From: rik at snf.stanford.edu (rik at snf.stanford.edu) Date: Fri, 12 Jun 2009 04:27:08 -0700 Subject: Shutdown lampoly SNF 2009-06-12 04:27:08: Alarm 184: Water chiller failed Message-ID: From mdickey at snf.stanford.edu Fri Jun 12 07:46:08 2009 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Fri, 12 Jun 2009 07:46:08 -0700 Subject: Shutdown lampoly SNF 2009-06-12 04:27:08: Alarm 184: Water chiller failed Message-ID: Topped of chiller From rhenn at snf.stanford.edu Fri Jun 12 15:34:25 2009 From: rhenn at snf.stanford.edu (rhenn at snf.stanford.edu) Date: Fri, 12 Jun 2009 15:34:25 -0700 Subject: Shutdown lampoly SNF 2009-06-12 15:34:24: Piece left in chamber Message-ID: Piece fell off of the carrier wafer and was left in the chamber. Piece is 2 cm x .5 cm. From cbaxter at snf.stanford.edu Fri Jun 12 17:38:06 2009 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Fri, 12 Jun 2009 17:38:06 -0700 Subject: Shutdown lampoly SNF 2009-06-12 15:34:24: Piece left in chamber Message-ID: Vented chamber and I did not see a small wafer sample, also checked both load lock. From nvgirish at snf.stanford.edu Sat Jun 13 18:05:47 2009 From: nvgirish at snf.stanford.edu (nvgirish at snf.stanford.edu) Date: Sat, 13 Jun 2009 18:05:47 -0700 Subject: Shutdown lampoly SNF 2009-06-13 18:05:46: Water chiller Message-ID: Dummy wafers ran ok but gave alarm "Water chilller down" when ran device wafers From shott at snf.stanford.edu Sun Jun 14 07:28:12 2009 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Sun, 14 Jun 2009 07:28:12 -0700 Subject: Shutdown lampoly SNF 2009-06-13 18:05:46: Water chiller Message-ID: Chiller refilled with 50/50 glycol/water and restarted. Added nearly 1 gallon. Temperature is back to 66C. Elmer and Mike: I propose that we send out the most intact of the remaining M & W chillers for an overhaul so that both uppler and lower units are confirmed to be functional. Then, when that returns, we replace the one that is currently leaking and send it out for a rebuild. Thanks, John From tura at snf.stanford.edu Sun Jun 14 16:47:01 2009 From: tura at snf.stanford.edu (tura at snf.stanford.edu) Date: Sun, 14 Jun 2009 16:47:01 -0700 Subject: Shutdown lampoly SNF 2009-06-14 16:47:00: Water chiller has failed Message-ID: From mdickey at snf.stanford.edu Tue Jun 16 10:32:59 2009 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Tue, 16 Jun 2009 10:32:59 -0700 Subject: Shutdown lampoly SNF 2009-06-14 16:47:00: Water chiller has failed Message-ID: Replaced water chiller. It is working but the upper electrode resistivity is recovering. From mzhang2 at snf.stanford.edu Tue Jun 16 15:10:54 2009 From: mzhang2 at snf.stanford.edu (mzhang2 at snf.stanford.edu) Date: Tue, 16 Jun 2009 15:10:54 -0700 Subject: Problem lampoly SNF 2009-06-16 15:10:54: wafer burning problem Message-ID: I ran like 10 dummy wafers using my recipe and all of them are burned. The recipe is just fine because that's the one I used to use. I don't know whether the problem is due to the system stability or not. From mtang at snf.stanford.edu Wed Jun 17 19:19:49 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Wed, 17 Jun 2009 19:19:49 -0700 Subject: Shutdown lampoly SNF 2009-06-17 19:19:49: Resist burning Message-ID: There was a chiller failure, but John and Elmer topped it off (new chiller installed yesterday and topped off, but level probably dropped as things got flowing for a while.) Set electrode temp back to 60 C. Reads 58.5C. Ran wafers and etch rate test -- but resist still burns. Am running a boat load of silicon dummies through clean recipe 99 in case the chamber needs additional conditioning (following clean.) From mtang at snf.stanford.edu Wed Jun 17 19:23:00 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Wed, 17 Jun 2009 19:23:00 -0700 Subject: Problem lampoly SNF 2009-06-17 19:23:00: He backside pressure Message-ID: By the way, it looks like the He backside pressure is having difficulty controlling.... We should probably open up the chamber and check out the He clamping. (But will check for leakby first.) From eenriquez at snf.stanford.edu Thu Jun 18 10:16:38 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 18 Jun 2009 10:16:38 -0700 Subject: Comment lampoly SNF 2009-06-18 10:16:37: Update He press Message-ID: Ran 3 wafers using recipe 99. 