Problem lampoly SNF 2010-04-12 15:45:24: RF and pressure tolerance problems

eenriquez at snf.stanford.edu eenriquez at snf.stanford.edu
Thu Apr 15 09:30:00 PDT 2010


Exit loadlock inner door (between the LL and chamber) leak  was caused by etch residue build-up on the door hinge.  The residue prevented the door from pivoting so that it is flush with the door o-ring.
Ran 5 wafers using recipe 1 and 11.  Ran 3 wafer using recipe 99 all with no problems.




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