From tura at snf.stanford.edu Sat May 2 19:09:48 2009 From: tura at snf.stanford.edu (tura at snf.stanford.edu) Date: Sat, 2 May 2009 19:09:48 -0700 Subject: Comment lampoly SNF 2009-05-02 19:09:47: Couldn't find the quartz wafer for clean recipe #99 Message-ID: Please put a new quartz wafer! Thanks! From cbaxter at snf.stanford.edu Mon May 4 17:20:03 2009 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Mon, 4 May 2009 17:20:03 -0700 Subject: Comment lampoly SNF 2009-05-04 17:20:03: Broken wafer Message-ID: Wafer broke between the exit load lock and chamber. Vented chamber and load lock, vacuumed wafer chips and wiped down chamber and load lock with water and ipa. Cycled wafers w/out problem. From sbasumal at snf.stanford.edu Mon May 4 22:35:48 2009 From: sbasumal at snf.stanford.edu (sbasumal at snf.stanford.edu) Date: Mon, 4 May 2009 22:35:48 -0700 Subject: Problem lampoly SNF 2009-05-04 22:35:47: Wafer Broke Message-ID: Wafer broke again in chamber. Exit arm extension failed while trying to unload broken wafer . So exit arm jammed. Also, another wafer stuck in chamber before etch chamber and seems precariously perched. From eenriquez at snf.stanford.edu Tue May 5 12:18:26 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 5 May 2009 12:18:26 -0700 Subject: Problem lampoly SNF 2009-05-04 22:35:47: Wafer Broke Message-ID: Vented the chamber and vacuum the broken pieces of the wafer. The chamber had a dark, heavy, flaky build-up. Mike, wet cleaned the chamber. Cycle purged the chamber and ran two wafers using the Clean 2 recipe. Ran an additional 4 wafers with no problems. From eenriquez at snf.stanford.edu Tue May 5 12:18:31 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 5 May 2009 12:18:31 -0700 Subject: Comment lampoly SNF 2009-05-04 17:20:03: Broken wafer Message-ID: Vented the chamber and vacuum the broken pieces of the wafer. The chamber had a dark, heavy, flaky build-up. Mike, wet cleaned the chamber. Cycle purged the chamber and ran two wafers using the Clean 2 recipe. Ran an additional 4 wafers with no problems. From mtang at snf.stanford.edu Tue May 5 16:38:05 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Tue, 5 May 2009 16:38:05 -0700 Subject: Problem lampoly SNF 2009-05-05 16:38:04: Backside Helium leak? Message-ID: I was hoping to run a qual wafer, but Nahid and Usha pointed out that the He backside flow was running at 36-38 sccm. Wrote a recipe in which there was no backside He and no gas (wide open throttle) in one step and He at 6 torr (standard) in the next step. The base pressure was -0.09 mt when no gas and no backside He is flowing. But base is 0.50 mt when He backside is set at 6 torr (and yes, a nice, solid, 36 sccm flow setting.) Tried running N2 at various flows -- I get 0.20 mt with N2 set at 10 sccm (no backside He) and 0.50 mt with N2 set at 20 sccm (no He.) So, a ballpark figure suggests we may be leaking up to 20 sccm of He. Open throttle valve isn't a very accurate measure, and I've not done this before when the system was running "normally" at 8 sccm of He to achieve 6 torr backside, but I'm guessing that we may be leaking a lot of He. Oh, and the plasma is a lot more blue/white than unusal, but then it always seems to me to be more blue/white following a wet clean (polymer buildup makes the chamber window pink.) I won't put the system down, since at least one person wanted to do a generic, non-critical poly etch. But I would not recommend using this system for a critical etch until this is resolved. Will take another look tomorrow morning. From mtang at snf.stanford.edu Tue May 5 17:16:11 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Tue, 5 May 2009 17:16:11 -0700 Subject: Shutdown lampoly SNF 2009-05-05 17:16:11: No HBr Message-ID: HBr shut off. Gas sensor is noisy. Need to troubleshoot. From mdickey at snf.stanford.edu Wed May 6 11:00:19 2009 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Wed, 6 May 2009 11:00:19 -0700 Subject: Comment lampoly SNF 2009-05-06 