1st wafer, the He press with a setpoint of of 6.0 T varied +/- 1.1 T and alarmed for He press out of tolerance. The 2nd and 3rd wafer ran without any problems. The He press was stable at 6.2 +/- 0.1. From mtang at snf.stanford.edu Thu Jun 18 18:03:04 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Thu, 18 Jun 2009 18:03:04 -0700 Subject: Comment lampoly SNF 2009-06-18 18:03:04: Resist burning Message-ID: Resist is burning around most of the wafer, except for a bit of the middle and leading out to the left side relative to the flat. Checked chamber rate of rise: 0.23 mt/min Check gas flows -- all well within +/-5% of full range of MFS'c. Wafer rotation relative to the chamber clamp looks good. Chiller and lower electrode temperatures look good (setpoint 67, actual chiller 66.8, electrode 58.5C.) When running wafers, the backside He controls well (once system is warm) to 6.3 torr (set point 6.0) with He flow of 11-12 sccm. Normally, this is 8-9 sccm. Purged the system and opened the chamber with Cesar. It looks very clean, although there was a little dot on the electrode (left/above the flat). Cesar scotch-brited it down, did IPA wipe and closed up. Ran the purge and cycled wafers in. Backside He is now 6.2 torr -- and 14 sccm!!! Will leave this down for now. This is probably OK for non-critical etches, but will burn resist and no doubt yield terrible profiles for critical etches. By the way, I wonder if the annoying He backside stablization problem (frequent alarms with the first few wafers until it stabilizes) is due to the bleed/bypass (supposed to evacuate excess He pressure) not working. This is probably not related to the current problem, but worth looking into some time soon. From cbaxter at snf.stanford.edu Fri Jun 19 14:39:58 2009 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Fri, 19 Jun 2009 14:39:58 -0700 Subject: Shutdown lampoly SNF 2009-06-17 19:19:49: Resist burning Message-ID: Run some wafer with resist on it last night, did see any sign of burning. From mtang at snf.stanford.edu Fri Jun 19 16:25:24 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Fri, 19 Jun 2009 16:25:24 -0700 Subject: Problem lampoly SNF 2009-06-19 16:25:23: Resist Burning Message-ID: Sorry, no progress since yesterday. The system is being yellow lighted to allow non-critical etches to be done. I suspect the problem has something to do with the wafer clamping, especially as the burnt resist is not radially symmetric. (I've left the wafers on the table, in case anyone wants to look.) If you want to mount pieces, you might want to put them in the area where the resist does not appear to burn (experience has been that the profiles are typically good in the non-burnt areas - which you can also see on these etch rate wafers under the microscope - features in the burnt areas have a halo/are sloped.) We'll look at this on Monday. From eenriquez at snf.stanford.edu Mon Jun 22 09:41:54 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 22 Jun 2009 09:41:54 -0700 Subject: Shutdown lampoly SNF 2009-06-22 09:41:53: Checking clamp Message-ID: From eenriquez at snf.stanford.edu Mon Jun 22 15:04:29 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 22 Jun 2009 15:04:29 -0700 Subject: Comment lampoly SNF 2009-06-22 15:04:29: Update burning resist Message-ID: Vented the chamber and removed the clamp. Trying to find a force gauge so that I can measure the clamp spring tension. Chamber is still vented. From mtang at snf.stanford.edu Mon Jun 22 19:43:34 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Mon, 22 Jun 2009 19:43:34 -0700 Subject: Comment lampoly SNF 2009-06-22 19:43:34: Bad clamping? Message-ID: Suspicions are now that the clamping mechanism needs work. Elmer suggests checking and replacing the springs in the clamp mechanism, but didn't get a chance to disassemble this today -- hopefully, tonight, but otherwise planned for tomorrow. From eenriquez at snf.stanford.edu Tue Jun 23 14:50:47 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 23 Jun 2009 14:50:47 -0700 Subject: Comment lampoly SNF 2009-06-23 14:50:47: Update bad clamping Message-ID: Replaced all the