From cyahn at stanford.edu Mon May 2 14:57:31 2011 From: cyahn at stanford.edu (Ethan C. Ahn) Date: Mon, 2 May 2011 14:57:31 -0700 Subject: Metalica Free till 6pm Message-ID: -------------- next part -------------- An HTML attachment was scrubbed... URL: From wslee at stanford.edu Tue May 3 13:21:52 2011 From: wslee at stanford.edu (Scott Lee) Date: Tue, 3 May 2011 13:21:52 -0700 Subject: Metalica available tonight from 7pm to 11pm Message-ID: Upstream tool problems... -------------- next part -------------- An HTML attachment was scrubbed... URL: From nperez at stanford.edu Fri May 6 15:28:59 2011 From: nperez at stanford.edu (Jeannie Perez) Date: Fri, 06 May 2011 15:28:59 -0700 Subject: Log sheets Need to be filled out correctly! Message-ID: <4DC4762B.8080105@stanford.edu> Hi Everyone, I need help from all Users to completely fill out the log sheets . With this information we would have a better understanding of what, why, or when did problems start occurring. Users are not completely filling out the log sheets. What you may think is minor, can be very important to maintenance, staff and you as an User. This even means the Date, Pressure, how many pellets added, what frequency used, what recipe used, what gases used, what film etched or cleaned ( oxide, nitride, resist) or What is the DC Bias reading on Drytek 4. I need you to completely fill out the log sheets or I will have to start disqualifying Users. For all the good Users, you can stop by the office and have some peanuts. Have a nice week-end, Jeannie -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: nperez.vcf Type: text/x-vcard Size: 346 bytes Desc: not available URL: From dwnam at stanford.edu Tue May 10 18:16:43 2011 From: dwnam at stanford.edu (Donguk Nam) Date: Tue, 10 May 2011 18:16:43 -0700 Subject: Metalica is free tonight Message-ID: Sorry for the late notice. Donguk -------------- next part -------------- An HTML attachment was scrubbed... URL: From edmyers at stanford.edu Thu May 12 08:58:18 2011 From: edmyers at stanford.edu (Ed Myers) Date: Thu, 12 May 2011 08:58:18 -0700 Subject: Intlvac PVD Update, 5/12/11 Message-ID: <6.2.5.6.2.20110512081125.02a88aa0@stanford.edu> Metal's Community, The Intlvac systems have been in the fab for awhile and I imagine many are wondering about their status. Intlvac_Evaporator: The system has a very different hearth and control system compared to the Innotec. I took me some time to understand and feel comfortable with the new configuration. After a few miss steps, I settled on an approach we will test as we release of the system. I waited to order the starter materials until I felt comfortable with the hardware configuration, since it could have required a source size change. The material order went out last month and they should be arriving soon. One question I hear, beside when can we use the system is what is the cleanliness category. It is my intention to bridge the gap between clean up to gold contaminated. I do not plan on allowing gold, or other known device killers (such as Fe) in the system. The sources I have ordered are Ni, Co, Pt, Al, Hf, Ta, Mo, W, Ti, Cr, Zr, Si, Ge, Pd, Nb and V. As we start metering in the lab member community (each new material will take some development the first time), we can discuss your material and substrate requirements. Please contact me regarding the evaporator and we can start putting together a plan for releasing your desired material. Intlvac_Sputter: Originally I felt this system would be released first, since sputtering is pretty straight forward. I even committed to an EE412 project on the system for the characterization the deposition rates, uniformity and some reactive depositions. The project is moving along with the student accomplishing most of the objectives. What I have also learned using the system and working with Intlvac is the system would suit us better with some configuration changes. Intlvac is here this week and I hope to have a time line on when the configuration changes will be completed (I'm guessing a few weeks). During this time there are a few depositions we can run, but we are also limited by target cooling water flow. You may have noticed the system in pieces last week. This resulted from an overheated water cooling line to one of the cathodes. The vendor specification for our cathode size is 1.6 gallons per minute. What we are delivering is 0.5 gpm, or lower. This restricted cooling means we can't put as much power to the cathodes as we would like. Currently the system is hooked up to the house process cooling water. This is not working, so we have ordered a dedicated heat exchanger for the system. I expect we will receive the chiller in a few weeks. With the cooling water issues, I expect it will be 3 to 4 weeks before we can start the wider release of the system. In the mean time, if you are interested we can talk about running some low power depositions. The majority of the targets are on order so we are limited to Al, Ta, TiW, W and Cr. The final material set will be similar to the Intlvac_Evaporator except no precious materials (Pt and probably not Pd). Also the EE412 student will have priority for the next few weeks. Regards, Ed I apologize for the multiple copies of the email to those lab members on all the metal tool's distribution lists From wslee at stanford.edu Sat May 21 07:45:40 2011 From: wslee at stanford.edu (Scott Lee) Date: Sat, 21 May 2011 07:45:40 -0700 Subject: Reservation released (7am-10am) Message-ID: Sorry for the late notice. Scott -------------- next part -------------- An HTML attachment was scrubbed... URL: From dwnam at stanford.edu Mon May 23 12:17:59 2011 From: dwnam at stanford.edu (Donguk Nam) Date: Mon, 23 May 2011 12:17:59 -0700 Subject: Metalica is free tonight from 9pm Message-ID: Samples won't be ready. Donguk -------------- next part -------------- An HTML attachment was scrubbed... URL: From nperez at stanford.edu Tue May 24 15:26:30 2011 From: nperez at stanford.edu (Jeannie Perez) Date: Tue, 24 May 2011 15:26:30 -0700 Subject: Metalica pump down one hour after regen! Message-ID: <4DDC3096.5070706@stanford.edu> -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: nperez.vcf Type: text/x-vcard Size: 346 bytes Desc: not available URL: From benck at stanford.edu Mon May 30 08:51:00 2011 From: benck at stanford.edu (Jesse Benck) Date: Mon, 30 May 2011 08:51:00 -0700 Subject: Metalica sputter coater released 11:00 am - 3:00 pm today Message-ID: <4DE3BCE4.5010503@stanford.edu> My samples are not ready. Sorry for the late notice. - Jesse