11:00:18: clamp replaced Message-ID: Replaced upper clamp and cleaned up chamber From eenriquez at snf.stanford.edu Thu May 7 14:33:33 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 7 May 2009 14:33:33 -0700 Subject: Comment lampoly SNF 2009-05-06 11:00:18: clamp replaced Message-ID: Archived From eenriquez at snf.stanford.edu Thu May 7 14:36:57 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 7 May 2009 14:36:57 -0700 Subject: Comment lampoly SNF 2009-05-07 14:36:56: Backside He is OK Message-ID: Opened the chamber and cleaned the chuck using scotch brite and IPA. Ran 4 wafers. He flow during the 1st wafer varied from 0 -20 sccm with an average of about 5 sccm. The rest of the wafer ran with the He flow stable at 11 sccm. From eenriquez at snf.stanford.edu Thu May 7 14:37:06 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 7 May 2009 14:37:06 -0700 Subject: Comment lampoly SNF 2009-05-06 16:11:42: Wet cleaned the chamber Message-ID: Archived From mtang at snf.stanford.edu Fri May 8 09:21:52 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Fri, 8 May 2009 09:21:52 -0700 Subject: Problem lampoly SNF 2009-05-05 16:38:04: Backside Helium leak? Message-ID: Elmer fixed it! See his comment on 5/7/09. Thanks EE! From mtang at snf.stanford.edu Fri May 8 09:26:34 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Fri, 8 May 2009 09:26:34 -0700 Subject: Problem lampoly SNF 2009-05-08 09:26:33: No HBr Message-ID: HBr remains unavailable as the toxic gas sensor is replaced. However, Cl2 is available as is SF6 (and other gases.) So, for the few people that have non-HBr recipes, this is being put into "problem." From mtang at snf.stanford.edu Fri May 8 09:27:50 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Fri, 8 May 2009 09:27:50 -0700 Subject: Shutdown lampoly SNF 2009-05-05 17:16:11: No HBr Message-ID: Still no HBr, but other gases available for the minority of people who have non-HBr processing to do. Elmer also fixed the backside problem, so that's OK. However, be aware that the etch qual has not been done (and can't be until we get HBr back). From mtang at snf.stanford.edu Fri May 8 09:32:21 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Fri, 8 May 2009 09:32:21 -0700 Subject: Problem lampoly SNF 2009-05-08 09:32:21: HBr Update Message-ID: HBr is unavailable because the toxic gas sensor in the HBR cabinet in the gas vault is faulty. (For safety reasons, we cannot run without a functioning gas sensor.) The gas detector is being replaced, which is planned for Monday, 5/11. If the sensor head also arrives on Monday, as we hope, testing of the system is planned for Tuesday and Wednesday. If all goes as well as planned, then we should have HBr back on Wednesday. We apologize for the inconvenience, but please continue to bear with us as we work on these safety concerns. From eenriquez at snf.stanford.edu Wed May 13 18:12:13 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 13 May 2009 18:12:13 -0700 Subject: Problem lampoly SNF 2009-05-08 09:32:21: HBr Update Message-ID: Completed sensor testing. HBr is now available. Ran several wafers using recipe 99. Still need to run condioning and then a process qual. From eenriquez at snf.stanford.edu Wed May 13 18:12:20 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 13 May 2009 18:12:20 -0700 Subject: Problem lampoly SNF 2009-05-08 09:26:33: No HBr Message-ID: Completed sensor testing. HBr is now available. Ran several wafers using recipe 99. Still need to run condioning and then a process qual. From eenriquez at snf.stanford.edu Wed May 13 18:12:56 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 13 May 2009 18:12:56 -0700 Subject: Comment lampoly SNF 2009-05-13 18:12:55: Needs qual Message-ID: Need to run conditioning wafers and a qual From nharjee at snf.stanford.edu Thu May 14 01:53:56 2009 From: nharjee at snf.stanford.edu (nharjee at snf.stanford.edu) Date: Thu, 14 May 2009 01:53:56 -0700 Subject: Problem lampoly SNF 2009-05-14 01:53:56: Backside