clamp springs, plunger and plunger guide. Set the chamber temp = 60 C. Ran 3 wafers. Backside He flow @ 6 Torr varied from 2 - 20 sccm with an average of around 8 sccm. From mtang at snf.stanford.edu Tue Jun 23 17:06:54 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Tue, 23 Jun 2009 17:06:54 -0700 Subject: Comment lampoly SNF 2009-06-23 17:06:53: Checking clamping Message-ID: After a few false starts, the system looks good. (Not sure why, but chamber and chuck temp setpoints were off -- 10 C??? -- I reset and things seem stable now.) After a few stabilizing wafers, the helium backside is controlling at 9-10 sccm. Normally, 8--10 is observed, but I'm happy with 9-10. We're running conditioning wafers (25 wafers through recipe 99) and will run another 25 through recipe 1 before running the qual, hopefully tomorrow (Wed) am. By the way, after cycle puring the chamber rate of rise if 0.66 mt/min. From cbaxter at snf.stanford.edu Tue Jun 23 22:11:16 2009 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Tue, 23 Jun 2009 22:11:16 -0700 Subject: Comment lampoly SNF 2009-06-23 22:11:16: Gap Check Message-ID: Gap is good, no adjustment made. From mtang at snf.stanford.edu Wed Jun 24 10:32:04 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Wed, 24 Jun 2009 10:32:04 -0700 Subject: Comment lampoly SNF 2009-06-24 10:32:04: Update Message-ID: There was a turbo error last night, but Elmer cleared and restarted the dummy wafers this morning. The backside He was controlled at 8 sccm after the 3rd wafer on recipe 99. Started a cassette of dummies + etch rate wafer at 10:15. First wafer had high backside He, but by the 3rd wafer had dropped to 8 sccm. Will post results this afternoon. From mtang at snf.stanford.edu Wed Jun 24 15:33:13 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Wed, 24 Jun 2009 15:33:13 -0700 Subject: Shutdown lampoly SNF 2009-06-22 09:41:53: Checking clamp Message-ID: System looks good. No burning resist! Backside He is stable at 8 sccm once several wafers are run. From mtang at snf.stanford.edu Wed Jun 24 15:33:40 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Wed, 24 Jun 2009 15:33:40 -0700 Subject: Problem lampoly SNF 2009-06-16 15:10:54: wafer burning problem Message-ID: Clamp repair on 6/23 seems to have fixed this. From mtang at snf.stanford.edu Wed Jun 24 15:33:48 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Wed, 24 Jun 2009 15:33:48 -0700 Subject: Problem lampoly SNF 2009-06-19 16:25:23: Resist Burning Message-ID: Clamp repair on 6/23 seems to have fixed this. From mtang at snf.stanford.edu Wed Jun 24 15:34:20 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Wed, 24 Jun 2009 15:34:20 -0700 Subject: Problem lampoly SNF 2009-06-17 19:23:00: He backside pressure Message-ID: Main backside He problem fixed with clamp repair, 6/23. See update on 6/24. From mtang at snf.stanford.edu Wed Jun 24 15:37:40 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Wed, 24 Jun 2009 15:37:40 -0700 Subject: Problem lampoly SNF 2009-06-24 15:37:39: Update Message-ID: The clamp repair on 6/23 seems to have fixed the burning resist problem. The etch rate is high, but not unexpectedly so after new parts and a chamber clean. Etch depth of silicon using recipe 1 is 5160 A with 2% nonuniformity; resist selectivity to silicon is 3.6. (Expect about 4600 A total, with <5% nonuniformity and selectivity ~3.3-4.2) So, the system seems to be running well. HOWEVER, the helium clamping is still unstable for the first several wafers processed, if the machine has been idle. So, make sure to run several wafers and that the He backside flow rate is stable at about 8-10 sccm for a backside pressure of 6 torr (right now, seems to control to 6.2 torr.) Please report any etch problems. From filip at snf.stanford.edu Fri Jun 26 17:52:36 2009 From: filip at snf.stanford.edu (filip at snf.stanford.edu) Date: Fri, 26 Jun 2009 17:52:36 -0700 Subject: Comment lampoly SNF 2009-06-26 17:52:35: recipe 1 status Message-ID: after running 25 dummy wafers, the He flow has fixed at 14 (should be 8-10). Ran 1min, 2min, 2.5min etches, and no resist burning evident, although I am not very skilled at noticing burnt resist :-) Ethch rate for main etch: 410nm / min