He still problematic Message-ID: Ran 6 dummy wafers. Wafers 1 and 4 caused alarms because backside He exceeded soft tolerances. For all wafers, He pressure ranged from 5-7 Torr while flow hovered at <5 sccm with frequent spikes >15 sccm (max observed was 21 sccm). Didn't commit actual wafers. From eenriquez at snf.stanford.edu Thu May 14 14:58:17 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 14 May 2009 14:58:17 -0700 Subject: Comment lampoly SNF 2009-05-14 14:58:17: Backside He updage Message-ID: Ran tests at 4 Torr and 10 Torr backside He pressure. The pressure and flow was very stable at 10 T from the 1st wafer to the last (6th) but at 4 T, the pressure and flow never stablelized. Suggest running at 10T backside He pressure. From mtang at snf.stanford.edu Tue May 19 15:08:35 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Tue, 19 May 2009 15:08:35 -0700 Subject: Problem lampoly SNF 2009-05-14 01:53:56: Backside He still problematic Message-ID: It was observed that the wafer clamp was rotated slightly off from the wafer itself (the flats were not aligned.) In the past, this has caused intermittent backside helium problems and burning resist, possibly because of He leakage at the flat. The wafer rotation parameter (#311) was adjusted slightly from the previous value of 198 to 204. This appears to have aligned the flat with the wafer clamp. The backside helium is still jumpy (from 2 sccm to >20) when the first wafers are run after the machine has been idle. But, it settles down solidly after the first 5-6 wafers or so during the normal 10 wafer warm up. When it is stable, the He flow will be 8-10 sccm for 6 torr backside cooling pressure. Double check your recipes. There should be NO backside He during the first step, when wafer clamping is done. He backside should be turned on in a subsequent step for flow stabilization BEFORE the RF is turned on for etching. Many thanks to Usha, Nahid, and Elmer for fixing the problem. From mtang at snf.stanford.edu Tue May 19 15:09:26 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Tue, 19 May 2009 15:09:26 -0700 Subject: Problem lampoly SNF 2009-04-17 16:18:56: HBr Message-ID: HBr cabinet sensor and detector module were replaced and tested with live gas. The sensor has been stable since. From mtang at snf.stanford.edu Tue May 19 15:10:03 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Tue, 19 May 2009 15:10:03 -0700 Subject: Comment lampoly SNF 2009-05-14 14:58:17: Backside He updage Message-ID: See Nahid's problem report on 5/14. Rotation adjustment done. From mtang at snf.stanford.edu Tue May 19 15:11:22 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Tue, 19 May 2009 15:11:22 -0700 Subject: Comment lampoly SNF 2009-05-19 15:11:20: Etch Rate Message-ID: Sorry, not finished measuring yet. But resist etch rate (which is sensitive to cooling and other chamber conditioning problems) looks good. From usha at snf.stanford.edu Fri May 22 08:24:06 2009 From: usha at snf.stanford.edu (usha at snf.stanford.edu) Date: Fri, 22 May 2009 08:24:06 -0700 Subject: Comment lampoly SNF 2009-05-22 08:24:05: Clamp ring & Backside He Message-ID: Changed Index 311 from 198 to 204 to correct for the misalignment between wafer and the clamp ring on Monday 5/18/09. Backside He flow at 6T stabilized between 10-11sccm after ~5-6 wafers. From ahryciw at snf.stanford.edu Fri May 22 17:27:52 2009 From: ahryciw at snf.stanford.edu (ahryciw at snf.stanford.edu) Date: Fri, 22 May 2009 17:27:52 -0700 Subject: Problem lampoly SNF 2009-05-22 17:27:51: Alarm 184: Water chiller failure Message-ID: From shott at snf.stanford.edu Sun May 24 08:24:43 2009 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Sun, 24 May 2009 08:24:43 -0700 Subject: Problem lampoly SNF 2009-05-22 17:27:51: Alarm 184: Water chiller failure Message-ID: Low 50/50 glycol/water in the chiller. Refilled .... but it looks as if Mike/Elmer know that there is a leak in the system that still needs to be addressed. Thanks, John